JP3268473B2 - Electronic component chute supply method and apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for supplying an electronic component to an electronic component automatically supplied to a mounting head, and more particularly to an electronic component storage pack containing a plurality of electronic components. And a means for supplying an electronic component to a mounting head.

[0002]

2. Description of the Related Art Generally, as a means for supplying electronic components, a component continuous tape for feeding the electronic components at a pitch, a magazine for arranging and housing a plurality of odd-shaped electronic components, or a pallet for arranging a plurality of similar electronic components. Etc. are applied. From each of these supply means, the electronic component is picked up by a mounting head that moves up and down, and the mounting head of the electronic component is moved to an XY table on which the printed circuit board is mounted so that the electronic component is placed on a predetermined surface of the printed circuit board. A predetermined circuit component is automatically assembled by being mounted.

[0003] In addition to the electronic component supply means, a disk-shaped case main body is provided, a spiral storage groove is provided inside the case main body, and a plurality of electronic components are aligned and stored in the storage groove. By intermittently sending the compressed air of electronic components into the storage groove in which the electronic components are stored,
There has been proposed a supply unit using a storage pack for electronic components configured to individually supply electronic components to a mounting head from a component outlet provided on an upper side of a case body (Japanese Patent Application Laid-Open No. 3-295300).

When the electronic component storage pack is used together with the existing component supply means, the mounting head component outlet is different in height from the standard height position at which electronic components are sent from the existing component supply means. Electronic components cannot be extracted from the component supply means including the storage pack with a common mounting head, and a mounting head dedicated to the storage pack must be provided.

In order to set the supply position of the electronic components sent from the storage pack to a standard height by other component supply means, a gentle curve is drawn from the component supply port of the electronic component and inclined downward. It is conceivable to provide a chute feed path having a component slideway (for example,
-280129).

[0006] According to the chute feed path, the electronic components can be aligned and moved along a hole of a predetermined width, so that the electronic components can be sent to a predetermined component picking position by the mounting head. However, if only the electronic component's own weight is used to slide down the interior of the component slideway and move to the component exit of the chute feed path, the electronic component may not be able to move due to the edge of the component being caught on the curved surface of the component slideway. In some cases, the electronic component cannot be smoothly moved to the component outlet of the chute feed path.

[0007]

SUMMARY OF THE INVENTION The present invention applies a means for supplying electronic components by a chute feed path, and stabilizes an electronic component from a component outlet of the chute feed path to a component picking position of a standard height by a mounting head. An object of the present invention is to provide a method and an apparatus for supplying a chute of an electronic component that can be sent well.

[0008]

According to a first aspect of the present invention, there is provided a method for supplying a chute for an electronic component, comprising a storage pack for electronic components in which a plurality of electronic components are stored, wherein the compressed air for the electronic components is supplied to the storage pack. And the electronic components are moved to the component outlet of the storage pack, a plurality of these electronic components are aligned, and a component slideway descending from the component inlet of the chute feed path aligned with the component outlet of the storage pack. And the compressed air of the electronic components is sent to the inside of the chute feed path, and is sent to the part exit of the chute feed path, which is located at a standard height where the mounting head moves up and down. And a component presence / absence sensor for detecting the presence / absence of a component in the component alignment path is provided near the component exit in the chute feed path. When the absence is detected, as a first step, the air for feeding the electronic components is sent to the component slideway of the chute feed path, and when the component presence / absence sensor still does not detect the electronic components on the component slideway, the second step is the pumping of the electronic components. Air is sent to the electronic component storage pack.

According to a second aspect of the present invention, there is provided a method of supplying a chute for an electronic component, comprising a shutter for opening and closing a component outlet of the chute feed path, and when closing the shutter, pressurized air for the electronic component is supplied to the inside of the chute feed path. The feeding air supply system for the electronic components is switched so that the feeding is always performed and the feeding of the feeding air to the chute feeding path is stopped when the shutter is opened.

According to a third aspect of the present invention, the opening and closing of the shutter and the switching of the pressurized air supply system are controlled in accordance with the vertical movement of the mounting head.

According to a fourth aspect of the present invention, there is provided an electronic component chute supply apparatus, wherein the electronic component storage pack contains a plurality of electronic components, and the compressed air of the electronic components is fed into the storage pack to store the electronic components. And a chute feed mechanism for feeding the electronic component moving to the component feed port to a component picking position of the mounting head that moves up and down at a standard height, and the chute feed mechanism is aligned with the component feed port of the storage pack. A component runway that slopes down from the component entrance,
A chute feed path for electronic components comprising a linear component alignment path for successively aligning and housing a plurality of electronic components from the component slideway and a component exit opening at a standard height at which the mounting head moves up and down. The chute feed path is connected to a compressed air supply system for electronic components, and a component presence sensor for detecting the presence / absence of a component in the component alignment path is provided near the component exit of the chute feed path. When detecting that there is no component on the alignment path, the first step is to send the compressed air of the electronic component to the component slideway of the chute feed path, and when the component presence / absence sensor still does not detect the electronic component on the component slideway, the second step is performed. It is configured by equipping the electronic component with a compressed air supply system for sending and controlling the compressed air of the electronic component into the storage pack of the electronic component.

According to a fifth aspect of the present invention, there is provided an electronic component chute supply device, comprising a shutter for opening and closing a component outlet of the chute feed path, and when closing the shutter, pressurized air of the electronic component is constantly supplied to the inside of the chute feed path. It is configured by connecting a feed air supply path of the electronic component for stopping the feed of the feed air to the chute feed path when the shutter is opened and opening the shutter to the chute feed path.

According to a sixth aspect of the present invention, there is provided an electronic component chute supply apparatus, comprising a link mechanism for abuttingly pressing as the mounting head moves downward, and the link mechanism includes a component outlet of a chute feed path. , And a cam plate for operating a switching valve for switching a compressed air supply path of the electronic components.

[0014]

According to the first aspect of the present invention, there is provided a method for feeding chute electronic components, wherein a plurality of electronic components are aligned and a component slideway descending from a component inlet of a chute feed path aligned with a component feed port of a storage pack. The electronic component is transferred to a linear component alignment path through the channel, but the compressed air of the electronic component is fed into the chute feed path to forcibly feed the electronic component in the hole of the chute feed path, so that the electronic component can be moved smoothly. Not only that, a component presence / absence sensor ensures that electronic components can be reliably moved from the component slideway of the chute feed path to the component outlet, and the number of times of feeding of compressed air can be reduced to prevent unnecessary contact between components. The electronic component can be stably sent out to a standard height position where the mounting head moves up and down.

According to a second aspect of the present invention, there is provided a method for feeding a chute of an electronic component, comprising a shutter for opening and closing a component outlet of the chute feed path, and when the shutter is closed, pressurized air of the electronic component is constantly fed into the chute feed path; When the shutter is opened, the feeding of the compressed air is stopped, so that not only the electronic components can be smoothly moved to the component outlet of the chute feed path, but also the electronic components can be prevented from jumping out of the component outlet of the chute feed path.

In the electronic component chute supply method according to the third aspect of the present invention, the opening and closing of the shutter and the switching of the pressurized air supply system are controlled as the mounting head moves up and down. The switching of the air can be accurately synchronized with the vertical movement of the mounting head.

In the electronic component chute supply apparatus according to the fourth aspect of the present invention, even if the electronic component is transferred from the component delivery port of the storage pack to the chute feed path, the compressed air supply of the electronic component is supplied to the chute feed path. The system path is connected, and a component presence / absence sensor for detecting the presence / absence of a component on the component alignment path is provided near the component exit of the chute feed path. The pumping air of the component is sent to the component slide on the chute feed path, and when the component presence / absence sensor still does not detect the electronic component on the component slide, the pumping air of the electronic component is sent to the electronic component storage pack as the second stage. Equipped with a compressed air supply path for electronic components to be mounted, the electronic components are opened to the standard height at which the mounting head moves up and down along the chute feed path. It can be fed smoothly to the parts outlet is located.

According to a fifth aspect of the present invention, there is provided an electronic component chute supply device including a shutter for opening and closing a component outlet of a chute feed path, and when the shutter is closed, pressurized air of the electronic component is constantly fed into the chute feed path. At the same time, when the shutter is opened, the compressed air supply system for the electronic components, which stops the supply of compressed air to the chute feed path, is connected to the chute feed path. And the electronic components can be reliably prevented from jumping out of the component outlet of the chute feed path.

According to a sixth aspect of the present invention, there is provided an electronic component chute supply device, comprising a link mechanism for abuttingly pressing as the mounting head moves down, and the link mechanism includes a component outlet of a chute feed path. Equipped with a cam plate that operates a shutter that opens and closes and a switching valve that switches the compressed air supply system of the electronic components, so that the shutter can open and close the component exit of the chute feed system and the switching valve switches the compressed air supply system. The movement can be accurately synchronized with the lifting and lowering movement of the mounting head, and can be operated by a simple mechanism.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the accompanying drawings, FIG. 1 shows a chute for an electronic component by mounting a storage pack 1 of electronic components in which a plurality of electronic components are aligned and stored in a chute feeding mechanism 2. FIG. 3 shows a supply device. In the figure, reference numeral 3 denotes a feeder base on which the electronic component chute feed mechanism 2 is mounted, and reference numeral 4 denotes a lock lever mechanism for detachably fixing the electronic component chute feed mechanism 2 to the feeder base 3.

The chute supply device is used together with a supply means for other electronic components such as an electronic component continuous tape, a magazine, a pallet, and the like, so that the electronic component mounting head H moves up and down to a standard height position. The components are configured to be sent out from the storage pack 1.

As shown in FIG. 2, the storage pack 1 for electronic components has a disk-shaped case body 10 sealed with a transparent cover plate inside. A spiral component storage groove 11 for storing in a line is provided inside. From the outermost periphery of the component storage groove 11, a component delivery port 13 is provided through a linear component alignment groove 12 so as to open to the upper side of the case body 10.

On the side of the substrate forming the case body 10, air feed holes 14a and 14b for feeding the compressed air of the electronic component into the spiral grooves of the component storage groove 11 as shown in FIG.
... are provided. An air outlet hole 15 for discharging the compressed air of the electronic component is provided on the cover plate side of the case body 10.
are provided so as to correspond to the air feed holes 14a, 14b.

The chute feed mechanism 2 has a component feed port 13
A holder 20 is disposed on the upper side to fit and hold the case body 10, and a component feed guide 21 extending from the holder 20 to a position where the electronic component is extracted by the mounting head H is provided.

The component feed guide 21 has a linear shape for arranging and storing a plurality of electronic components through a component slideway 22b that draws a gentle curve from a component inlet 22a that is aligned with the component feed port 13 of the storage pack 1. A chute feed path 22 that is continuous up to the component alignment path 22c is provided inside.
The end of the chute feed path 22 is a component outlet 22d that is continuously located from the component alignment path 22c, and the component outlet 22d.
Is formed as an extraction position of the electronic component based on the open surface of the component feed guide portion 21.

In the component alignment path 22c, an air inlet hole 23a is formed from the side of the component feed guide portion 21 to the component outlet 2.
It is provided so as to communicate obliquely toward the opening direction 1d. In addition to the air feed hole 23a, the component slideway 22
air feed hole 23b for the component feed guide portion 2
1 is provided so as to communicate in the vertical direction from the side surface.

The chute feed mechanism 2 is equipped with a pressurized air supply system 5 for supplying pressurized air for electronic components. The compressed air supply system 5 for the electronic component is provided with a main pipe 5 that continuously supplies the compressed air for the electronic component from the air supply source.
0 from its main pipe 50 to the switching valve 51
An air supply path 52 is provided to feed the compressed air of the electronic component from the air feed holes 14a, 14b.

In addition to the air supply line 52, an air supply line 53 for feeding the compressed air of the electronic component into the chute feed line 22 is provided branched from the switching valve 51. The air supply path 53 is connected to an air switching bubble 55 of the chute feed path 22 via an intermediate switching bubble 54 that is mechanically switched by a link mechanism. Further, two branch pipes 56a and 56b connected to the air feed hole 23a of the component alignment path 22c and the air feed hole 23b of the component slide-down path 22b are drawn out of the air switching bubble 55 of the chute feed path 22. Have been.

In addition, from the intermediate switching bubble 54, the storage pack 1 for electronic components is moved from the holder 2 of the chute feed mechanism 2.
Detection valve 57 for confirming that the positioning is maintained at 0
And the branch pipe 58 is drawn out. Further, the detection valve 57 is provided with an air supply path for supplying air to a holding mechanism (not shown) that pneumatically fixes the electronic component storage pack 1 to the holder section 20 of the chute feeding mechanism 2. .

The above-described switching valve 51 is provided so as to be controlled by a command from the control box 6 so as to feed the compressed air of the electronic component into the storage groove 11 whenever necessary. The intermediate switching valve 54 is opened so as to communicate with the switching valve 55 so as to constantly supply the compressed air of the electronic component fed from the air supply path 53 to the air inlet 23a of the component alignment path 22c as shown in FIG. I have. The intermediate switching valve 54 is opened so that air is always supplied to the detection valve 57 of the holding mechanism that pneumatically presses the storage pack 1 described above.

Air switching valve 5 in chute feed path 22
Numeral 5 is provided so that the pressure-feed air of the electronic component can be switched from the air feed hole 23a of the component alignment path 22c to the air feed hole 23b of the component slideway 22b by a command from a component presence / absence detection sensor described later.

The chute feed mechanism 2 is further provided with a shutter 7 for opening and closing the component outlet 22d of the chute feed path 22 by being slidably supported by a holding plate 7a based on the open surface of the component feed guide portion 21. ing. The shutter 7 has a leg 7b projecting downward as shown in FIG. 5, and the leg 7b is inserted into a concave receiving groove 7c provided on the base surface of the component feed guide 21, and the shutter 7 is The component outlet 22d of the chute feed path 22 is always closed by elastically supporting it by a compression spring 7d inserted between the receiving groove 7b and the receiving groove 7c.

The shutter 7 has a protruding pin 7e on the side thereof, and the protruding pin 7e is pressed by a cam plate 84 of a link mechanism 8, which will be described later, so as to oppose the compression spring 7d. Parts outlet 2
Equipped to open 2d.

As shown in FIG. 1, the link mechanism 8 is provided with an upright plate 80 on the side of the component feed guide section 21, and a cam plate 81 is mounted on a plate surface of the upright plate 80 in a swingably rotatable manner. It is constituted by. In the structure, the cam plate 81 is provided so as to be positioned so as to abut against and be pressed by the pressing operation shaft P provided on the mounting head H that moves up and down. The cam plate 81 has a link bar 82 extending toward the equipment side of the shutter 7 and a link bar 83 extending toward the intermediate switching valve 54 of the chute feed path 21 by supporting one end side. Installed.

One of the link bars 82, 83
2 includes a protruding piece portion 8 that engages with the protruding pin 7e of the shutter 7.
A cam plate 84 having 4a is connected. The other 83 has a valve rod 5 projecting outward from the intermediate switching valve 54.
The cam plate 85 which contacts with 4a is connected. Each of the cam plates 84 and 85 is mounted on the lower side of the component feed guide portion 21 so as to be swingably rotatable.

A tension spring 86 is mounted on the cam plate 81, which swings in contact with the pressing operation axis P of the mounting head H, so as to extend between the cam plate 81 and one of the link bars 82.
In order to regulate the pulling position by the tension spring 86, a stopper pin 87 is provided on the side surface of the cam plate 81 so as to engage with the link bar 82.

The intermediate switching valve 54 has a valve body 54b integrally formed with a valve rod 54a as shown in FIG. 4, and the valve body 54a is elastically pressed by a compression spring 54c interposed therein. As described above, the predetermined air supply system is configured to be always open or closed.

The chute feed mechanism 2 includes a component alignment path 22
A component presence / absence sensor 9 for detecting the presence / absence of the component c is provided near the component outlet 22d of the chute feed path 22. The component presence / absence sensor 9 is a photoelectric sensor, and when detecting the absence of a component in the component alignment path 22c, as a first step, the switching valve 55 of the air feed hole 22 is moved from the air inlet hole 23a of the component alignment path 22c to the component slideway 22b.
Is controlled to switch to the air inlet hole 23b. Thereafter, when the component presence / absence sensor 9 still does not detect the electronic component in the component alignment path 22c, a second stage is provided to control the switching valve 51 so as to send the compressed air of the electronic component to the electronic component storage pack 1. I have.

In the electronic component chute supply device configured as described above, initially, the compressed air of the electronic component is supplied from the switching valve 51 via the air supply path 52 to the component storage groove 11 provided in the electronic component storage pack 1. To the inside.
With the feeding of the compressed air, a plurality of electronic components accommodated in the component storage grooves 11 of the storage pack 1 are supplied to the chute feed path 22 of the component feed guide portion 21 from the component inlet 22 a aligned with the component feed outlet 13. Sent in. When a plurality of these electronic components are fed into the chute feed path 22 of the component feed guide section 21, the switching valve 51 is controlled so as to temporarily shut off the air supply path 52 by a command from the control box 6.

The electronic component fed into the chute feed path 22 slides down by its own weight inside the component slide-off path 22b, from the linear component alignment path 22c where the compressed air for electronic component is constantly fed to the component outlet 22d. Moving. From here, the mounting head H of the electronic component is moved down to the component picking position provided at the standard height position, and the chute feed path 22 is moved.
The electronic component sent out from the component outlet 22d is extracted by sucking it at the nozzle tip.

With the downward movement of the mounting head H, the pressing operation shaft P provided on the mounting head H side swings and rotates by abuttingly pressing the cam plate 81, and the cam is moved via the link bar 82. When the plate 84 swings and rotates, the projecting piece 84 a of the cam plate 84 engages with the projecting pin 7 a of the shutter 7, thereby opening the component outlet 22 d of the chute feed path 22. With the opening of the component outlet 22d, the electronic component is sent out from the component outlet 22d of the chute feed path 22 to the component extracting position, and the mounting head H can hold the electronic component E.

At the same time, the cam plate 81 and the link bar 8
3 is connected to the cam plate 85 via the intermediate switching valve 54.
A switching valve that presses the valve rod 54a of the above and moves the valve body 54b integrally formed with the valve rod 54a against the compression spring 54c to feed the compressed air of the electronic component into the component alignment path 22c of the chute feed path 22. 55, the air supply path 56a is shut off.

When the mounting head H of the electronic component moves upward after sucking and extracting the electronic component at the tip of the nozzle, the cam plate 82 is released from the contact pressing by the pressing operation shaft P, and the link mechanism 8 is released.
Is returned entirely by the tension spring 86. Along with this, the shutter 7 closes the component outlet 22a of the chute feed path 22, and the intermediate switching valve 54 switches the air supply path so that the compressed air of the electronic component is fed into the component alignment path 22c of the chute feed path 22. .

By repeating the above operation, the electronic component E moved to the component alignment path 22c of the chute feed path 22 as shown in FIG. It is sequentially extracted at the tip.

The parts alignment path 22 of the chute feed path 22
When the remaining number of the electronic components moved to the component c reaches a predetermined number from the component outlet 22d, the component presence / absence sensor 9 sets the component alignment path 2
The absence of the component 2c is detected. In accordance with this detection, the switching valve 55 of the chute feed path 22 is actuated by a command from the component presence / absence sensor 9, and pressurized air for electronic components is supplied from the air supply system 23 a of the component alignment path 22 c to the air supply system of the component slideway 22 b. Switch to road 23b.

By switching the valve 55, the compressed air of the electronic component is sent into the component slideway 22b. Therefore, even if the electronic component is caught on the inner surface of the component slideway 22b, it remains in the chute feed path 22. It can move smoothly to the component outlet 22d.

The compressed air for the electronic components is supplied to the component slideway 2.
When the component presence / absence sensor 9 still does not detect the presence of the component after being sent into the inside of the component 2b, the compressed air of the electronic component is sent to the component storage groove 11 of the storage pack 1 by a command from the control box 6 as originally, The electronic component is controlled to be sent from the component outlet 13 of the storage pack 1 to the chute feed path 22 of the component feed guide 21.

Since it is possible to set the feeding of the compressed air to the chute feed path 22 in a small number of times, including the control of the feeding of the compressed air to the storage pack 1 for the electronic components, the electronic components are stored in the component storage grooves 11 of the storage pack 1. It is possible to reduce the contact between the electronic components and the electronic components sliding down the chute feed path 22 between the components.

In the above-described embodiment, the case has been described in which the electronic component storage pack 1 in which the electronic components are stored in the spiral storage groove 11 is provided. The present invention can also be applied to a case where a bulk-type storage pack is installed in the storage device.

[0050]

As described above, according to the method and apparatus for supplying the electronic component chute according to the present invention, the electronic component is moved from the chute feed path to the standard height position where the mounting head is moved up and down by a simple mechanism. Smooth feeding can be performed, electronic components can be prevented from being damaged, and the operation of each mechanism can be accurately controlled as the mounting head moves up and down.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing an entire electronic component chute supply device according to the present invention.

FIG. 2 is an explanatory diagram showing a storage pack of electronic components mounted on the chute supply device from a cover plate side.

FIG. 3 is an explanatory diagram showing the storage pack from the substrate side.

FIG. 4 is an explanatory view showing a partial cross section of an intermediate switching valve of a pressure-feeding air supply system provided in the chute supply device.

FIG. 5 is an explanatory view showing a shutter provided in the chute supply device in a partial cross section.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Storage pack of electronic parts 10 Case main body of storage pack 11 Storage groove of parts of storage pack 13 Parts feeding outlet of storage pack 2 Chute feed mechanism 21 Parts feed guide part 22 Chute feed path 22a Parts inlet of chute feed path 22b Chute feed path Component slideway 22c Chute feed path component alignment path 22d Chute feed path component outlet 23a Air supply system path for component alignment path 23b Air supply system path for component slideway 5 Air supply path 54 Switching valve 7 Shutter 8 Link mechanism 84, 85 Cam plate of link mechanism 9 Component presence sensor H Mounting head

Continuation of the front page (72) Inventor Takeshi Ito 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation (56) References JP-A-62-280129 (JP, A) JP-A-3-295300 ( JP, A) JP-A-2-251199 (JP, A) JP-A-4-157800 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 3/30 H05K 13/00 -13/04

Claims (6)

(57) [Claims] An electronic component storage pack in which a plurality of electronic components are stored is provided, and the compressed air of the electronic components is sent into the storage pack to move the electronic components to a component outlet of the storage pack. Are arranged and transferred from the component inlet of the chute feed path, which is aligned with the component feed port of the storage pack, to the linear component alignment path via the downhill component slideway, and the chute feed of the electronic component compressed air. A component that is fed into the path, moves the electronic component to the component exit of the chute feed path that is open at a standard height at which the mounting head moves up and down, and further detects a component presence in the component alignment path. A presence / absence sensor is provided near the component outlet of the chute feed path, and when the component presence / absence sensor detects that there is no component, the first step is to send compressed air for electronic components to the chute feed path. An electronic component, wherein when the component presence sensor does not detect an electronic component on the component slideway, the compressed air of the electronic component is sent to the electronic component storage pack as a second step when the component presence sensor still does not detect the electronic component on the component slideway. Chute supply method. 2. A shutter for opening and closing a component outlet of the chute feed path, wherein when the shutter is closed, compressed air for electronic components is constantly fed into the chute feed path, and when the shutter is opened, the compressed air is supplied to the chute feed path. 2. The method according to claim 1, wherein the air supply path of the electronic component is switched so as to stop the feeding. 3. The method according to claim 2, wherein the opening and closing of the shutter and the switching of the compressed air supply system are controlled in accordance with the elevation of the mounting head. 4. A standard height of a storage pack of electronic components in which a plurality of electronic components are stored, and an electronic component which sends compressed air of the electronic components into the storage pack and moves to a component outlet of the storage pack. A chute feeding mechanism for feeding the component to a picking position of the mounting head which moves up and down, and the chute feeding mechanism includes a component slideway inclined downward from the component inlet aligned with the component delivery port of the storage pack, and a component slideway. A chute feed path for electronic components comprising a linear component alignment path for successively aligning and housing a plurality of electronic components from the path and a component exit opening at a standard height at which the mounting head moves up and down, and The chute feed path is connected to a compressed air supply system for electronic components, and a component presence / absence sensor for detecting the presence / absence of a component in the component alignment path is provided near the component exit of the chute feed path. When the component presence / absence sensor detects that there is no component on the component alignment path, the first step is to send the compressed air of the electronic component to the component slideway of the chute feedway, and the component presence / absence sensor still detects the electronic component on the component slideway. In a second step, a chute supply device for electronic components is provided with a compressed air supply system for supplying electronic components to a storage pack for electronic components as a second stage. 5. A shutter for opening and closing a component outlet of the chute feed path, wherein when the shutter is closed, the compressed air for electronic components is always fed into the chute feed path, and when the shutter is opened, the compressed air for the chute feed path is supplied to the chute feed path. 5. The electronic component chute supply device according to claim 4, wherein a pressurized air supply system of the electronic component to stop feeding is connected to the chute feed channel. 6. A link mechanism for abutting and pressing as the mounting head moves down, the link mechanism including a shutter for opening and closing a component outlet of a chute feed path, and a pressure feed air supply system for electronic components. The chute supply device for an electronic component according to claim 5, further comprising a cam plate for operating a switching valve for switching between the two.