JPH0315820B2 - - Google Patents
Info
- Publication number
- JPH0315820B2 JPH0315820B2 JP25339584A JP25339584A JPH0315820B2 JP H0315820 B2 JPH0315820 B2 JP H0315820B2 JP 25339584 A JP25339584 A JP 25339584A JP 25339584 A JP25339584 A JP 25339584A JP H0315820 B2 JPH0315820 B2 JP H0315820B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- frame
- current
- electronic component
- terminal frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 12
- 238000003466 welding Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49537—Plurality of lead frames mounted in one device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25339584A JPS60149156A (ja) | 1984-11-29 | 1984-11-29 | 電子部品素子および電子部品のケース収容方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25339584A JPS60149156A (ja) | 1984-11-29 | 1984-11-29 | 電子部品素子および電子部品のケース収容方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57128466A Division JPS5918663A (ja) | 1982-07-22 | 1982-07-22 | 電子部品のケ−ス収容方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60149156A JPS60149156A (ja) | 1985-08-06 |
| JPH0315820B2 true JPH0315820B2 (enrdf_load_stackoverflow) | 1991-03-04 |
Family
ID=17250770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25339584A Granted JPS60149156A (ja) | 1984-11-29 | 1984-11-29 | 電子部品素子および電子部品のケース収容方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60149156A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6248050A (ja) * | 1985-08-28 | 1987-03-02 | Seiei Kosan Kk | 半導体デバイス等のパツケ−ジング方法 |
-
1984
- 1984-11-29 JP JP25339584A patent/JPS60149156A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60149156A (ja) | 1985-08-06 |
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