JPH0315820B2 - - Google Patents
Info
- Publication number
- JPH0315820B2 JPH0315820B2 JP25339584A JP25339584A JPH0315820B2 JP H0315820 B2 JPH0315820 B2 JP H0315820B2 JP 25339584 A JP25339584 A JP 25339584A JP 25339584 A JP25339584 A JP 25339584A JP H0315820 B2 JPH0315820 B2 JP H0315820B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- frame
- current
- electronic component
- terminal frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 12
- 229920005992 thermoplastic resin Polymers 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 12
- 238000003466 welding Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229930182556 Polyacetal Natural products 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49537—Plurality of lead frames mounted in one device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、電子部品素子およびこれを用いた
電子部品のケース収納方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component element and a case storage method for electronic components using the same.
（従来の技術）
従来より、集積回路等の電子部品においては、
エポキシ系樹脂を型に流し込むトランスフアーモ
ールド等により外装が行われているが、機械的振
動を許容する等の目的で空間を内部に形成しなけ
ればならない圧電共振子や音片等の電子部品の素
子本体をトランスフアーモールドにより外装する
ことは困難であつた。(Conventional technology) Conventionally, in electronic components such as integrated circuits,
Exterior packaging is done using transfer molding, etc. in which epoxy resin is poured into a mold, but electronic components such as piezoelectric resonators and sound pieces that require a space inside to allow for mechanical vibrations, etc. It has been difficult to package the device body with transfer molding.
そこで、この種の電子部品の素子本体を外装す
るには、予め中空構造に成形した一対のセラミツ
ク等の外装ケースを用いて、低融点ガラスや接着
剤等によつてこれら外装ケースを貼り合せるよう
にしていたが、電子部品が小さくなつて外装ケー
スが小形化すると、低融点ガラスや接着剤の塗布
が困難になるばかりでなく、外装ケース同志の位
置合せ精度も悪くなり、接着剤の硬化時間も長
く、硬化温度も高く、生産効率も低いといつた欠
点を有していた、。 Therefore, in order to package the element body of this type of electronic component, it is recommended to use a pair of ceramic or other outer cases that have been formed into a hollow structure in advance, and then bond these outer cases together using low-melting glass or adhesive. However, as electronic components become smaller and outer cases become smaller, it not only becomes difficult to apply low-melting glass or adhesives, but also the alignment accuracy of the outer cases deteriorates, which increases the curing time of the adhesive. The disadvantages were that the process was long, the curing temperature was high, and the production efficiency was low.
上述の欠点を除く一方法として、熱可塑性樹脂
からなる凹形状の２つのケース間に電子部品素子
要素取付用の枠形状を有する金属板にてなる端子
フレームを挟み、この端子フレームに通電して発
熱させることにより両ケースの接触面を加熱して
溶着する方法が提案されている。 One method to eliminate the above-mentioned drawbacks is to sandwich a terminal frame made of a metal plate having a frame shape for mounting electronic component elements between two concave cases made of thermoplastic resin, and to apply electricity to this terminal frame. A method has been proposed in which the contact surfaces of both cases are heated and welded by generating heat.
しかるに、この提案に係るケース収納方法は、
電子部品素子要素と接続される端子フレームのリ
ード端子を、加熱通電用の端子としても用いるた
めに、加熱通電時にリード端子を通じて電子部品
素子要素にも電流が流れ、リード端子のハンダメ
ツキがとれるなどの不具合がある。 However, the case storage method related to this proposal is
The lead terminals of the terminal frame that are connected to the electronic component elements are also used as heating and energizing terminals, so when heating and energizing, current flows through the lead terminals to the electronic component element, which can remove solder marks from the lead terminals. There is a problem.
（発明が解決しようとする問題点およびこの問題
点を解決するための手段）
この発明は、上述の問題点に鑑みてなされたも
ので、枠形状を有する基板部と、この基板部から
外向きに突出した複数のリード端子および一対の
通電端子とを有する端子フレームを複数備え、隣
接する端子フレームの同極の通電端子同士を端子
フレーム連結部で連結した形状で一体形成し、端
子フレームの基板部に電子部品素子要素を設け、
該端子フレームの基板部の両面を、熱可塑性樹脂
からなる２つの外装用のケースの端面により挟み
込み、上記端子フレーム連結部間に通電して、該
端子フレームの基板部を発熱させることにより、
両ケースの端面を互いに溶着して、両ケース内に
電子部品素子を封入するようにしたもので、電子
部品素子要素には、加熱用の電流が流れるのを防
止し、かつ、小型のものでも容易にモールドでき
る電子部品のケース収容方法を提供することを目
的とする。また、この発明は、枠形状を有する基
板部と、この基板部から外向きに突出した複数の
リード端子および一対の通電端子とを有する端子
フレームを複数備え、隣接する端子フレームの同
極の通電端子同士を端子フレーム連結部で連結し
た形状で一体形成し、端子フレームの基板部に電
子部品素子要素を設けて成るという、前述の電子
部品のケース収容方法を実施するのに最適な電子
部品素子構造を提供することを目的とする。(Problems to be Solved by the Invention and Means for Solving the Problems) This invention has been made in view of the above-mentioned problems. A plurality of terminal frames each having a plurality of lead terminals and a pair of current-carrying terminals protruding from each other are integrally formed in a shape in which the current-carrying terminals of the same polarity of adjacent terminal frames are connected by a terminal frame connecting portion, and the terminal frame substrate An electronic component element is provided in the part,
Both sides of the board part of the terminal frame are sandwiched between the end faces of two exterior cases made of thermoplastic resin, and electricity is applied between the terminal frame connecting parts to generate heat in the board part of the terminal frame.
The end faces of both cases are welded to each other, and the electronic component element is enclosed within both cases.The electronic component element is designed to prevent heating current from flowing through the electronic component element, and to prevent heating current from flowing through the electronic component element. It is an object of the present invention to provide a method for accommodating electronic components in a case that can be easily molded. Further, the present invention includes a plurality of terminal frames having a frame-shaped substrate portion, a plurality of lead terminals protruding outward from the substrate portion, and a pair of current-carrying terminals, and the same polarity of current-carrying terminals of adjacent terminal frames is provided. An electronic component element that is ideal for carrying out the above-mentioned electronic component case housing method, in which the terminals are integrally formed in a shape in which they are connected to each other by a terminal frame connection part, and the electronic component element element is provided on the board part of the terminal frame. The purpose is to provide structure.
以下に、この発明の一実施例を、添付図面とと
もに説明する。 An embodiment of the present invention will be described below with reference to the accompanying drawings.
第１図において、２は端子フレーム、１０は電
子部品素子要素の一例である音片振動子、２０お
よび２２は外装用のケースである。 In FIG. 1, 2 is a terminal frame, 10 is a vibrator which is an example of an electronic component element, and 20 and 22 are exterior cases.
上記端子フレーム２は、薄い金属板を打抜いて
一体的に形成したものである。この端子フレーム
２は、第３図に示すように、一列状にならび各々
の通電端子５−１同士、５−２同士が二本の端子
フレーム連結部Ｆで連結された状態で形成され
る。この端子フレームの連結体全体を端子フレー
ム板１と呼ぶ。 The terminal frame 2 is integrally formed by punching out a thin metal plate. As shown in FIG. 3, this terminal frame 2 is formed in a state in which the current-carrying terminals 5-1 and 5-2 are connected to each other by two terminal frame connecting portions F arranged in a line. This entire connected body of terminal frames is called a terminal frame plate 1.
１つの端子フレーム２は、平面形状が略四角形
の環状の枠形状にてなる基板部３と、基板部３の
一方の対向する辺３ａ，３ａから外方に向けて突
出するこの実施例では４つのリード端子４−１，
４−２，４−３，４−４、および一対の通電端子
５−１，５−２と、他方の対向する辺３ｂ，３ｂ
から内方に向けて突出する４つの支持片６−１，
６−１，６−２，６−２、とを有している。そし
て、基板部３の辺３ａと通電端子５−１，５−２
とのそれぞれ連結部分には、各辺３ａの内方の縁
から辺３ａを横断して通電端子５−１，５−２に
延在する略Ｕ字形の切欠部７が設けられている。 One terminal frame 2 includes a board part 3 having an annular frame shape with a substantially square planar shape, and a board part 3 in this embodiment that protrudes outward from one opposing side 3a, 3a of the board part 3. one lead terminal 4-1,
4-2, 4-3, 4-4, and a pair of current-carrying terminals 5-1, 5-2, and the other opposing sides 3b, 3b
four support pieces 6-1 protruding inward from
6-1, 6-2, 6-2. Then, the side 3a of the board portion 3 and the current-carrying terminals 5-1, 5-2
A substantially U-shaped notch 7 extending from the inner edge of each side 3a to the current-carrying terminals 5-1 and 5-2 across the side 3a is provided at each connecting portion with the side 3a.
上記音辺振動子１０は、エリンバ等の恒弾性金
属板を打抜いて一体的に形成した板体１１を用い
て構成したものである。この板体１１は、四角形
の枠部１２と、該枠部１２の内部に長方形の振動
子本体１３と、該振動子本体１３の振動節部を支
持する４つの結合子１４−１，１４−２，１４−
３，１４−４とを有する。この板体１１における
振動子本体１３と結合子１４−１および１４−３
と枠部１２の一部との上面には、酸化亜鉛
（ZnO）等の圧電材料からなる圧電膜１５が形成
されている。この圧電膜１５を図中、斜線で示
す。さらに、圧電膜１５の上面には、導電膜１６
が設けられている。この導電膜１６は、駆動電極
部１６ａとリード電極部１６ｂと引出電極部１６
ｃとを形成している。 The tone-side vibrator 10 is constructed using a plate body 11 integrally formed by punching out a constant elastic metal plate such as Erinba. This plate body 11 includes a rectangular frame portion 12, a rectangular vibrator body 13 inside the frame portion 12, and four connectors 14-1, 14- that support the vibration node portions of the vibrator body 13. 2,14-
3, 14-4. Vibrator main body 13 and connectors 14-1 and 14-3 in this plate body 11
A piezoelectric film 15 made of a piezoelectric material such as zinc oxide (ZnO) is formed on the upper surfaces of the frame portion 12 and a portion of the frame portion 12 . This piezoelectric film 15 is indicated by diagonal lines in the figure. Furthermore, a conductive film 16 is provided on the upper surface of the piezoelectric film 15.
is provided. This conductive film 16 includes a drive electrode section 16a, a lead electrode section 16b, and an extraction electrode section 16.
c.
上記ケース２０，２２は、ともに、ポリカーボ
ネイト、ポリアセタール、PBT、PPS等の熱可
塑性樹脂により方形状に形成したものである。ケ
ース２０と２２は、同一形状であつて、それぞ
れ、周壁２０ｂ，２２ｂで囲まれた凹所２１，２
３を有し、ケース２０，２２の端面２０ａ，２２
ａを合わせると１つの容器を構成するようになつ
ている。周壁２０ｂ，２２ｂは、上記端子フレー
ム２の各辺２ａと２ｂが端面２０ａ，２２ｂに重
なり合うような寸法に形成されている。 Both of the cases 20 and 22 are made of thermoplastic resin such as polycarbonate, polyacetal, PBT, PPS, etc. and are formed into a rectangular shape. The cases 20 and 22 have the same shape and have recesses 21 and 2 surrounded by peripheral walls 20b and 22b, respectively.
3, and the end surfaces 20a, 22 of the cases 20, 22
When a is put together, it constitutes one container. The peripheral walls 20b, 22b are dimensioned such that each side 2a, 2b of the terminal frame 2 overlaps the end surface 20a, 22b.
次に、音辺振動子をケース内に収容して封入す
る方法について説明する。 Next, a method of accommodating and enclosing the sound-side vibrator in the case will be described.
端子フレーム２における基板部２の内部に、そ
れぞれ、支持片６−１，６−２を介して音片振動
子１０を装着する。このように端子フレーム連結
部Ｆで複数の端子フレームが一体形成されたもの
に電子部品素子要素が設けられたものを電子部品
素子と呼ぶ。この場合、第１図に示すように、音
片振動子１０の枠部１２の○印が付された部分と
端子フレーム２の支持片６−２，６−２の○印が
付された部分とは、たとえば、スポツト溶接す
る。また、音片振動子１０の引出電極部１６ｃと
端子フレーム２の支持片６−１とは、たとえば、
圧着半田付け等により固着する。 The vibrating bar vibrator 10 is mounted inside the substrate section 2 of the terminal frame 2 via support pieces 6-1 and 6-2, respectively. A structure in which a plurality of terminal frames are integrally formed at the terminal frame connecting portion F and an electronic component element is provided thereon is called an electronic component element. In this case, as illustrated in FIG. For example, spot welding. Further, the extraction electrode portion 16c of the vibrating bar vibrator 10 and the support piece 6-1 of the terminal frame 2 are, for example,
Secure by crimp soldering, etc.
上述のようにして、端子フレーム２に、それぞ
れ音片振動子１０を装着した後、端子フレーム２
の基板部３の各辺３ａ，３ｂを、それぞれケース
２０の周壁２０ｂの端面２０ａとケース２２の周
壁２２ｂの端面２２ａに合致させて、両ケース２
０，２２の凹所２１，２３で形成される空間内に
音辺振動子１０を収容するとともに、ケース２０
と２２の端面２０ａと２２ａで、所定の圧力をも
つて基板部３を挟む。その後、端子フレーム２の
通電端子５−１，５−２間に、所定の電圧を印加
すると、電流が通電端子５−１、基板部３、通電
端子５−２に流れる。よつて、基板部３は、その
抵抗値に応じて発熱し、ケース２０の端面２０ａ
とケース２２の端面２２ａとが加熱されて溶融
し、両端面２０ａと２２ａは溶着される。 After mounting the vibrating unit vibrators 10 on the terminal frames 2 as described above, the terminal frames 2
The sides 3a and 3b of the substrate section 3 are aligned with the end surface 20a of the peripheral wall 20b of the case 20 and the end surface 22a of the peripheral wall 22b of the case 22, respectively, so that both cases 2
The sound-side vibrator 10 is accommodated in the space formed by the recesses 21 and 23 of 0 and 22, and the case 20
The substrate portion 3 is sandwiched between the end surfaces 20a and 22a of the and 22 with a predetermined pressure. Thereafter, when a predetermined voltage is applied between the current-carrying terminals 5-1 and 5-2 of the terminal frame 2, a current flows through the current-carrying terminal 5-1, the substrate portion 3, and the current-carrying terminal 5-2. Therefore, the substrate section 3 generates heat according to its resistance value, and the end surface 20a of the case 20
and end surface 22a of case 22 are heated and melted, and both end surfaces 20a and 22a are welded.
なお、支持片６−１，６−２、音片振動子１
０、およびリード端子１４−１乃至１４−４には
電流が流れず、音片振動子１０が溶着用の電流に
より破損することを防止でき、また、リード端子
１４−１乃至１４−４に予め付着された半田が溶
落することもない。上述の操作により、音片振動
子１０は、数秒間でケース２０，２２内に封入さ
れる。 In addition, the supporting pieces 6-1, 6-2, the vibrating piece vibrator 1
0 and the lead terminals 14-1 to 14-4, so that the vibrating bar resonator 10 can be prevented from being damaged by the welding current. The attached solder will not melt off. By the above-described operation, the vibrating bar vibrator 10 is enclosed within the cases 20 and 22 in a few seconds.
つぎに、上述のようにして、ケース２０，２２
で外装された各端子フレーム２の通電端子５−
１，５−２を、第２図中、一点鎖線で示す位置で
切断する。このことにより、リード端子４−１，
４−３と４−２，４−４とは、切欠部７により、
電気的に絶縁される。 Next, as described above, cases 20 and 22
The current-carrying terminal 5- of each terminal frame 2 is sheathed with
1 and 5-2 are cut at the position shown by the dashed line in FIG. As a result, lead terminals 4-1,
4-3, 4-2, and 4-4 are connected by the notch 7,
electrically isolated.
また、各端子フレーム２におけるリード端子４
−１乃至４−４を、第２図中、一点鎖線で示す位
置でケース２０の側面２０ｃに向けて略直角に折
曲する。これで、いわゆる、デユアルインライン
型のモールドされた音片振動子が得られる。 In addition, the lead terminal 4 in each terminal frame 2
-1 to 4-4 are bent at a substantially right angle toward the side surface 20c of the case 20 at the position shown by the dashed line in FIG. In this way, a so-called dual-in-line molded vibrator can be obtained.
なお、上述の実施例においては、音片振動子１
０のモールド電子部品を製造する場合について述
べたが、この発明は、上述の音片振動子１０に限
らず、たとえば、圧電共振子、リードスイツチ、
リードリレー、バイメタル、圧力センサ等のよう
に、機械的振動をおこなう電子部品素子要素をケ
ースに収容する場合にも適用できる。 In addition, in the above-mentioned embodiment, the sound piece vibrator 1
Although the case of manufacturing a molded electronic component of 0 has been described, the present invention is not limited to the above-mentioned acoustic resonator 10, but can be applied to piezoelectric resonators, reed switches,
The present invention can also be applied to cases where electronic component elements that produce mechanical vibrations, such as reed relays, bimetals, pressure sensors, etc., are housed in a case.
なお、端子フレーム２の通電端子５−１，５−
２間に電流を流すには、第３図のように、連結し
た端子フレーム２の各々に電子部品素子要素を取
り付けるか一体的に形成して、各端子フレーム２
を複数個一斉に所定の工程に送つて、一対又は複
数対の溶着溶電極（図示せず）を端子フレーム連
結部Ｆに圧接するなどすればよい。当然のことで
はあるが端子フレーム連結部Ｆの幅が広いと溶着
用電極との接触抵抗を小さくできて好ましい。 In addition, the current-carrying terminals 5-1, 5- of the terminal frame 2
In order to pass a current between the terminal frames 2, as shown in FIG.
A plurality of electrodes may be sent to a predetermined process all at once, and one or more pairs of welding electrodes (not shown) may be pressed into contact with the terminal frame connecting portion F. It goes without saying that it is preferable that the width of the terminal frame connection part F is wide because it can reduce the contact resistance with the welding electrode.
以上説明したように、この発明によれば、電子
部品素子要素が装着される端子フレームの基板部
に設けた一対の通電端子間に通電するのに端子フ
レーム連結部で複数の端子フレームが連結された
状態で行なうから、該基板部を挟み込むように取
り付けた熱可塑性樹脂からなる外装用の２つのケ
ースの対向端面を溶着するとき、電子部品素子要
素に不要に電流を流すことがないことはもちろ
ん、複数の電子部品のケースを同時に溶着できて
生産性が向上するとともに、溶着電流が端子フレ
ーム連結部を介して分流均一化されるから溶着電
流が安定になり溶着状態のばらつきがなくなる。
さらには、電子部品が小型になつて基板部、リー
ド端子および通電端子が小さくなつても端子フレ
ーム連結部は大きくできるから、作業効率が悪く
なることもないし、溶着電流も安定している。 As explained above, according to the present invention, a plurality of terminal frames are connected at the terminal frame connecting portion in order to conduct electricity between a pair of current-carrying terminals provided on the substrate portion of the terminal frame on which the electronic component element is mounted. Since the process is carried out in a state in which the circuit board is sandwiched, when welding the opposing end surfaces of the two exterior cases made of thermoplastic resin that are attached so as to sandwich the board part, it goes without saying that unnecessary current will not be passed through the electronic component elements. The cases of multiple electronic components can be welded at the same time, which improves productivity, and the welding current is divided and uniformized through the terminal frame connecting portion, making the welding current stable and eliminating variations in the welding state.
Furthermore, even if electronic components become smaller and the size of the board, lead terminals, and current-carrying terminals becomes smaller, the terminal frame connecting portion can be made larger, so work efficiency does not deteriorate and the welding current is stable.
このようにこの発明は非常に効率よくかつ高品
質でしかも安価になるケース封入方法とこの方法
の実施に最適な電子部品素子である。 As described above, the present invention provides a method for enclosing a case that is highly efficient, high quality, and inexpensive, and an electronic component element that is most suitable for carrying out this method.
第１図は、この発明の一実施例を示す分解斜視
図、第２図は、電子部品をケースで外装した状態
を透視した図、第３図は、複数の端子フレームを
連結した端子フレーム板の一例を示す平面図であ
る。
１……端子フレーム板、２……端子フレーム、
３……基板部、４−１，４−２，……，４−４…
…リード端子、５−１，５−２……通電端子、１
０……音片振動子、２０，２１……外装用のケー
ス、Ｆ……端子フレーム連結部。
Fig. 1 is an exploded perspective view showing an embodiment of the present invention, Fig. 2 is a transparent view of an electronic component covered with a case, and Fig. 3 is a terminal frame plate connecting a plurality of terminal frames. It is a top view showing an example. 1...Terminal frame board, 2...Terminal frame,
3... Board part, 4-1, 4-2,..., 4-4...
... Lead terminal, 5-1, 5-2 ... Current-carrying terminal, 1
0... Sound piece vibrator, 20, 21... Exterior case, F... Terminal frame connection portion.
Claims (1)
向きに突出した複数のリード端子および一対の通
電端子とを有する端子フレームを複数備え、隣接
する端子フレームの同極の通電端子同士を端子フ
レーム連結部で連結した形状で一体形成し、端子
フレームの基板部に電子部品素子要素を設けて成
る電子部品素子。 ２ 枠形状を有する基板部と、この基板部から外
向きに突出した複数のリード端子および一対の通
電端子とを有する端子フレームを複数備え、隣接
する端子フレームの同極の通電端子同士を端子フ
レーム連結部で連結した形状で一体形成し、端子
フレームの基板部に電子部品素子要素を設け、該
端子フレームの基板部の両面を、熱可塑性樹脂か
らなる２つの外装用のケースの端面により挟み込
み、上記端子フレーム連結部間に通電して、該端
子フレームの基板部を発熱させることにより、両
ケースの端面を互いに溶着して、両ケース内に電
子部品素子を封入するようにしたことを特徴とす
る電子部品のケース収容方法。[Scope of Claims] 1. A plurality of terminal frames each having a frame-shaped substrate portion, a plurality of lead terminals and a pair of current-carrying terminals protruding outward from the substrate portion, and having the same polarity of adjacent terminal frames. An electronic component element formed by integrally forming current-carrying terminals connected to each other by a terminal frame connection part, and providing an electronic component element element on the substrate part of the terminal frame. 2 A plurality of terminal frames each having a frame-shaped board part, a plurality of lead terminals and a pair of current-carrying terminals protruding outward from the board part, and the current-carrying terminals of the same polarity of adjacent terminal frames are connected to each other by the terminal frame. integrally formed in a shape connected at a connecting part, an electronic component element element is provided on the board part of the terminal frame, and both sides of the board part of the terminal frame are sandwiched between the end faces of two exterior cases made of thermoplastic resin, The end faces of both cases are welded to each other by applying electricity between the terminal frame connecting parts to generate heat in the board part of the terminal frame, thereby enclosing an electronic component element in both cases. How to store electronic components in cases.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25339584A JPS60149156A (en) | 1984-11-29 | 1984-11-29 | Electronic component element and encasing method for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25339584A JPS60149156A (en) | 1984-11-29 | 1984-11-29 | Electronic component element and encasing method for electronic component |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57128466A Division JPS5918663A (en) | 1982-07-22 | 1982-07-22 | Method of containing electronic component into case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60149156A JPS60149156A (en) | 1985-08-06 |
| JPH0315820B2 true JPH0315820B2 (en) | 1991-03-04 |
Family
ID=17250770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25339584A Granted JPS60149156A (en) | 1984-11-29 | 1984-11-29 | Electronic component element and encasing method for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60149156A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6248050A (en) * | 1985-08-28 | 1987-03-02 | Seiei Kosan Kk | Packaging method for semiconductor device or the like |
-
1984
- 1984-11-29 JP JP25339584A patent/JPS60149156A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60149156A (en) | 1985-08-06 |
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