JPH0148658B2 - - Google Patents

Info

Publication number
JPH0148658B2
JPH0148658B2 JP57117315A JP11731582A JPH0148658B2 JP H0148658 B2 JPH0148658 B2 JP H0148658B2 JP 57117315 A JP57117315 A JP 57117315A JP 11731582 A JP11731582 A JP 11731582A JP H0148658 B2 JPH0148658 B2 JP H0148658B2
Authority
JP
Japan
Prior art keywords
frame
terminal
cases
exterior
element body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57117315A
Other languages
Japanese (ja)
Other versions
JPS598399A (en
Inventor
Takeshi Nakamura
Koji Nishama
Satoshi Matsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP11731582A priority Critical patent/JPS598399A/en
Publication of JPS598399A publication Critical patent/JPS598399A/en
Publication of JPH0148658B2 publication Critical patent/JPH0148658B2/ja
Granted legal-status Critical Current

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  • Manufacture Of Switches (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Casings For Electric Apparatus (AREA)

Description

【発明の詳細な説明】 本発明は機械的振動を行う圧電共振子等の電子
部品の素子本体を中空の外装ケースに収容する電
子部品のケース収容方法およびそのケース構造に
関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a case housing method for an electronic component, in which an element body of an electronic component such as a piezoelectric resonator that performs mechanical vibration is housed in a hollow exterior case, and a case structure thereof.

従来より、集積回路等の電子部品においては、
エポキシ系樹脂を型に流し込むトランスフアーモ
ールド等により外装が行われているが、機械的振
動を許容する空間を内部に形成しなければならな
い圧電共振子や音片等の電子部品の素子本体をト
ランスフアーモールドにより外装することは困難
であつた。
Traditionally, in electronic components such as integrated circuits,
External packaging is done using transfer molding, etc. in which epoxy resin is poured into a mold, but the element bodies of electronic components such as piezoelectric resonators and acoustic bars, which require a space inside to allow mechanical vibration, are formed using transfer molding. It was difficult to cover it with armor.

そこで、この種の電子部品の素子本体を外装す
るには、予め中空構造に成形した一対のセラミツ
ク等の外装ケースを用いて、低融点ガラスや接着
剤等によつてこれら外装ケースを貼り合せるよう
にしていたが、電子部品が小さくなつて外装ケー
スが小形化すると、低融点ガラスや接着剤の塗布
が困難になるばかりでなく、外装ケース同志の位
置合せ精度も悪くなり、接着剤の硬化時間も長
く、硬化温度も高く、生産効率も低いといつた欠
点を有していた。また端子がデユアルインライン
形状であるかシングルインライン形状であるかに
よつて外装ケース及び端子フレームも別構造とな
り、外装ケース及び端子フレームの共通化も困難
であつた。
Therefore, in order to package the element body of this type of electronic component, it is recommended to use a pair of ceramic or other outer cases that have been formed into a hollow structure in advance, and then bond these outer cases together using low-melting glass or adhesive. However, as electronic components become smaller and outer cases become smaller, it not only becomes difficult to apply low-melting glass and adhesives, but also the accuracy of alignment between the outer cases deteriorates, and the curing time of the adhesive becomes shorter. The disadvantages were that the process was long, the curing temperature was high, and the production efficiency was low. Furthermore, the outer case and terminal frame have different structures depending on whether the terminal has a dual in-line shape or a single in-line shape, and it has been difficult to standardize the outer case and the terminal frame.

本発明の目的は、素子本体が機械的振動を行な
う電子部品の組立の簡単化および組立精度の向上
を図り、デユアルインラインとシングルインライ
ンの端子形状に対して外装ケースの共用化を図る
ことである。
The purpose of the present invention is to simplify the assembly of electronic components whose element bodies undergo mechanical vibration and improve assembly accuracy, and to enable common use of the outer case for dual-in-line and single-in-line terminal shapes. .

本発明のいま一つの目的は、端子フレームをそ
のまま電子部品のリード端子として利用すること
ができ、電子部品の素子本体を外装ケースに収容
すると同時にリード端子の取付が行なえるように
することである。
Another object of the present invention is to enable the terminal frame to be used as it is as a lead terminal for an electronic component, and to allow the lead terminal to be attached at the same time as the element body of the electronic component is housed in an exterior case. .

本発明を要約すれば、各々が熱可塑性樹脂から
なり、合体されることにより内部に電子部品の素
子本体を収容する凹部を形成する上下一対の外装
ケースと、これら外装ケースの各凹部の開口周縁
に沿つて伸長して伸びる部分と外装ケースの外部
に二又状に突出する複数の突出部分とを含んでル
ープ状に連続した枠体とこの枠体の内向に引き出
されて素子本体を支持するとともに、素子本体の
各電極に導電的に接続されてなる複数の支持片と
上記枠体の外向に引き出されてなる複数のリード
端子とからなる端子フレームとを用意し、端子フ
レームの枠体の両面に上下一対の外装ケースの各
開口端面を夫々合致させて上記枠体を両外装ケー
ス間に介装し、上記端子フレームを発熱させて上
記外装ケースをその開口端面を溶融させて互いに
溶着した後、素子本体の各電極と対応するリード
端子とを電気的に導通させ、他とは遮断するよう
に、上記枠体の外装ケースから二又状に突出する
部分を切断して上記ループ状の枠体を分離するこ
とを特徴とする電子部品のケース収容方法であ
る。
To summarize the present invention, there is provided a pair of upper and lower exterior cases, each of which is made of thermoplastic resin and which, when combined, forms a recess for accommodating the element body of an electronic component therein, and an opening periphery of each recess of these exterior cases. A frame body that is continuous in a loop shape, including a portion that extends along the outer case, and a plurality of protruding portions that protrude in a bifurcated manner to the outside of the outer case, and a frame body that is pulled inward from this frame body to support the element body. At the same time, a terminal frame consisting of a plurality of support pieces conductively connected to each electrode of the element body and a plurality of lead terminals drawn outward from the frame is prepared, and the frame of the terminal frame is The opening end faces of a pair of upper and lower exterior cases were aligned with each other on both sides, and the frame was interposed between the two exterior cases, and the terminal frame was made to generate heat to melt the opening end faces of the exterior cases and weld them together. After that, the loop-shaped portion is cut by cutting the fork-shaped portion of the frame body that protrudes from the exterior case so that each electrode of the element body and the corresponding lead terminal are electrically connected and disconnected from the others. This is a method of accommodating an electronic component case, which is characterized by separating the frame.

また、本発明は、各々が熱可塑性樹脂からな
り、合体されることにより内部に電子部品の素子
本体を収容する凹部を形成する上下一対の外装ケ
ースと、これら外装ケースの各凹部の開口周縁に
沿つて伸長して伸びる部分と外装ケースの外部に
二又状に突出する複数の突出部分とを含んでルー
プ状に連続した枠体とこの枠体の内向に引き出さ
れて素子本体を支持するとともに、素子本体の各
電極に導電的に接続されてなる複数の支持片と上
記枠体の外向に引き出されてなる複数のリード端
子とからなる端子フレームとを備え、端子フレー
ムの枠体の両面に上下一対の外装ケースの各開口
端面が夫々合致して上記枠体が両外装ケース間に
介装され、上記端子フレームの発熱により上記外
装ケースがその開口端面が互いに溶着されてお
り、素子本体の各電極と対応するリード端子とが
電気的に導通し、他とは遮断されて、上記枠体の
外装ケースから二又状に突出する部分が切断され
て上記ループ状の枠体が分離されてなる電子部品
である。
The present invention also provides a pair of upper and lower exterior cases, each of which is made of thermoplastic resin and which, when combined, forms a recess for accommodating an element body of an electronic component therein; A frame body continuous in a loop shape including a portion extending along the outer case and a plurality of protruding portions protruding in a fork shape to the outside of the outer case; , a terminal frame consisting of a plurality of support pieces conductively connected to each electrode of the element body and a plurality of lead terminals drawn outward from the frame, and a terminal frame on both sides of the frame of the terminal frame. The opening end surfaces of the upper and lower pair of exterior cases are aligned with each other, and the frame is interposed between the two exterior cases, and the opening end surfaces of the exterior cases are welded to each other by the heat generated by the terminal frame. Each electrode is electrically connected to the corresponding lead terminal, and is cut off from the others, and the forked portion of the frame body that protrudes from the exterior case is cut to separate the loop-shaped frame body. It is an electronic component.

以下、添付図面を参照して本発明の実施例を説
明する。
Embodiments of the present invention will be described below with reference to the accompanying drawings.

第1図に本発明を音片振動子に適用した実施例
を示す。
FIG. 1 shows an embodiment in which the present invention is applied to a vibrator.

第1図において、11は音片振動子、12は該
音片振動子11を支持する端子フレーム、13,
14は上記音片振動子を収容する外装ケースであ
る。
In FIG. 1, 11 is a vibrator, 12 is a terminal frame that supports the vibrator 11, 13,
Reference numeral 14 denotes an exterior case that houses the above-mentioned vibrator.

上記音片振動子11は、エリンバー等の恒弾性
金属板を打ち抜いて、四角形状を有する枠体15
の内部に、結合子16a〜16dにより、長方形
状の音片振動子本体17をその振動の節部で支持
し、該音片振動子本体17の一方の主面と結合子
16a、そして結合子16aに連らなる枠体15
の一部に酸化亜鉛(ZnO)等の圧電材料からなる
圧電膜18を形成し、この圧電膜18の上に駆動
電極膜19a、リード電極膜19b、引出電極膜
19cを形成したものである。リード電極膜19
b、引出電極膜19c下の圧電膜18は絶縁層と
して機能する。
The above-mentioned sound piece vibrator 11 has a frame 15 having a rectangular shape, which is formed by punching a constant elastic metal plate such as Elinvar.
A rectangular sound piece vibrator main body 17 is supported at its vibration nodes by connectors 16a to 16d, and one main surface of the sound piece vibrator body 17, the connector 16a, and the connector Frame body 15 connected to 16a
A piezoelectric film 18 made of a piezoelectric material such as zinc oxide (ZnO) is formed on a part of the electrode, and a drive electrode film 19a, a lead electrode film 19b, and an extraction electrode film 19c are formed on this piezoelectric film 18. Lead electrode film 19
b, the piezoelectric film 18 under the extraction electrode film 19c functions as an insulating layer.

一方、端子フレーム12は、上記音片振動子1
1を収容する四角形状の凹部13a,14aを有
する上下一対の外装ケース13,14の上記凹部
13a,14aの開口端面の周面13b,14b
内に沿うほゞ四角形のループ形状を有し、上記音
片振動子11を支持する支持片20a〜20dを
回転対称に突出させる一方、その4つのコーナ部
からは、外装ケース13,14の開口端面の上記
周面13b,14bから外部に突出する大略U字
形状を有する突出部21a,21b,21c,2
1dを夫々突出させ、これら各突出部21a,2
1b,21c,21dからリード端子22a,2
2b,22c,22dを夫々突出させている。
On the other hand, the terminal frame 12
Peripheral surfaces 13b, 14b of the opening end surfaces of the recesses 13a, 14a of the pair of upper and lower exterior cases 13, 14 having square recesses 13a, 14a for accommodating the
Support pieces 20a to 20d, which have a substantially rectangular loop shape along the inside and support the acoustic bar vibrator 11, protrude rotationally symmetrically, while the openings of the exterior cases 13 and 14 extend from their four corners. Projections 21a, 21b, 21c, 2 having a roughly U-shape projecting outward from the peripheral surfaces 13b, 14b of the end faces.
1d respectively, and these respective protrusions 21a, 2
Lead terminals 22a, 2 from 1b, 21c, 21d
2b, 22c, and 22d are made to protrude, respectively.

外装ケース13,14はポリカーボネート、ポ
リアセタール、ポリエチレン等の熱可塑性樹脂を
一方の主面に上記凹部13a,14bを有する四
角形の板状に成形したものである。
The outer cases 13 and 14 are made of thermoplastic resin such as polycarbonate, polyacetal, polyethylene, etc. and are molded into rectangular plate shapes having the recesses 13a and 14b on one main surface.

上記外装ケース13,14間には、第2図に示
すように、端子フレーム12の支持片20b〜2
0dを音片振動子11の枠体15に溶接、導電接
着剤(図示せず。)等で接続固定するとともに、
支持片20aを音片振動子本体17のリード電極
膜19bに、はんだ、ボンデイング、導電接着
剤、単なる接触等によつて接続した上記端子フレ
ーム12を介装し、その状態で、上記端子フレー
ム12に電流を流して発熱させるか誘導加熱を行
つて上記端子フレーム12の温度を上昇させる。
Between the outer cases 13 and 14, as shown in FIG.
0d is welded to the frame 15 of the vibrator 11, connected and fixed with conductive adhesive (not shown), etc.
The terminal frame 12 in which the supporting piece 20a is connected to the lead electrode film 19b of the transducer main body 17 by soldering, bonding, conductive adhesive, mere contact, etc. is interposed, and in this state, the terminal frame 12 The temperature of the terminal frame 12 is raised by passing a current through it to generate heat or by performing induction heating.

端子フレーム12が温度上昇すると、外装ケー
ス13,14の開口端面の周面13b,14bの
端子フレーム12との当接部分が溶解する。
When the temperature of the terminal frame 12 increases, the contact portions of the peripheral surfaces 13b and 14b of the open end surfaces of the outer cases 13 and 14 with the terminal frame 12 melt.

その後、上記端子フレーム12の加熱を停止し
て温度を低下させると、上記外装ケース13,1
4は溶解した外装ケース13,14の熱可塑性樹
脂で相互に接着される。
Thereafter, when the heating of the terminal frame 12 is stopped and the temperature is lowered, the outer cases 13, 1
4 are bonded to each other with the melted thermoplastic resin of the outer cases 13 and 14.

次いで、一例ではあるが、上記端子フレーム1
2の各突出部21a〜21dのうち突出部21a
は、一対の脚部21a1,21a2のうち内側の脚部
21a2を第2図に点線で示すように切断し、突出
部21bは、一対の脚部21b1,21b2のうち内
側の脚部21b2を第2図に点線で示すように切断
する。するとリード端子22a,22bと駆動電
極膜19aとが導通し、リード端子22c,22
dと音叉振動子本体17が導通することになる。
Next, as an example, the terminal frame 1
The protrusion 21a among the protrusions 21a to 21d of 2
The inner leg 21a 2 of the pair of legs 21a 1 and 21a 2 is cut as shown by the dotted line in FIG . The leg portion 21b2 is cut as shown by the dotted line in FIG. Then, the lead terminals 22a, 22b and the drive electrode film 19a are electrically connected, and the lead terminals 22c, 22
d and the tuning fork vibrator main body 17 are electrically connected.

上記端子フレーム12の各突出部21a〜21
dを夫々外装ケース14側に直角に折曲し、各リ
ード端子22a〜22dを適当な長さで切断すれ
ば、デユアルインライン形の端子構造を有する音
片振動部品を得ることができる。
Each of the protrusions 21a to 21 of the terminal frame 12
By bending each lead terminal 22a to 22d at a right angle to the outer case 14 side and cutting each lead terminal 22a to 22d to an appropriate length, a vibrating element vibrating component having a dual in-line terminal structure can be obtained.

また、上記のように、端子フレーム12の各突
出部21a〜21dを夫々外装ケース14側に直
角に折曲する前に、端子フレーム12の上記各突
部21a〜21dのうち、外装ケース13,14
の一側に突出する突部たとえば21b,21cを
切除すれば、外装ケース13,14の他側に突出
するリード端子22a,22dにより、シングル
インライン形の端子構造を有する音片振動部品を
得ることができる。
Further, as described above, before bending each of the protrusions 21a to 21d of the terminal frame 12 at a right angle to the exterior case 14 side, among the protrusions 21a to 21d of the terminal frame 12, the exterior case 13, 14
By removing the protrusions 21b and 21c that protrude on one side, lead terminals 22a and 22d that protrude on the other side of the outer cases 13 and 14 make it possible to obtain a vibrating unit having a single in-line terminal structure. Can be done.

上記のようにすれば、共通の形状を有する単純
な外装ケース13,14を使用して、デユアルイ
ンライン形およびシングルインライン形の端子構
造を有する音片振動部品を能率よく組み立てるこ
とができる。
With the above method, it is possible to efficiently assemble vibrating element components having dual-in-line type and single-in-line type terminal structures using simple outer cases 13 and 14 having a common shape.

ちなみに、従来のように、外装ケース13,1
4を接着剤等により接着するには、接着剤によつ
てはかなりの温度と時間を要するが、上記実施例
においては、外装ケース13,14の接着は1秒
ないし10秒で行うことができる。
By the way, as before, the outer case 13,1
Depending on the adhesive, it takes a considerable amount of temperature and time to bond the outer cases 13 and 14 with an adhesive, but in the above embodiment, the outer cases 13 and 14 can be bonded in 1 to 10 seconds. .

なお、上記実施例において、外装フレーム13
は必ずしもループ状である必要はなく、その一部
が切断されたものであつてもよい。
In addition, in the above embodiment, the exterior frame 13
does not necessarily have to be loop-shaped, and may be partially cut.

支持片20c,20dを第3図のようにしても
よい。すなわち、支持片20cは支持片20bと
並行になるよう端子フレーム12から突出させ、
支持片20dは支持片20aと突き合せ位置で端
子フレーム12から突出させる。支持片20a〜
20dを、突出部21a〜21dの一対の脚部の
いずれから突出させるか、また、どの脚部を切断
するかは内部素子の種類やリード端子22a〜2
2dのどれに内部素子の引出部を接続するかによ
つて定まる。
The supporting pieces 20c and 20d may be arranged as shown in FIG. That is, the support piece 20c is made to protrude from the terminal frame 12 so as to be parallel to the support piece 20b,
The support piece 20d is made to protrude from the terminal frame 12 at a position where it butts against the support piece 20a. Support piece 20a~
Which of the pair of legs of the protrusions 21a to 21d the protrusion 20d should protrude from and which leg should be cut depends on the type of internal element and the lead terminals 22a to 22d.
2d to which the lead-out portion of the internal element is connected.

また、本発明は音片振動子11を外装ケース1
3,14に収容する上記実施例に限定されるもの
ではなく、圧電共振子のように機械的振動を行う
素子等内部空間を必要とする素子をケースに収容
する場合に広く適用することができる。
Further, the present invention provides the vibrating unit vibrator 11 in the outer case 1.
The present invention is not limited to the above-mentioned embodiment in which the case is housed in a case, but can be widely applied to cases in which elements that require internal space, such as elements that perform mechanical vibration such as piezoelectric resonators, are housed in the case. .

以上、詳述したことからも明らかなように、本
発明は、熱可塑性樹脂からなる外装ケースをその
間に介装した端子フレームを加熱して相互に溶着
するものであるから、従来の外装ケースの接着の
ように低融点ガラスや接着剤等の塗布を必要とせ
ず、外装ケースに接着剤の塗布部分が不要にな
り、外装ケースが小形化されるとともに、外装ケ
ースの接着作業も非常に容易で接着精度も大巾に
向上させることができる。
As is clear from the detailed description above, the present invention heats and welds together terminal frames with an exterior case made of thermoplastic resin interposed therebetween, which is different from the conventional exterior case. Unlike adhesion, it does not require the application of low-melting point glass or adhesive, and there is no need to apply adhesive on the exterior case, making the exterior case more compact and making the work of gluing the exterior case extremely easy. Adhesion accuracy can also be greatly improved.

また、接着剤等を使用せず、端子フレームの温
度を上昇させて外装ケースを相互に溶着させるよ
うにしているため接着時間も大巾に短縮され、電
子部品の生産能率も大巾に向上させることができ
る。
In addition, because the temperature of the terminal frame is raised to weld the outer cases together without using adhesives, the bonding time is greatly shortened, and the production efficiency of electronic components is also greatly improved. be able to.

さらに、外装ケースの両側にリード端子が突出
するような端子フレームを使用すれば、共通の外
装ケースを使用して、シングルインラインおよび
デユアルインライン等任意の端子構造を有する電
子部品を生産することもできる。
Furthermore, by using a terminal frame with lead terminals protruding from both sides of the outer case, electronic components with arbitrary terminal structures such as single-in-line and dual-in-line can be produced using a common outer case. .

さらにまた、本発明によれば、端子フレームは
電子部品の素子本体の電極を外部に引き出す外部
引き出し端子として機能しているので、端子フレ
ームをそのまま電子部品のリード端子として利用
することができ、電子部品の素子本体を外装ケー
スに収容すると同時にリード端子の取付が行なえ
る電子部品のケース構造を得ることができる。
Furthermore, according to the present invention, the terminal frame functions as an external lead-out terminal for drawing out the electrodes of the element body of the electronic component, so the terminal frame can be used as it is as a lead terminal of the electronic component. It is possible to obtain a case structure for an electronic component in which lead terminals can be attached at the same time as housing the element body of the component in an exterior case.

中空構造のパツケージを必要とする電子部品と
しては、リードスイツチ、リードリレー、バイメ
タル、圧力センサー等応用分野が広い。
Electronic components that require hollow packages have a wide range of applications, including reed switches, reed relays, bimetals, and pressure sensors.

また、電子部品の性格上リード端子、端子フレ
ーム、電子部品素子材料を同一金属体で一体成形
したものでも良い。
Further, due to the nature of the electronic component, the lead terminal, the terminal frame, and the electronic component element material may be integrally molded from the same metal body.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明を音片振動部品のケース収容方
法とそのケース構造に適用した実施例の分解斜視
図、第2図は第1図の音片振動部品の組立説明
図、第3図は端子フレームの平面図である。 11……音片振動子、12……端子フレーム、
13,14……外装ケース(13a,14a……
凹部)、17……音片振動子本体、20a,20
b……支持片。
FIG. 1 is an exploded perspective view of an embodiment in which the present invention is applied to a case housing method for a vibrating unit and its case structure, FIG. 2 is an explanatory diagram of the assembly of the vibrating unit shown in FIG. 1, and FIG. It is a top view of a terminal frame. 11... Sound piece vibrator, 12... Terminal frame,
13, 14...Exterior case (13a, 14a...
recess), 17... sound piece vibrator body, 20a, 20
b...Support piece.

Claims (1)

【特許請求の範囲】 1 各々が熱可塑性樹脂からなり、合体されるこ
とにより内部に電子部品の素子本体を収容する凹
部を形成する上下一対の外装ケースと、これら外
装ケースの各凹部の開口周縁に沿つて伸長して伸
びる部分と外装ケースの外部に二又状に突出する
複数の突出部分とを含んでループ状に連続した枠
体とこの枠体の内向に引き出されて素子本体を支
持するとともに、素子本体の各電極に導電的に接
続されてなる複数の支持片と上記枠体の外向に引
き出されてなる複数のリード端子とからなる端子
フレームとを用意し、端子フレームの枠体の両面
に上下一対の外装ケースの各開口端面を夫々合致
させて上記枠体を両外装ケース間に介装し、上記
端子フレームを発熱させて上記外装ケースをその
開口端面を溶融させて互いに溶着した後、素子本
体の各電極と対応するリード端子とを電気的に導
通させ、他とは遮断するように、上記枠体の外装
ケースから二又状に突出する部分を切断して上記
ループ状の枠体を分離することを特徴とする電子
部品のケース収容方法。 2 各々が熱可塑性樹脂からなり、合体されるこ
とにより内部に電子部品の素子本体を収容する凹
部を形成する上下一対の外装ケースと、これら外
装ケースの各凹部の開口周縁に沿つて伸長して伸
びる部分と外装ケースの外部に二又状に突出する
複数の突出部分とを含んでループ状に連続した枠
体とこの枠体の内向に引き出されて素子本体を支
持するとともに、素子本体の各電極に導電的に接
続されてなる複数の支持片と上記枠体の外向に引
き出されてなる複数のリード端子とからなる端子
フレームとを備え、端子フレームの枠体の両面に
上下一対の外装ケースの各開口端面が夫々合致し
て上記枠体が両外装ケース間に介装され、上記端
子フレームの発熱により上記外装ケースがその開
口端面が互いに溶着されており、素子本体の各電
極と対応するリード端子とが電気的に導通し、他
とは遮断されて、上記枠体の外装ケースから二又
状に突出する部分が切断されて上記ループ状の枠
体が分離されてなる電子部品。
[Scope of Claims] 1. A pair of upper and lower exterior cases, each of which is made of thermoplastic resin and which, when combined, form a recess for accommodating the element body of the electronic component therein, and the opening periphery of each recess of these exterior cases. A frame body that is continuous in a loop shape, including a portion that extends along the outer case, and a plurality of protruding portions that protrude in a bifurcated manner to the outside of the outer case, and a frame body that is pulled inward from this frame body to support the element body. At the same time, a terminal frame consisting of a plurality of support pieces conductively connected to each electrode of the element body and a plurality of lead terminals drawn outward from the frame is prepared, and the frame of the terminal frame is The opening end faces of a pair of upper and lower exterior cases were aligned with each other on both sides, and the frame was interposed between the two exterior cases, and the terminal frame was made to generate heat to melt the opening end faces of the exterior cases and weld them together. After that, the loop-shaped portion is cut by cutting the fork-shaped portion of the frame that protrudes from the exterior case so that each electrode of the element body and the corresponding lead terminal are electrically connected, and the others are cut off. A method for accommodating a case for electronic components, characterized by separating a frame. 2 A pair of upper and lower exterior cases, each made of thermoplastic resin, which when combined form a recess for accommodating the element body of the electronic component therein; A continuous frame body in a loop shape including an extending portion and a plurality of protruding portions protruding in a bifurcated manner to the outside of the exterior case, and a frame body that is pulled inward from this frame body to support the element body, and each of the element body A terminal frame includes a plurality of support pieces conductively connected to the electrodes and a plurality of lead terminals drawn outward from the frame, and a pair of upper and lower exterior cases are provided on both sides of the frame of the terminal frame. The frame body is interposed between the two outer cases so that the opening end surfaces of the terminal frames match each other, and the opening end surfaces of the outer cases are welded to each other due to the heat generated by the terminal frame, and the opening end surfaces of the outer cases are welded to each other, and the opening end surfaces of the outer cases correspond to each electrode of the element body. An electronic component in which the loop-shaped frame is separated by electrically conducting with the lead terminal and being cut off from the others, and by cutting off a portion of the frame that protrudes in a fork shape from the exterior case.
JP11731582A 1982-07-05 1982-07-05 Method of containing electronic part in case and case structure thereof Granted JPS598399A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11731582A JPS598399A (en) 1982-07-05 1982-07-05 Method of containing electronic part in case and case structure thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11731582A JPS598399A (en) 1982-07-05 1982-07-05 Method of containing electronic part in case and case structure thereof

Publications (2)

Publication Number Publication Date
JPS598399A JPS598399A (en) 1984-01-17
JPH0148658B2 true JPH0148658B2 (en) 1989-10-20

Family

ID=14708703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11731582A Granted JPS598399A (en) 1982-07-05 1982-07-05 Method of containing electronic part in case and case structure thereof

Country Status (1)

Country Link
JP (1) JPS598399A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4894784B2 (en) 2008-02-27 2012-03-14 三菱電機株式会社 Semiconductor device and manufacturing method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49113158A (en) * 1973-03-02 1974-10-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49113158A (en) * 1973-03-02 1974-10-29

Also Published As

Publication number Publication date
JPS598399A (en) 1984-01-17

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