JPH087696Y2 - Composite electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a composite electronic component in which a resonator and a capacitor are integrally provided.

[Conventional technology]

Conventionally, as a composite electronic component used in a Colpitts type oscillation circuit or the like, for example, a resonator with a built-in capacitor disclosed in JP-A-62-67914 is known. That is, this resonator with a built-in capacitor has a resonator referred to as a thickness longitudinal vibration mode structure and a capacitor as a load capacitance integrally formed on a single ceramic substrate, and is formed at the upper ends of the terminals at both ends. The above-mentioned substrate is held by a holding portion having a substantially U-shaped cross section, and is electrically connected by soldering or the like.

[Problems to be solved by the device]

However, in the case of the composite electronic component having the above structure, the ceramic substrate is vertically mounted on the upper portion of the terminal, and the resonator and the capacitor are provided in parallel in the vertical direction on the ceramic substrate. There is a problem that the total height becomes higher than that of the electronic component, and as a result, when the composite electronic component is mounted on the printed board, the thickness of the entire printed board including the electronic component increases. In addition, since the resonator and the capacitor coexist in close proximity to each other on the ceramic substrate, the polarization process becomes complicated, and especially when the ceramic substrate is downsized to reduce the height, the polarization process becomes more difficult. There is.

The present invention has been made in view of the above problems, and an object thereof is to provide a composite electronic component which can realize a low profile without downsizing each element and which does not hinder polarization processing. .

[Means for solving the problem]

In order to achieve the above object, the composite electronic component of the present invention has vibrating electrode portions facing each other at the central portions of the first and second main surfaces of the piezoelectric ceramic substrate, and the vibrating electrode portions are formed at both end portions of the ceramic substrate. An energy trap type thickness extensional vibration mode resonator having a terminal electrode portion electrically connected to the vibrating electrode portion and a dielectric substrate having substantially the same outer shape as that of the ceramic substrate are provided, and a first main surface of the dielectric substrate is provided. In addition to forming two capacitor electrodes, terminal electrode portions that are electrically connected to the respective capacitor electrodes are formed at both end portions of the dielectric substrate, and the capacitor electrode faces the central portion of the second main surface of the dielectric substrate. A capacitor unit having a plurality of capacitor electrodes and a first main surface of the resonator and a first main surface of the capacitor unit, which are closely attached and sandwiched between the first main surface of the resonator and the vibration electrode portion of the first main surface of the resonator. Form a cavity around An insulating spacer having a window hole for the both sides and a width dimension in both sides smaller than the ceramic substrate and the dielectric substrate; and three terminals. Two terminals at both ends of the terminals are provided. Are opposed to each other, and holding portions having a substantially U-shaped cross section are formed, and both ends of the resonator and the capacitor unit are fitted and held by these holding portions. Solder is supplied to the inside of the holding portion and the central terminal is The solder, which is connected to the condesan electrode on the second main surface of the capacitor unit and is supplied to the holding portion, flows into the groove defined by the resonator and both end portions of the capacitor unit and the insulating spacer, and the solder of the resonator is removed. The terminal electrode portion of the first main surface, the terminal electrode portion of the first main surface of the capacitor unit, and the holding portion are electrically connected to each other, and the periphery of the resonator and the capacitor unit is a vibrating electrode on the second main surface of the resonator. Department Leaving a cavity around characterized in that it is sealed with an insulating resin.

[Action]

That is, the resonator and the capacitor unit are formed on different substrates, and the substrates are stacked and held by the holding portions having a substantially U-shaped cross section, and the peripheries of these elements are integrally formed with an insulating resin. It is sealed. Therefore, as compared with the conventional resonator and the capacitor unit integrally formed on one substrate, the height can be reduced by the amount of the capacitor unit, and the resonator and the capacitor unit are formed on separate substrates. Therefore, there is no problem in polarization processing.

Further, only by superposing the resonator and the capacitor unit, there is a problem that both elements are short-circuited and the sealing resin enters the vibrating electrode portion of the resonator to hinder vibration. Since an insulating spacer is interposed between the electrodes, the electrodes of the resonator and the electrodes of the capacitor unit are reliably insulated, and a cavity is formed in the vibration electrode section on one side of the resonator to prevent vibration of the vibration electrode section. Is not disturbed. A cavity is formed in the vibrating electrode portion on the other surface of the resonator with the sealing resin by a known method.

Furthermore, since the piezoelectric ceramic substrate of the resonator and the dielectric substrate of the capacitor unit have almost the same outer shape,
It is advantageous in manufacturing. That is, the mother substrates of the piezoelectric ceramic substrate and the dielectric substrate are attached to each other via the spacer, and then both substrates are cut at the same time,
It becomes possible to manufacture the composite element very efficiently.

Since the width dimension of the spacer is smaller than the width dimension of the resonator and the capacitor unit, a part of the solder forms a groove by the insulating spacers and both end portions of the resonator and the capacitor unit. When solder is poured into the holding portion with both ends of the resonator and the capacitor unit fitted and held in the holding portions provided in the terminals at both ends and having a substantially U-shaped cross section, part of the solder flows into the groove. Therefore, the terminal electrode portion on the first main surface of the resonator, the terminal electrode portion on the first main surface of the capacitor unit, and the holding portion are surely electrically connected to each other.

〔Example〕

1 to 3 show an example of a composite electronic component according to the present invention, more specifically, a resonator with a built-in capacitor used in a Colpitts type oscillation circuit.

In the drawing, the resonator 1 and the capacitor unit 10 are arranged parallel to each other in the plate thickness direction, that is, the front-back direction,
In the state where the three terminals 20, 30, 40 are connected, the periphery of these elements is integrally sealed with an insulating resin 50.

The resonator 1 has an energy confinement type thickness longitudinal vibration mode structure, and a piezoelectric substrate 2 made of a rectangular thin plate ceramic, an electrode 3 provided on the front surface thereof, and the electrode 3 on the back surface are located at 180 ° symmetrical positions. And an electrode 4 of the same shape provided on the. The electrode 3 on the front surface side has a circular vibrating portion (vibrating electrode portion) 3a located in the center of the substrate, and a terminal portion (terminal electrode portion) 3b formed at one side edge portion of the substrate so as to wrap around from the front surface to the back surface. , 2 drawers 3c connecting both parts 3a, 3b
Similarly, the electrode 4 on the back side is also composed of a vibrating portion (vibrating electrode portion) 4a, a terminal portion (terminal electrode portion) 4b, and a lead-out portion 4c. Although the terminal portions 3b and 4b are formed so as to wrap around from the one main surface side to the other main surface side of the piezoelectric substrate 2, the present invention is not limited to this. Further, by providing two lead portions 3c and 4c for connecting the vibrating portions 3a and 4a and the terminal portions 3b and 4b, it is possible to prevent disconnection of the lead portions 3c and 4c due to the solder leaching phenomenon. In addition, the electrodes 3 and 4 have the same shape and the substrate 2
Since they are formed at 180 ° symmetrical positions on the front and back sides, there is no directivity and assembly by an automatic machine is easy.

The spacer 5 is made of a rectangular frame-shaped insulating material, and is sandwiched between the resonator 1 and the capacitor unit 10 to electrically insulate them from each other. As the spacer 5, for example, a resin plate or a rubber plate may be used, but an adhesive, solder resist ink, or the like may be used. A window hole 5a is formed in the center of the spacer 5, and when the spacer 5 is sandwiched between the resonator 1 and the capacitor unit 10, the window hole 5a is formed.
5a forms a cavity 60 around the vibrating portion 3a of the front surface side electrode 3 as shown in FIG. The width W ₃ of the spacer 5 is smaller than the widths W ₁ and W ₂ of the resonator 1 and the capacitor unit 10.

The capacitor unit 10 includes a dielectric substrate 11 made of a rectangular thin plate ceramic or the like.
Has the same contour shape as that of the piezoelectric substrate 2. A strip-shaped capacitor electrode 12 is formed vertically in a region of about 1/3 in the center of the front surface of the dielectric substrate 11, and a strip-shaped capacitor electrode 13 is formed laterally opposite the upper and lower ends of the back surface. 1
It is composed of 4 and, and the electrode 12 and 13 facing each other, and the electrode
The opposing part of 12,14 has a structure of two capacitors. Then, the terminal portion (terminal electrode portion) 13 of the electrodes 13 and 14
The a and 14a are formed so as to wrap around from the back surface of the dielectric substrate 11 to the front surface side. Although the terminal portions 13a and 14a are formed so as to extend from one main surface of the dielectric substrate 11 to the other main surface,
It is not limited to this.

As shown in FIG. 2, the three terminals 20, 30, 40 are punched from the hoop material by a press and then bent into a desired shape. The input and output terminals 20, 30 on both sides are It has a symmetrical shape. At the upper ends of the input / output terminals 20 and 30, holding portions 21 and 31 having a U-shaped cross section are formed to face each other.
Extends directly above. The stopper portions 22 and 32 bent at right angles to the holding portions 21 and 31 prevent the resonator 1 and the capacitor unit 10 from coming out downward when the holding portions 21 and 31 are inserted. The ends of the stoppers 22 and 32 are bent downward, and the leads 23 and 33 are integrally formed at the tips thereof. A holding piece 41 extending upward is formed at substantially the same position as the front surfaces of the holding portions 21 and 31 at the upper end portion of the central grounding terminal 40, and the lower surface of the holding piece 41 is provided with the lower surface of the capacitor unit 10. A horizontal stopper portion 42 that regulates the position is bent, and a lead portion 43 that extends downward is integrally formed at the tip end portion thereof.

A method for assembling the resonator with a built-in capacitor having the above configuration will be described. First, the resonator 1 and the capacitor unit 10 are superposed and bonded with the spacer 5 interposed therebetween. for that reason,
Between the resonator 1 and the capacitor 10, there is a window hole for the spacer 5.
A cavity 60 is formed by 5a, and a groove 6 is formed between both ends of the resonator 1 and the capacitor unit 10 (see FIG. 3). Next, the both ends of both the bonded substrates are put in, and the grooves 21a of the holding portions 21 and 31 formed on the output terminals 20 and 30,
Insert into 31a. At this time, the bottom surface of both elements 1 and 10 is
The position is regulated by hitting the stopper portions 22, 32, 42 of 0, 40.
In this manner, with the both ends of the resonator 1 and the capacitor unit 10 inserted and held in the holding portions 21 and 31, the solder 7 is poured into the grooves 21a and 31a, so that the electrodes of the holding portions 21 and 31 and the resonator 1 are Terminals 3b, 4b of 3, 4 and electrodes of the capacitor unit 10
The terminal portions 13a and 14a of 13, 14 are electrically connected. That is, a part of the solder 7 flows into the groove 6, and the terminal portion 3b of the resonator 1 and the terminal portions 13a and 14a of the capacitor unit 10 which are opposed to each other with a minute gap are electrically connected by the solder 7. Then, the common electrode 12 of the capacitor unit 10 is connected to the holding piece 41 of the grounding terminal 40 with the solder 9.

After the assembly is completed in this way, the periphery of the terminals 20, 30, 40 is sealed with the insulating resin 50, leaving only the lead portions 23, 33, 44. At this time, a cavity 60 is formed around the vibrating portion 3a of the front surface side electrode 3 of the resonator 1 by the window hole 5a of the spacer 5,
Since the cavity 61 (see FIG. 3) is also formed around the vibrating portion 4a of the back surface side electrode 4, the thickness longitudinal vibration of the resonator 1 is not hindered. The method of forming the cavity 61 on the back surface side is, for example, solid or semi-solid at room temperature such as wax or paraffin in advance around the vibrating portion 4a, and easily softens when heated,
A material that melts at a relatively low temperature is attached, and insulating resin 50
During the sealing of or after the sealing, the wax 61 is melted by the above-mentioned wax or paraffin and absorbed by the insulating resin 50 (Japanese Patent Publication No. 45-22384).
Can be formed.

As in the above embodiment, the resonator 1 and the capacitor unit
Since 10 and 10 are held by the holding portions 21 and 31 with the spacer 5 sandwiched therebetween, the two are arranged in close proximity to each other, and the height dimension can be reduced, and the thickness is not so large. Further, since the resonator 1 and the capacitor unit 10 are temporarily held integrally by the holding portions 21 and 31, there is an advantage that workability such as soldering by an automatic machine is improved.

In addition, if the capacitor unit is formed in substantially the same shape as the resonator as in the embodiment, the manufacturing efficiency is improved, the positional deviation during assembly is small, the area of the dielectric substrate is large, and the thickness can be freely selected. Therefore, there is an advantage that the load capacity can be easily adjusted.

In the above embodiment, the terminal portions 3b and 4b of the resonator 1 are formed so as to wrap around to the other main surface side via both end surfaces, but even in this case, the electrode film thickness at the edge portion of the piezoelectric substrate 2 is very large. Not only is it thin and the conduction reliability is low, but the formation of the wrap-around electrode as described above causes an increase in manufacturing cost. The same applies to the terminal portions 13a and 14a of the capacitor electrodes 13 and 14. However, in the present invention, the width W _{3 of the} spacer 5 is
Is smaller than the widths W ₁ and W _{2 of} the resonator 1 and the capacitor unit 10 so that the groove 6 into which the solder 7 flows is formed between the resonator 1 and the capacitor unit 10. Even if it does not wrap around, the terminals 3b and 4b of the resonator 1 and the terminals 13a and 14a of the capacitor unit 10 can be surely conducted.

[Effect of device]

As is clear from the above description, according to the present invention, the resonator and the capacitor unit are superposed, and both elements are held together in the holding portion of the terminal, so that the total height is lower than the conventional structure by the amount of the capacitor unit. can do. Moreover, since each element is formed on each substrate and both are separated, there is no problem in polarization processing.

Further, since the present invention sandwiches the resonator and the capacitor unit with the spacer in between, insulation between the electrodes can be achieved, and a cavity is easily formed in the vibrating electrode portion on one side of the resonator. There is no possibility that the resin will go around the vibrating electrode portion when the resin is sealed.

Furthermore, since both ends of the superposed boards are held by the U-shaped holding portions of the terminals on both ends, electrical connection can be made by pouring solder into these holding portions, and the number of connection steps is small. , Connection reliability is also high.

In particular, by making the width of the spacer smaller than that of the resonator and the capacitor unit, a groove was provided between both ends of the resonator and the capacitor unit, and solder was allowed to flow into this groove. The terminal portion of the unit can be surely conducted.

Since the external shape of the capacitor unit is almost the same as that of the resonator, the composite element is manufactured using a method in which the mother board of the resonator and the mother board of the capacitor unit are bonded together via a spacer and then cut. The advantage is that productivity can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of an example of a composite electronic component according to the present invention,
2 is an exploded perspective view thereof, and FIG. 3 is a sectional view taken along line III-III of FIG. 1 ... Resonator, 3,4 ... Electrode, 3a, 4a ... Vibrating part (vibrating electrode part), 3b, 4b ... Terminal part (terminal electrode part), 5 ... Spacer,
6 ... Groove, 7, 8 ... Solder, 10 ... Capacitor unit, 12, 13, 1
4 ... Capacitor electrodes, 13a, 14a ... Terminal part (terminal electrode part),
20,30 ... Input / output terminals, 21,31 ... Holding part, 40 ... Grounding terminal, 50 ... Insulating resin, 60,61 ... Cavity.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-60-123120 (JP, A) JP-A-62-67914 (JP, A) JP-A-61-218213 (JP, A) Actual development Sho-59- 25830 (JP, U) Actually open 62-146316 (JP, U) Actually public 50-26260 (JP, Y1)

Claims (1)

[Scope of utility model registration request] 1. A piezoceramic substrate is provided with vibrating electrode portions facing each other in the central portions of the first and second main surfaces, and terminal electrode portions which are electrically connected to the respective vibrating electrode portions are formed at both end portions of the ceramic substrate. The energy trapping type thickness extensional vibration mode resonator and the dielectric substrate having substantially the same outer shape as the ceramic substrate are formed. Two capacitor electrodes are formed on the first main surface of the dielectric substrate, and A capacitor unit in which terminal electrode portions that are electrically connected to the respective capacitor electrodes are formed on both end portions of the body substrate, and one capacitor electrode facing the capacitor electrode is formed in the central portion of the second main surface of the dielectric substrate; A window hole which is tightly sandwiched between the first main surface of the resonator and the first main surface of the capacitor unit and forms a cavity around the vibrating electrode section of the first main surface of the resonator. And has width in both directions Is provided with an insulating spacer smaller than the ceramic substrate and the dielectric substrate, and three terminals. Two terminals at both ends of the terminals are provided with opposed holding portions having a substantially U-shaped cross section. , Both ends of the resonator and the capacitor unit are fitted and held in these holding parts, solder is supplied to the inside of the holding parts, and the central terminal is connected to the capacitor electrode on the second main surface of the capacitor unit, The solder supplied to the holding portion flows into the grooves defined by both end portions of the resonator and the capacitor unit and the insulating spacer, and the terminal electrode portion of the first main surface of the resonator and the first portion of the capacitor unit. The terminal electrode portion and the holding portion on the main surface are electrically connected to each other, and the periphery of the resonator and the capacitor unit is made of an insulating resin, leaving a cavity around the vibration electrode portion on the second main surface of the resonator. Complex electronic device characterized in that it is sealed.