JPS6359012A - Composite electronic component - Google Patents

Abstract

PURPOSE:To attain miniaturization by arranging plural electronic components side by side in the broadwise direction so as to reduce the height. CONSTITUTION:A resonator element 11 and a capacitor element 12 are overlapped in the broadwise direction so as to arrange the both side by side at a prescribed interval by abutting projections 14, 14 and an insulation film 16 into contact with each other. Holders 17a, 18a are formed to the inner end of lead terminals 17, 18 in a form whose plane view is nearly 'U' shape in a recessed way. The inner end of the lead terminals 17, 18, 19 and the capacitor element 12 and the resonator element 11 are sealed by resin by using an outer package material 20. Since plural electronic components are arrnaged side by side in the broadwise direction in this way, the height of the composite electronic components is lowered remarkably than a conventional one and the height is nearly equal to the heigh of the single electronic component and the composite electronic component is miniaturized.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a composite electronic component composed of a plurality of plate-shaped electronic component elements.

<Prior Art> Conventionally, as an example of this type of composite electronic component, there has been an optical pendulum 30 with built-in load capacitance as shown in FIG. This optical pendulum 30 with built-in load capacitance includes a resonator element 31 and a capacitor element 32 as plate-shaped electronic component elements.
are arranged in parallel in the width direction, and both elements 31.
32 has a structure in which the periphery thereof is sealed with an exterior material 33.

Both ends of one resonator element 31 are held by holding parts 34a and 35a formed by bending the inner ends of input/output lead terminals 34 and 35, and counter electrodes formed on the resonator element 31 31a and 31b are electrically connected to holding parts 34a and 35a, respectively. Capacitor electrodes 32a and 32b formed at both ends of the other capacitor element 32 are connected to the intermediate portions of the lead terminals 34 and 35 in the longitudinal direction, respectively, and a ground electrode 32c formed on the capacitor element 32 is connected to a grounding electrode 32c. The upper end of the lead terminal 36 is connected.

The outer ends of each lead terminal 34, 35, and 36 are led out of the exterior material 33, and the equivalent circuit of such an optical pendulum 30 with a built-in load capacitor is as shown in FIG. .

<Problems to be Solved by the Invention> Incidentally, in a composite electronic component such as the optical pendulum 30 with built-in load capacitance described above, a plurality of (two in the figure) electronic component elements, that is, a resonator element 31 and Since the capacitor element 32 is arranged in parallel with the capacitor element 32 in the width direction, when it is incorporated into a circuit board, its height is higher than that of other electronic components. Therefore, there has been a strong desire to reduce the height and size of such composite electronic components.

In view of this need, the present invention aims to provide a composite electronic component that can be made smaller by reducing its height.

Means for Solving the Problems> In order to solve these problems, the present invention provides a composite electronic component consisting of a plurality of plate-shaped electronic component elements, each of which is connected to both ends of the electronic component element. A pair of leads are provided, a recessed holding part is formed in the inner end of the lead, and the electronic component element is inserted between these holding parts in a state where they overlap each other in the thickness direction. be.

<Function> According to the above configuration, since multiple electronic component elements are arranged next to each other in the thickness direction, the height of the composite electronic component is significantly lower than that of conventional ones, and it is made up of a single electronic component element. The height is almost the same as that of electronic components.

<Example> Hereinafter, the present invention will be described in detail based on an example shown in the drawings. In this example, the present invention will be explained by applying it to an optical pendulum with built-in load capacitance as a composite electronic component.

FIG. 1 is an exploded perspective view of the optical pendulum with a built-in load capacity, and FIG. 2 is an assembled sectional view taken along line nn in FIG. 1. Reference numeral 10 in these figures indicates an optical pendulum with built-in load capacitance, and this oscillator 10 includes a resonator element 11 and a capacitor element 12 as plate-shaped electronic component elements.

The resonator element 11 has an energy-trapped thickness-sliding vibration mode, and includes a rectangular flat substrate 13 made of ceramic.

Opposing electrodes 11a and llb, which constitute resonant electrodes by opposing each other with the substrate 13 in between at the center of the substrate 13, are formed on the amphibatic surface of the substrate 13, respectively. Counter electrode 11a formed on one main surface of substrate 13
is folded back and extended through one end surface of the substrate 13 to a part of the other main surface. Further, the counter electrode 11b formed on the other main surface of the substrate 13 also extends to a part of the opposite main surface of the substrate 13, similarly to the counter electrode 11a described above. A protrusion 14 having a predetermined height is provided on each side of the opposing electrodes 11a and 11b, which are formed at the center of the substrate 13 and constitute a resonant electrode. ... is formed from an insulating agent such as solder resist ink.

The capacitor element 12 is the resonator element 1
The present invention includes a rectangular flat substrate 15 having substantially the same shape as the substrate 13 of No. 1 and made of ceramic.

Capacitor electrodes 12a and 12b are formed at both ends of one main surface of this substrate 15, and the inner side of each of these capacitor electrodes 12a and 12b and the surface of the substrate 15 at an intermediate portion sandwiched between both capacitor electrodes 12a and 12b. is covered with an insulating film 16 made of solder resist ink or the like. On the other hand, in the center of the other main surface of the substrate 15, each capacitor electrode 12a has both ends sandwiching the substrate 15 therebetween.
A ground electrode 12C facing the electrode 12b is formed.

The resonator element 11 and the capacitor element 12 are overlapped in the thickness direction so that the protrusions 14.14 and the insulating film 16 are in contact with each other so that they are adjacent to each other with a predetermined spacing therebetween. This predetermined interval ensures a vibration space for the resonant electrodes in the resonator element 11.

Note that the resonator element 11 and the capacitor element 1
These elements IL 12 may be simply overlapped or bonded together as long as a required vibration interval is secured between them by the insulating material.

Next, reference numerals 17 and 18 in the figure are input/output lead terminals, and the inner ends of these lead terminals 17 and 180 have a recessed holding portion that is approximately rUJ-shaped in plan view. 17a and 18a are formed. Each of the holding portions 17a and 18a is mounted on both ends of the short side of the superimposed resonator element 11 and capacitor element 12, respectively, and connected by soldering or by applying a conductive paste. At this time, solder or conductive paste enters between the resonator element 11 and the capacitor element 12 due to capillary action, and the two are reliably connected and conductive. Therefore, the counter electrode 11
a and capacitor electrode 12a are electrically connected to lead terminal 17, and counter electrode 11b and capacitor electrode 12b are electrically connected to lead terminal 18.

The inner end of the grounding lead terminal 19 is connected to the grounding electrode 12C of the capacitor element 12 by soldering or conductive paste. Further, the inner ends of the resonator element 11, the capacitor element 12, and each lead terminal 17, 18, and 19 are sealed with resin using an exterior material 20, as shown in FIG. Note that the outer end portions of each lead terminal 17, 18, and 19 are led out to the outside of the exterior material 20. Furthermore, a space is secured for the vibrating part of the resonator by a known cavity forming process.

Optical pendulum 1 with built-in load capacitance configured as described above
The equivalent circuit of 0 is as shown in FIG. 5, similar to the conventional example.

By the way, FIG. 3 shows another embodiment of such an optical pendulum with a built-in load capacitor, in which the optical pendulum with a built-in load capacitor that is not sealed with resin is assembled into a case. That is, in the optical pendulum 10 with built-in load capacitance shown in this figure, the resonator element 11 and the capacitor element 12 are mounted on a rectangular flat plate formed in advance by insert molding at the intermediate position in the longitudinal direction of each lead terminal 17, 18, 19. A terminal having a shaped base 25 is connected to the terminal. Note that the base 25 is not formed by insert molding, but may be one in which an insulating plate made of resin or paper is sandwiched between the terminals. A case 26 is mounted on the optical pendulum 10 with built-in load capacity and the base 25, and the case 26 of each lead terminal 17, 18, and 19 protruding from the base 25 is
The area surrounded by is molded with resin 27.

The optical pendulum with a built-in load capacitor built into the case in this way has the advantage that there are fewer factors that cause dimensional fluctuations than the aforementioned resin-sealed optical pendulum.

In the above explanation, the present invention was applied to an optical pendulum with a built-in load capacitor, but the present invention is not limited to this, and can be applied to other types of composite electronic components. be able to.

<Effects of the Invention> As described above, according to the present invention, since a plurality of electronic component elements are arranged next to each other in the thickness direction, the height of the composite electronic component is significantly lower than that of the conventional one, and the height of the composite electronic component is significantly lower than the conventional one. The height is approximately equal to the height of an electronic component made of one electronic component element. Therefore, it is possible to realize the miniaturization of composite electronic components, which has long been a strong demand.

[Brief explanation of drawings]

1 and 2 show one embodiment of the present invention, FIG. 1 is an exploded perspective view of a resin-sealed optical pendulum with a built-in load capacity, and FIG. FIG. 3 is an assembled cross-sectional view along the line. FIG. 3 shows another embodiment of the present invention, and is a longitudinal sectional side view of an optical pendulum with a built-in load capacitor built into a case. Further, FIG. 4 is a perspective view showing a conventional example, and FIG. 5 is an equivalent circuit diagram of the embodiment and the conventional example. 10... Optical pendulum with built-in load capacity (composite electronic component), 1
1... Resonator element (electronic component element), 12...
・Capacitor element (electronic component element).

Claims (1)

[Claims] (1) A composite electronic component consisting of a plurality of plate-shaped electronic component elements, wherein a pair of leads to be connected to each end of the electronic component element is provided, and a holding portion recessed in the inner end thereof is formed. A composite electronic component characterized in that the electronic component elements are inserted between these holding portions in a state where they overlap each other in the thickness direction.