JPS60149156A - Electronic component element and encasing method for electronic component - Google Patents

Abstract

PURPOSE:To encase components with good efficiency by a method wherein a plurality of frames provided with lead terminals and a pair of conduction terminals projecting outward from a framelike base are prepared, and conduction terminals of the same pole are joined into an integral body; then, components are loaded to the substrate part of the frame. CONSTITUTION:An oscillator 10 is loaded to supporting pieces 6-1 and 6-2 of the frame 2, and sides 3a and 3b of the substrate part 3 are fitted to the end surface 20a of a wall 20b of a case 20, and to the end surface 22a of a wall 22b of a case 22. A component 10 is housed to the space made by the recesses 21 and 23 of both cases, and the substrate part 3 is sandwiched between the end surfaces 20a and 22a under a prescribed pressure and then welded by conduction across a pair of the terminals 5-1 and 5-2. Next, the terminals 5-1 and 5-2 are cut across cutouts 7, and terminals 4-1-4-4 are folded toward the case side surface 20c. A plurality of frames 2 are joined at the wider joint F, and then fed all together to a required process and processed. This construction enables efficient encapsulation with high quality under the uniformity of welding state due to the uniform flow of welding current instead of the flow of unnecessary current to the electronic component 10 at the time of end surface welding of the resin case.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component element and a method of accommodating an electronic component in a case using the same.

(Prior art) Traditionally, electronic components such as integrated circuits have been packaged using transfer molding, which involves pouring epoxy resin into a mold. It has been difficult to package the element bodies of electronic components such as piezoelectric resonators and sound bars that must be formed using transfer molding.

Therefore, in order to package the element body of this type of electronic component,
Previously, a pair of ceramic or other outer cases were formed into a hollow structure and then bonded together using low-melting glass or adhesive, but as electronic components became smaller and outer cases became smaller, Not only is it difficult to apply low melting point glass and adhesives, but the alignment accuracy of the outer cases is also poor, the adhesive takes a long time to cure, the curing temperature is high, and production efficiency is low. Ta,.

One method for eliminating the above-mentioned drawbacks is to sandwich a terminal frame made of a metal plate having a frame shape for mounting electronic component elements between two concave cases made of thermoplastic resin, and to apply electricity to this terminal frame. A method has been proposed in which the contact surfaces of both cases are heated and welded by generating heat.

However, in the case housing method according to this proposal, since the lead terminals of the terminal frame connected to the electronic component elements are also used as terminals for heating and energizing, current is also applied to the electronic component elements through the lead terminals during heating and energization. There are problems such as the solder plating on the lead terminals coming off.

(Problems to be Solved by the Invention and Means for Solving the Problems) This invention has been made in view of the above-mentioned problems. A plurality of terminal frames each having a plurality of lead terminals and a pair of current-carrying terminals protruding from each other are integrally formed in a shape in which the current-carrying terminals of the same polarity of adjacent terminal frames are connected by a terminal frame connecting portion, and the terminal frame substrate an electronic component element element is provided in the terminal frame, and both sides of the substrate part of the terminal frame are sandwiched between the end surfaces of two exterior cases made of thermoplastic resin;
By applying electricity between the connecting parts of the terminal frames and generating heat in the board part of the terminal frames, the end faces of both cases are welded together, and electronic parts, even small ones, can be easily molded inside both cases. The purpose is to provide a case storage method.

In addition, the present invention provides a plurality of terminal frames each having a frame-shaped substrate portion, a plurality of lead terminals protruding outward from the substrate portion, and a pair of current-carrying terminals, in which the same polarity of current-carrying terminals of adjacent terminal frames are connected to each other. An electronic component element that is ideal for carrying out the above-mentioned electronic component case housing method, in which the terminals are integrally formed in a shape in which they are connected to each other by a terminal frame connection part, and the electronic component element element is provided on the board part of the terminal frame. The purpose is to provide structure.

An embodiment of the present invention will be described below with reference to the accompanying drawings.

In FIG. 1, 2 is a terminal frame, 10 is a vibrator which is an example of an electronic component element, and 20 and 22 are exterior cases.

The terminal frame 2 is integrally formed by punching out a thin metal plate. As shown in FIG. 3, this terminal frame 2 is formed in a state in which the current-carrying terminals 5-1 and 5-2 are arranged in a row and connected by two terminal frame connecting portions F. Ru.

This entire connected body of terminal frames is called a terminal frame plate 1.

In this embodiment, one terminal frame 2 includes a substrate portion 3 having an annular frame shape with a substantially rectangular planar shape, and protruding outward from one opposing side 3a of the substrate portion 3. 4 lead terminals 4-1.4-2.4-3.4-4
．． and a pair of current-carrying terminals 5-1.5-2, and four support pieces 6-1.6-1.6-2.6-2 protruding inward from the other opposing sides 3b, 3b. It has

Then, from the inner edge of each side 3a to the connection portion between the side 3a of the board portion 3 and the current-carrying terminal 5-1, 5-2,
A substantially U-shaped notch 7 is provided that extends across the current-carrying terminal 5-1, 5-2.

The acoustic bar vibrator 10 is constructed using a plate body 11 integrally formed by punching out a constant elastic metal plate such as Erinba. This plate body 11 includes a rectangular frame portion 12, a rectangular vibrator body 13 inside the frame portion 12, and four connectors 14-1.14 that support the vibration node portions of the vibrator body 13.
-2.14-3.14-4. The vibrator main body 13 and the connectors 14-1 and 14-
3 and a part of the frame 12 are coated with zinc oxide (ZnO).
A piezoelectric film 15 made of a piezoelectric material such as the like is formed. This piezoelectric film 15 is indicated by diagonal lines in the figure.

Further, a conductive film 16 is provided on the upper surface of the piezoelectric film 15. This conductor 1116 forms a drive electrode section 16a, a lead electrode section 16b, and an extraction electrode section 16c.

The above cases 20 and 22 are both made of polycarbonate,
It is formed into a rectangular shape from a thermoplastic resin such as polyacetal, PBT, or PPS. Cases 20 and 22 are
The peripheral walls 201) and 22b have the same shape, respectively.
When the end surfaces 20a and 22a of the case 20.22 are put together, they constitute one container. The peripheral walls 20b and 22b are dimensioned so that each side 2a and 2b of the terminal frame 2 overlaps the end surfaces 20a and 22b.

Next, a method of accommodating and enclosing the vibrating bar vibrator in the case will be explained.

Inside the board part 2 in the terminal frame 2,
The vibrating bar vibrator 10 is attached via the support pieces 6-1 and 6-2. A structure in which a plurality of terminal frames are integrally formed at the terminal frame connecting portion F and an electronic component element is provided thereon is called an electronic component element. In this case, as shown in FIG. For example, spot welding. In addition, the extraction electrode portion 16c of the vibrating bar vibrator 10 and the terminal frame 2
The support piece 6-1 is fixed to the supporting piece 6-1 by, for example, crimping and half-filling.

After each of the vibrator elements 10 is mounted on the terminal frame 2 as described above, each side 3a, 3b of the substrate portion 3 of the terminal frame 2 is connected to the end surface 20a of the peripheral wall 20b of the case 2o and the end surface 20a of the case 22, respectively. The vibrator 10 is accommodated in the space formed by the recesses 21 and 23 of both cases 20.22 so as to match the end surface 22a of the peripheral wall 22b, and the end surfaces 20a and 22a of the cases 20 and 22 are aligned with each other. The substrate part 3 is sandwiched with a pressure of . Thereafter, when a predetermined voltage is applied between the current-carrying terminals 5-1, 5-2 of the terminal frame 2, a current flows between the current-carrying terminals 5-1, 5-2. The current flows to the current-carrying terminal 5-2 of the board portion 31. Therefore, the substrate section 3 generates heat according to its resistance value, and the end surface 20a of the case 20 and the end surface 22a of the case 22 are heated and melted, and both end surfaces 20a and 22a are welded.

Note that the support pieces 6-1, 6-2. Sound piece oscillator 10. No current flows through the lead terminals 14-1 to 14-4, and it is possible to prevent the vibrating unit vibrator 10 from being damaged by the welding current.
The solder applied once will not be welded. By the above-described operation, the vibrator 10 is enclosed within the case 20.22 in a few seconds.

Next, as described above, the current-carrying terminals 5-1, 5-2 of each terminal frame 2, which are covered with the cases 20, 22, are cut at the positions indicated by the dashed lines in FIG.

As a result, lead terminals 4-1, 4-3 and 4-2.
4-4 is electrically insulated by the notch I.

In addition, the lead terminals 4-1 to 4-4 in each terminal frame 2 are attached to the case 20 at the positions shown by the dashed lines in FIG.
Bend it at a substantially right angle toward the side surface 20c. In this way, a so-called dual in-line molded vibrator can be obtained.

In the above-described embodiment, a case has been described in which a molded electronic component of the vibrator 10 is manufactured. However, the present invention is not limited to the vibrator 10 described above, but is applicable to piezoelectric resonators, reed switches, etc. , reed relay, bimetal,
The present invention can also be applied to the case where an electronic component element that undergoes mechanical vibration, such as a pressure hinge, is housed in a case.

In addition, in order to flow a current between the current-carrying terminals 5-1 and 5-2 of the terminal frame 2, as shown in FIG. Then, a plurality of each terminal frame 2 may be simultaneously sent to a predetermined process, and one or more pairs of welding electrodes (not shown) may be pressed into contact with the terminal frame connecting portion F. It goes without saying that it is preferable that the width of the terminal frame connection part F is wide because it can reduce the contact resistance with the welding electrode.

As explained above, according to the present invention, a plurality of terminal frames are connected at a terminal frame connecting portion to conduct current between a pair of current-carrying terminals provided on the substrate portion of a terminal frame on which an electronic component element is mounted. Since welding is carried out with the circuit board in place, there is no need to pass current through the two exterior parts made of thermoplastic resin that sandwich the circuit board, and the cases of multiple electronic components can be welded at the same time. This improves productivity, and since the welding current is divided and made uniform through the terminal frame connecting portion, the welding current becomes stable and there is no variation in the welding state. Furthermore, even if electronic components become smaller and the board portion, lead terminals, and current-carrying terminals become smaller, the terminal frame connection portion can be made larger, so work efficiency does not deteriorate and the welding current is stable.

As described above, the present invention provides a method for enclosing a case that is highly efficient, high quality, and inexpensive, and an electronic component element that is most suitable for carrying out this method.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view showing one embodiment of the present invention, and FIG.
The figure is a transparent view of electronic components covered with a case.
FIG. 3 is a plan view showing an example of a terminal frame plate in which a plurality of terminal frames are connected. 1...Terminal frame board, 2...Terminal frame, 3.
...Substrate part, 4-1.4-2. ..., 4-4... Lead terminal, 5-1.5-2... Current-carrying terminal, 10...
Sound piece vibrator, 20.21...Exterior case, F...
・Terminal frame connection part. Patent applicant: Toda Seisakusho Co., Ltd.

Claims (2)

[Claims] (1) A plurality of terminal frames each having a frame-shaped board part, a plurality of lead terminals protruding outward from the board part, and a pair of current-carrying terminals are provided, and the current-carrying terminals of the same polarity of adjacent terminal frames are connected to each other. An electronic component element integrally formed with a shape connected by a terminal frame connecting part, and an electronic component element provided on a substrate part of the terminal frame. (2) A plurality of terminal frames each having a frame-shaped board portion, a plurality of lead terminals protruding outward from the board portion, and a pair of current-carrying terminals are provided, and the current-carrying terminals of the same polarity of adjacent terminal frames are connected to each other. The terminal frame is integrally formed in a shape connected by a connecting part, and an electronic component element is provided on the board part of the terminal frame, and both sides of the board part of the terminal frame are connected by the end faces of two exterior cases made of thermoplastic resin. By inserting electricity between the connecting parts of the terminal frames and generating heat in the board part of the terminal frames, the end surfaces of both cases are welded to each other, and the electronic component element is enclosed within both cases. A method for accommodating electronic components in a case, characterized by: