JPH0314897B2 - - Google Patents

Info

Publication number
JPH0314897B2
JPH0314897B2 JP61007008A JP700886A JPH0314897B2 JP H0314897 B2 JPH0314897 B2 JP H0314897B2 JP 61007008 A JP61007008 A JP 61007008A JP 700886 A JP700886 A JP 700886A JP H0314897 B2 JPH0314897 B2 JP H0314897B2
Authority
JP
Japan
Prior art keywords
lead
press punching
alloy
lead material
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61007008A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62164843A (ja
Inventor
Rensei Futatsuka
Tadao Sakakibara
Masuhiro Izumida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP700886A priority Critical patent/JPS62164843A/ja
Publication of JPS62164843A publication Critical patent/JPS62164843A/ja
Publication of JPH0314897B2 publication Critical patent/JPH0314897B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP700886A 1986-01-16 1986-01-16 半導体装置用Ｃｕ合金リ−ド素材 Granted JPS62164843A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP700886A JPS62164843A (ja) 1986-01-16 1986-01-16 半導体装置用Ｃｕ合金リ−ド素材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP700886A JPS62164843A (ja) 1986-01-16 1986-01-16 半導体装置用Ｃｕ合金リ−ド素材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP19645590A Division JPH0375325A (ja) 1990-07-25 1990-07-25 半導体装置用Ｃｕ合金リード素材

Publications (2)

Publication Number Publication Date
JPS62164843A JPS62164843A (ja) 1987-07-21
JPH0314897B2 true JPH0314897B2 (en, 2012) 1991-02-27

Family

ID=11654030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP700886A Granted JPS62164843A (ja) 1986-01-16 1986-01-16 半導体装置用Ｃｕ合金リ−ド素材

Country Status (1)

Country Link
JP (1) JPS62164843A (en, 2012)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07116536B2 (ja) * 1989-02-10 1995-12-13 三菱伸銅株式会社 高強度Ｃｕ合金
JP2501636B2 (ja) * 1989-02-10 1996-05-29 三菱伸銅株式会社 スタンピング金型の摩耗抑制効果にすぐれた半導体装置のリ―ドフレ―ム用Ｃｕ合金素材
JP2606397B2 (ja) * 1990-02-21 1997-04-30 日立電線株式会社 プレス性の優れたリードフレーム用銅合金材料
JP4950584B2 (ja) * 2006-07-28 2012-06-13 株式会社神戸製鋼所 高強度および耐熱性を備えた銅合金

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5853057B2 (ja) * 1974-05-20 1983-11-26 株式会社神戸製鋼所 高導電性銅基合金
JPS6039141B2 (ja) * 1981-12-28 1985-09-04 玉川機械金属株式会社 熱間加工性のすぐれたりん青銅
JPS60245752A (ja) * 1984-05-22 1985-12-05 Nippon Mining Co Ltd 高力高導電銅合金
US4605532A (en) * 1984-08-31 1986-08-12 Olin Corporation Copper alloys having an improved combination of strength and conductivity
JPS61242052A (ja) * 1985-04-19 1986-10-28 Mitsubishi Shindo Kk 半導体装置用銅合金リ−ド材

Also Published As

Publication number Publication date
JPS62164843A (ja) 1987-07-21

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