JPH0313744U - - Google Patents
Info
- Publication number
- JPH0313744U JPH0313744U JP7447689U JP7447689U JPH0313744U JP H0313744 U JPH0313744 U JP H0313744U JP 7447689 U JP7447689 U JP 7447689U JP 7447689 U JP7447689 U JP 7447689U JP H0313744 U JPH0313744 U JP H0313744U
- Authority
- JP
- Japan
- Prior art keywords
- package
- thermal expansion
- circuit board
- materials
- matching circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図はこの考案の一実施例であるパツケージ
構造の断面図、第２図は凸状にそつた従来の基板
の断面図、第３図はこの考案の原理を説明する断
面図、第４図は従来のパツケージ構造を示す断面
図である。１はパツケージ銅ベース、２はコバー
ルプレート、３は整合回路基板、４は半田、５は
銅モリブデンプレート、６，７は熱膨張係数大の
物質、８は小の物質を示す。なお、図中、同一符
号は同一、または相当部分を示す。
Fig. 1 is a sectional view of a package structure that is an embodiment of this invention, Fig. 2 is a sectional view of a conventional board with a convex shape, Fig. 3 is a sectional view explaining the principle of this invention, and Fig. 4 is a sectional view of a conventional board with a convex shape. The figure is a sectional view showing a conventional package structure. 1 is a package copper base, 2 is a Kovar plate, 3 is a matching circuit board, 4 is solder, 5 is a copper molybdenum plate, 6 and 7 are materials with a large coefficient of thermal expansion, and 8 is a material with a small coefficient of thermal expansion. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
を流用しパツケージを高誘電体整合回路基板及び
緩衝用プレートとほぼ同じ熱膨張係数の材料で挾
んだことを特徴とするパツケージ構造。 A package structure for an internally matched FET, characterized in that the current package is used and the package is sandwiched between materials having approximately the same coefficient of thermal expansion as a high dielectric matching circuit board and a buffer plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7447689U JPH0313744U (en) | 1989-06-26 | 1989-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7447689U JPH0313744U (en) | 1989-06-26 | 1989-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313744U true JPH0313744U (en) | 1991-02-12 |
Family
ID=31614196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7447689U Pending JPH0313744U (en) | 1989-06-26 | 1989-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313744U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007062276A (en) * | 2005-09-01 | 2007-03-15 | Kurabo Ind Ltd | One-piece extrusion molded body and building material |
-
1989
- 1989-06-26 JP JP7447689U patent/JPH0313744U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007062276A (en) * | 2005-09-01 | 2007-03-15 | Kurabo Ind Ltd | One-piece extrusion molded body and building material |
| JP4723956B2 (en) * | 2005-09-01 | 2011-07-13 | 倉敷紡績株式会社 | Monolithic extruded body and building material |