JPH0369908U - - Google Patents

Info

Publication number
JPH0369908U
JPH0369908U JP13008989U JP13008989U JPH0369908U JP H0369908 U JPH0369908 U JP H0369908U JP 13008989 U JP13008989 U JP 13008989U JP 13008989 U JP13008989 U JP 13008989U JP H0369908 U JPH0369908 U JP H0369908U
Authority
JP
Japan
Prior art keywords
package
ground conductor
substrate
dielectric constant
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13008989U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13008989U priority Critical patent/JPH0369908U/ja
Publication of JPH0369908U publication Critical patent/JPH0369908U/ja
Pending legal-status Critical Current

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  • Waveguides (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例によるパツケージ
の構成図、第2図、第3図はこの考案の他の実施
例を示すパツケージの構成図、第4図は従来のパ
ツケージを示す構成図である。 図において、1……地導体、2……メタルフレ
ーム、3……バイアス基板、4……絶縁基板、5
,6……RF入出力基板、7……RFデバイス、
8……高誘電率基板、9……コンデンサ、10…
…接続線である。なお、図中、同一符号は同一、
または相当部分を示す。
Figure 1 is a block diagram of a package according to one embodiment of this invention, Figures 2 and 3 are diagrams of a package showing other embodiments of this invention, and Figure 4 is a diagram showing a conventional package. be. In the figure, 1...Ground conductor, 2...Metal frame, 3...Bias board, 4...Insulating board, 5
, 6...RF input/output board, 7...RF device,
8... High dielectric constant substrate, 9... Capacitor, 10...
...It is a connecting line. In addition, in the figure, the same reference numerals are the same,
or a significant portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 地導体上に誘電体基板を設け、更に高誘電率基
板をはさみ込んだフレームを備えたパツケージ。
A package with a dielectric substrate on a ground conductor and a frame with a high dielectric constant substrate sandwiched between them.
JP13008989U 1989-11-06 1989-11-06 Pending JPH0369908U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13008989U JPH0369908U (en) 1989-11-06 1989-11-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13008989U JPH0369908U (en) 1989-11-06 1989-11-06

Publications (1)

Publication Number Publication Date
JPH0369908U true JPH0369908U (en) 1991-07-12

Family

ID=31677684

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13008989U Pending JPH0369908U (en) 1989-11-06 1989-11-06

Country Status (1)

Country Link
JP (1) JPH0369908U (en)

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