JPS61100172U - - Google Patents
Info
- Publication number
- JPS61100172U JPS61100172U JP18570384U JP18570384U JPS61100172U JP S61100172 U JPS61100172 U JP S61100172U JP 18570384 U JP18570384 U JP 18570384U JP 18570384 U JP18570384 U JP 18570384U JP S61100172 U JPS61100172 U JP S61100172U
- Authority
- JP
- Japan
- Prior art keywords
- conductor portion
- conductor
- dielectric member
- high frequency
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Waveguides (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の高周波回路用誘電体基板の一
実施例の断面図、第２図は従来の高周波回路用誘
電体基板の断面図、第３図はこれにチツプコンデ
ンサを搭載半田付けした断面図である。
１……誘電体部材、２……第１の導体部、２′
……第２の導体部、２″……第３の導体部、３…
…半田、４……スルーホール部、５……ガラス材
、６……第３の導体部、７……チツプコンデンサ
。
Figure 1 is a sectional view of an embodiment of the dielectric substrate for high frequency circuits of the present invention, Figure 2 is a sectional view of a conventional dielectric substrate for high frequency circuits, and Figure 3 is a sectional view of a chip capacitor mounted and soldered thereon. FIG. DESCRIPTION OF SYMBOLS 1... Dielectric member, 2... First conductor part, 2'
...Second conductor part, 2''...Third conductor part, 3...
...Solder, 4...Through hole part, 5...Glass material, 6...Third conductor part, 7...Chip capacitor.
Claims (1)
れ前記誘電体部材をはさんで前記第１の面と対向
する第２の面にも第２の導体部が形成されており
、且つ前記誘電体部材には前記第１の面から前記
第２の面へ内壁に第３の導体部を有する導通孔が
少なくとも１つ存在する高周波回路用誘電体基板
において、前記第３の導体部の材質が前記第１の
導体部及び前記第２の導体部の材質に比べて高導
電率であることを特徴とする高周波回路用誘電体
基板。 A first conductor portion is formed on a first surface of the dielectric member, and a second conductor portion is also formed on a second surface opposite to the first surface with the dielectric member sandwiched therebetween, In the dielectric substrate for a high frequency circuit, wherein the dielectric member has at least one conduction hole having a third conductor portion on an inner wall from the first surface to the second surface, the third conductor portion A dielectric substrate for a high frequency circuit, wherein the material has a higher conductivity than the materials of the first conductor part and the second conductor part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18570384U JPS61100172U (en) | 1984-12-07 | 1984-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18570384U JPS61100172U (en) | 1984-12-07 | 1984-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61100172U true JPS61100172U (en) | 1986-06-26 |
Family
ID=30743168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18570384U Pending JPS61100172U (en) | 1984-12-07 | 1984-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61100172U (en) |
-
1984
- 1984-12-07 JP JP18570384U patent/JPS61100172U/ja active Pending
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