JPH0180944U - - Google Patents
Info
- Publication number
- JPH0180944U JPH0180944U JP1987176373U JP17637387U JPH0180944U JP H0180944 U JPH0180944 U JP H0180944U JP 1987176373 U JP1987176373 U JP 1987176373U JP 17637387 U JP17637387 U JP 17637387U JP H0180944 U JPH0180944 U JP H0180944U
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- microwave
- integrated circuit
- mounting
- microwave module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案のマイクロ波モジユールの一実
施例の一部切欠側面図、第２図は本考案のマイク
ロ波モジユールをうねりが生じている金属板に実
装した状態を示す一部切欠側面図、第３図は従来
のマイクロ波モジユールをうねりが生じている金
属板に実装した状態を示す一部切欠側面図である
。
１……マイクロ波モジユール、２……金属ベー
ス、３……マイクロ波集積回路、４……リード端
子、５……誘電体、６……溝部、７……取付穴、
８……金属板、９……取付ねじ、１０……誘電体
基板。
Fig. 1 is a partially cutaway side view of an embodiment of the microwave module of the present invention, and Fig. 2 is a partially cutaway side view showing the microwave module of the present invention mounted on a corrugated metal plate. FIG. 3 is a partially cutaway side view showing a conventional microwave module mounted on a corrugated metal plate. DESCRIPTION OF SYMBOLS 1... Microwave module, 2... Metal base, 3... Microwave integrated circuit, 4... Lead terminal, 5... Dielectric, 6... Groove, 7... Mounting hole,
8...Metal plate, 9...Mounting screw, 10...Dielectric substrate.
Claims (1)
つこの金属ベースに設けた取付穴を利用して金属
板に実装を行うマイクロ波モジユールにおいて、
前記マイクロ波集積回路の搭載部位と取付穴の間
に金属ベースの板厚を低減させる溝部を形成した
ことを特徴とするマイクロ波モジユール。 In a microwave module in which a microwave integrated circuit is mounted on a metal base and is mounted on a metal plate using mounting holes provided in this metal base,
A microwave module characterized in that a groove portion is formed between the mounting portion of the microwave integrated circuit and the mounting hole to reduce the thickness of the metal base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176373U JPH0180944U (en) | 1987-11-20 | 1987-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176373U JPH0180944U (en) | 1987-11-20 | 1987-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180944U true JPH0180944U (en) | 1989-05-30 |
Family
ID=31468114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176373U Pending JPH0180944U (en) | 1987-11-20 | 1987-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180944U (en) |
-
1987
- 1987-11-20 JP JP1987176373U patent/JPH0180944U/ja active Pending