JPS62149852U - - Google Patents
Info
- Publication number
- JPS62149852U JPS62149852U JP1986036475U JP3647586U JPS62149852U JP S62149852 U JPS62149852 U JP S62149852U JP 1986036475 U JP1986036475 U JP 1986036475U JP 3647586 U JP3647586 U JP 3647586U JP S62149852 U JPS62149852 U JP S62149852U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- semiconductor element
- package
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 6
- 238000001816 cooling Methods 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 1
- 238000009423 ventilation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Description
第１図は本考案の原理側面図、第２図は本考案
による一実施例の説明図で、ａは斜視図、ｂは要
部断面図、第３図は本考案の説明図で、ａ１，ｂ
１は平面図、ａ２，ｂ２は側面図、第４図は本考
案による他の実施例の側面図、第５図のａ，ｂは
従来の側面図を示す。
Fig. 1 is a side view of the principle of the present invention, Fig. 2 is an explanatory diagram of an embodiment according to the present invention, a is a perspective view, b is a sectional view of essential parts, and Fig. 3 is an explanatory diagram of the present invention, a1 ,b
1 is a plan view, a2 and b2 are side views, FIG. 4 is a side view of another embodiment of the present invention, and FIGS. 5A and 5B are side views of a conventional device.
Claims (1)
１Ａに配列された半導体素子２とを備え、該半導
体素子２が実装された側に所定の通風Ａを行うこ
とにより該半導体素子２の冷却を行う半導体素子
の冷却構造であつて、 前記半導体素子２のリード端子５を貫通し、前
記プリント基板１と該半導体素子２のパツケージ
７との間隙に挿入される絶縁板４と、 該パツケージ７の側壁部７Ａに接触する貫通穴
６が設けられ、該絶縁板４を挟持するよう該プリ
ント基板１に係止される金属板３とを具備するこ
とを特徴とする半導体素子の冷却構造。[Claims for Utility Model Registration] A utility model comprising a printed circuit board 1 and semiconductor elements 2 arranged on a mounting surface 1A of the printed circuit board 1, and by providing a predetermined ventilation A to the side on which the semiconductor elements 2 are mounted. A semiconductor element cooling structure for cooling the semiconductor element 2, the insulating plate passing through the lead terminals 5 of the semiconductor element 2 and inserted into the gap between the printed circuit board 1 and the package 7 of the semiconductor element 2. 4; and a metal plate 3 that is provided with a through hole 6 that contacts the side wall 7A of the package 7 and that is locked to the printed circuit board 1 so as to sandwich the insulating plate 4. Element cooling structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986036475U JPS62149852U (en) | 1986-03-13 | 1986-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986036475U JPS62149852U (en) | 1986-03-13 | 1986-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62149852U true JPS62149852U (en) | 1987-09-22 |
Family
ID=30846908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986036475U Pending JPS62149852U (en) | 1986-03-13 | 1986-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62149852U (en) |
-
1986
- 1986-03-13 JP JP1986036475U patent/JPS62149852U/ja active Pending
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