JPH03136390A - 半導体レーザ製造工程でクリービングするためのフォト工程 - Google Patents

半導体レーザ製造工程でクリービングするためのフォト工程

Info

Publication number
JPH03136390A
JPH03136390A JP2203771A JP20377190A JPH03136390A JP H03136390 A JPH03136390 A JP H03136390A JP 2203771 A JP2203771 A JP 2203771A JP 20377190 A JP20377190 A JP 20377190A JP H03136390 A JPH03136390 A JP H03136390A
Authority
JP
Japan
Prior art keywords
cleaving
photoresist
wafer
semiconductor laser
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2203771A
Other languages
English (en)
Japanese (ja)
Inventor
Hyung S Ahn
安 亨洙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
Original Assignee
Gold Star Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gold Star Co Ltd filed Critical Gold Star Co Ltd
Publication of JPH03136390A publication Critical patent/JPH03136390A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0201Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202Cleaving
JP2203771A 1989-07-31 1990-07-31 半導体レーザ製造工程でクリービングするためのフォト工程 Pending JPH03136390A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019890010858A KR940002414B1 (ko) 1989-07-31 1989-07-31 반도체 레이저 제조에서 포토공정을 이용한 클리빙방법
KR10858 1989-07-31

Publications (1)

Publication Number Publication Date
JPH03136390A true JPH03136390A (ja) 1991-06-11

Family

ID=19288567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2203771A Pending JPH03136390A (ja) 1989-07-31 1990-07-31 半導体レーザ製造工程でクリービングするためのフォト工程

Country Status (2)

Country Link
JP (1) JPH03136390A (ko)
KR (1) KR940002414B1 (ko)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6170780A (ja) * 1984-09-13 1986-04-11 Sony Corp 半導体レ−ザ−の製造方法
JPS6450585A (en) * 1987-08-21 1989-02-27 Fuji Electric Co Ltd Formation of protective film of semiconductor laser

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6170780A (ja) * 1984-09-13 1986-04-11 Sony Corp 半導体レ−ザ−の製造方法
JPS6450585A (en) * 1987-08-21 1989-02-27 Fuji Electric Co Ltd Formation of protective film of semiconductor laser

Also Published As

Publication number Publication date
KR940002414B1 (ko) 1994-03-24
KR910003874A (ko) 1991-02-28

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