JPH0313046B2 - - Google Patents

Info

Publication number
JPH0313046B2
JPH0313046B2 JP56152594A JP15259481A JPH0313046B2 JP H0313046 B2 JPH0313046 B2 JP H0313046B2 JP 56152594 A JP56152594 A JP 56152594A JP 15259481 A JP15259481 A JP 15259481A JP H0313046 B2 JPH0313046 B2 JP H0313046B2
Authority
JP
Japan
Prior art keywords
powder
thermosetting resin
properties
mixer
powders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56152594A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5853922A (ja
Inventor
Yasuhito Momota
Saburo Oomori
Hideaki Taki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP15259481A priority Critical patent/JPS5853922A/ja
Publication of JPS5853922A publication Critical patent/JPS5853922A/ja
Publication of JPH0313046B2 publication Critical patent/JPH0313046B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Other Resins Obtained By Reactions Not Involving Carbon-To-Carbon Unsaturated Bonds (AREA)
  • Epoxy Resins (AREA)
JP15259481A 1981-09-26 1981-09-26 熱硬化性樹脂粉末の製造法 Granted JPS5853922A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15259481A JPS5853922A (ja) 1981-09-26 1981-09-26 熱硬化性樹脂粉末の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15259481A JPS5853922A (ja) 1981-09-26 1981-09-26 熱硬化性樹脂粉末の製造法

Publications (2)

Publication Number Publication Date
JPS5853922A JPS5853922A (ja) 1983-03-30
JPH0313046B2 true JPH0313046B2 (cg-RX-API-DMAC7.html) 1991-02-21

Family

ID=15543843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15259481A Granted JPS5853922A (ja) 1981-09-26 1981-09-26 熱硬化性樹脂粉末の製造法

Country Status (1)

Country Link
JP (1) JPS5853922A (cg-RX-API-DMAC7.html)

Also Published As

Publication number Publication date
JPS5853922A (ja) 1983-03-30

Similar Documents

Publication Publication Date Title
TWI227690B (en) Manufacture method of epoxy resin formed material of encapsulated semiconductor, forming material and semiconductor apparatus thereof
US2806832A (en) Shell molding compositions and process for preparing same
JPH059270A (ja) 樹脂組成物およびその製造方法
JPH0313046B2 (cg-RX-API-DMAC7.html)
JPS6296568A (ja) 半導体封止用樹脂組成物
CN101580629B (zh) 制造半导体元件封装用树脂组合物的方法
JPH06107773A (ja) エポキシ樹脂コンパウンドの製造方法
US3756980A (en) High temperature stable modified phenolic molding powders
JPS59191715A (ja) エポキシ樹脂組成物の製法
KR19980070781A (ko) 에폭시 수지 조성물 및 반도체 장치
US3855173A (en) High temperature stable modified aromatic amine-aldehyde molding powders modified with aromatic polycarboxylic acid, and molded article
JPH1027871A (ja) 半導体封止用エポキシ樹脂成形材料の製造方法
JPS6135907A (ja) 樹脂成形材料の製造法
JPS5941320A (ja) 耐熱性熱硬化性樹脂の製造方法
JPH09290418A (ja) 半導体封止用エポキシ樹脂組成物の製造方法
JPS59149038A (ja) 半導体装置
JP4374645B2 (ja) 半導体封止用エポキシ樹脂成形材料の製造方法
JPS60159006A (ja) 成形材料の製造法
JP3096374B2 (ja) 合成樹脂粉末とフィラーとの混合造粒物及びその製造方法
JPS5964662A (ja) 熱硬化性樹脂成形材料の製造方法
JPS63225618A (ja) 封止用樹脂組成物およびその製造方法
JP2740723B2 (ja) シェルモールド用フェノール樹脂組成物
JPH09174548A (ja) フェノール樹脂成形材料及びその製造方法
JPH09169029A (ja) フェノール樹脂成形材料及びその製造方法
JP2004107435A (ja) エポキシ樹脂組成物および成形品