JPH0312787B2 - - Google Patents
Info
- Publication number
- JPH0312787B2 JPH0312787B2 JP60102700A JP10270085A JPH0312787B2 JP H0312787 B2 JPH0312787 B2 JP H0312787B2 JP 60102700 A JP60102700 A JP 60102700A JP 10270085 A JP10270085 A JP 10270085A JP H0312787 B2 JPH0312787 B2 JP H0312787B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- superconductor layer
- superconductor
- etching
- etching mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002887 superconductor Substances 0.000 claims description 134
- 238000005530 etching Methods 0.000 claims description 94
- 238000000034 method Methods 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 30
- 230000004888 barrier function Effects 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 239000012212 insulator Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 13
- 239000000470 constituent Substances 0.000 claims description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 29
- 229910000978 Pb alloy Inorganic materials 0.000 description 17
- 230000000694 effects Effects 0.000 description 10
- 239000010955 niobium Substances 0.000 description 10
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 10
- 238000007740 vapor deposition Methods 0.000 description 9
- 230000007547 defect Effects 0.000 description 7
- 238000010884 ion-beam technique Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 238000000992 sputter etching Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 2
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60102700A JPS61263180A (ja) | 1985-05-16 | 1985-05-16 | ジヨセフソン接合素子の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60102700A JPS61263180A (ja) | 1985-05-16 | 1985-05-16 | ジヨセフソン接合素子の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61263180A JPS61263180A (ja) | 1986-11-21 |
| JPH0312787B2 true JPH0312787B2 (fr) | 1991-02-21 |
Family
ID=14334534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60102700A Granted JPS61263180A (ja) | 1985-05-16 | 1985-05-16 | ジヨセフソン接合素子の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61263180A (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63205974A (ja) * | 1987-02-23 | 1988-08-25 | Agency Of Ind Science & Technol | ジヨセフソン接合の製造方法 |
-
1985
- 1985-05-16 JP JP60102700A patent/JPS61263180A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61263180A (ja) | 1986-11-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |