JPH0312769B2 - - Google Patents

Info

Publication number
JPH0312769B2
JPH0312769B2 JP59000523A JP52384A JPH0312769B2 JP H0312769 B2 JPH0312769 B2 JP H0312769B2 JP 59000523 A JP59000523 A JP 59000523A JP 52384 A JP52384 A JP 52384A JP H0312769 B2 JPH0312769 B2 JP H0312769B2
Authority
JP
Japan
Prior art keywords
layer
inas
alxga
asysb
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59000523A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60144979A (ja
Inventor
Hideki Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP59000523A priority Critical patent/JPS60144979A/ja
Publication of JPS60144979A publication Critical patent/JPS60144979A/ja
Publication of JPH0312769B2 publication Critical patent/JPH0312769B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/778Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7782Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET
    • H01L29/7783Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with confinement of carriers by at least two heterojunctions, e.g. DHHEMT, quantum well HEMT, DHMODFET using III-V semiconductor material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/201Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
    • H01L29/205Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Junction Field-Effect Transistors (AREA)
JP59000523A 1984-01-07 1984-01-07 半導体デバイス Granted JPS60144979A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59000523A JPS60144979A (ja) 1984-01-07 1984-01-07 半導体デバイス

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59000523A JPS60144979A (ja) 1984-01-07 1984-01-07 半導体デバイス

Publications (2)

Publication Number Publication Date
JPS60144979A JPS60144979A (ja) 1985-07-31
JPH0312769B2 true JPH0312769B2 (fr) 1991-02-21

Family

ID=11476125

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59000523A Granted JPS60144979A (ja) 1984-01-07 1984-01-07 半導体デバイス

Country Status (1)

Country Link
JP (1) JPS60144979A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022014530A1 (fr) 2020-07-13 2022-01-20 日油株式会社 Système de détonation sans fil, dispositif de relais pour un système de détonation sans fil, et procédé de détonation sans fil utilisant un système de détonation sans fil

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4827320A (en) * 1986-09-19 1989-05-02 University Of Illinois Semiconductor device with strained InGaAs layer
US4987462A (en) * 1987-01-06 1991-01-22 Texas Instruments Incorporated Power MISFET
US5091759A (en) * 1989-10-30 1992-02-25 Texas Instruments Incorporated Heterostructure field effect transistor
JP2539268B2 (ja) * 1989-07-12 1996-10-02 富士通株式会社 半導体装置
JP2822547B2 (ja) * 1990-03-06 1998-11-11 富士通株式会社 高電子移動度トランジスタ
EP0531550B1 (fr) * 1991-03-28 1997-12-29 Asahi Kasei Kogyo Kabushiki Kaisha Transistor a effet de champ
JP3173080B2 (ja) * 1991-12-05 2001-06-04 日本電気株式会社 電界効果トランジスタ
JP3224437B2 (ja) * 1992-11-30 2001-10-29 富士通株式会社 Iii−v族化合物半導体装置
CN103137477B (zh) * 2013-02-27 2016-01-13 中国科学院半导体研究所 在Si基上制备InP基HEMT的方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022014530A1 (fr) 2020-07-13 2022-01-20 日油株式会社 Système de détonation sans fil, dispositif de relais pour un système de détonation sans fil, et procédé de détonation sans fil utilisant un système de détonation sans fil

Also Published As

Publication number Publication date
JPS60144979A (ja) 1985-07-31

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term