JPH0312465B2 - - Google Patents

Info

Publication number
JPH0312465B2
JPH0312465B2 JP58145921A JP14592183A JPH0312465B2 JP H0312465 B2 JPH0312465 B2 JP H0312465B2 JP 58145921 A JP58145921 A JP 58145921A JP 14592183 A JP14592183 A JP 14592183A JP H0312465 B2 JPH0312465 B2 JP H0312465B2
Authority
JP
Japan
Prior art keywords
metallized
layer
shield conductor
insulating layer
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58145921A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6037753A (ja
Inventor
Katsuhiko Suzuki
Isao Nagashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58145921A priority Critical patent/JPS6037753A/ja
Publication of JPS6037753A publication Critical patent/JPS6037753A/ja
Publication of JPH0312465B2 publication Critical patent/JPH0312465B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W44/20
    • H10W70/682
    • H10W70/685
    • H10W72/07551
    • H10W72/50
    • H10W72/5449
    • H10W90/754

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58145921A 1983-08-10 1983-08-10 半導体装置用パツケ−ジ Granted JPS6037753A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58145921A JPS6037753A (ja) 1983-08-10 1983-08-10 半導体装置用パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58145921A JPS6037753A (ja) 1983-08-10 1983-08-10 半導体装置用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6037753A JPS6037753A (ja) 1985-02-27
JPH0312465B2 true JPH0312465B2 (cg-RX-API-DMAC10.html) 1991-02-20

Family

ID=15396157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58145921A Granted JPS6037753A (ja) 1983-08-10 1983-08-10 半導体装置用パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6037753A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2502994Y2 (ja) * 1990-02-09 1996-06-26 沖電気工業株式会社 半導体集積回路装置
WO2011018973A1 (ja) * 2009-08-11 2011-02-17 アルプス電気株式会社 Memsセンサパッケージ

Also Published As

Publication number Publication date
JPS6037753A (ja) 1985-02-27

Similar Documents

Publication Publication Date Title
US4839717A (en) Ceramic package for high frequency semiconductor devices
US5382829A (en) Packaged microwave semiconductor device
US5252882A (en) Surface acoustic wave device and its manufacturing method
US5717245A (en) Ball grid array arrangement
US5656857A (en) Semiconductor device with insulating resin layer and substrate having low sheet resistance
US3683241A (en) Radio frequency transistor package
EP1094538A2 (en) Multilayered ceramic RF device
EP0393584B1 (en) High frequency semiconductor device
US5523621A (en) Semiconductor device having a multilayer ceramic wiring substrate
JP2001085569A (ja) 高周波回路装置
JP4190111B2 (ja) 高周波モジュール
JPS63192262A (ja) 高周波数装置用のセラミックパッケージ
JPH0312465B2 (cg-RX-API-DMAC10.html)
JP4251418B2 (ja) Icパッケージ
JP2004319650A (ja) 入出力端子および半導体素子収納用パッケージならびに半導体装置
JP2593509B2 (ja) 半導体集積回路用パッケージ
JP2668999B2 (ja) 半導体装置用パッケージ
JP2520511B2 (ja) 高周波半導体装置
JPS634662A (ja) 電子回路装置
JP3640463B2 (ja) Mmicパッケージ
JP2509904B2 (ja) 半導体装置用パツケ−ジ
JPS605055B2 (ja) 半導体装置
JP2003133462A (ja) 高周波素子用パッケージ
JPH07321243A (ja) 半導体装置及びその製造方法
GB2300068A (en) Semiconductor device