JPH03124642U - - Google Patents

Info

Publication number
JPH03124642U
JPH03124642U JP1990032517U JP3251790U JPH03124642U JP H03124642 U JPH03124642 U JP H03124642U JP 1990032517 U JP1990032517 U JP 1990032517U JP 3251790 U JP3251790 U JP 3251790U JP H03124642 U JPH03124642 U JP H03124642U
Authority
JP
Japan
Prior art keywords
lead portion
inner lead
liquid crystal
view
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990032517U
Other languages
English (en)
Japanese (ja)
Other versions
JPH087636Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990032517U priority Critical patent/JPH087636Y2/ja
Publication of JPH03124642U publication Critical patent/JPH03124642U/ja
Application granted granted Critical
Publication of JPH087636Y2 publication Critical patent/JPH087636Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Multi-Conductor Connections (AREA)
JP1990032517U 1990-03-28 1990-03-28 電子部品付きフィルムコネクタ Expired - Fee Related JPH087636Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990032517U JPH087636Y2 (ja) 1990-03-28 1990-03-28 電子部品付きフィルムコネクタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990032517U JPH087636Y2 (ja) 1990-03-28 1990-03-28 電子部品付きフィルムコネクタ

Publications (2)

Publication Number Publication Date
JPH03124642U true JPH03124642U (OSRAM) 1991-12-17
JPH087636Y2 JPH087636Y2 (ja) 1996-03-04

Family

ID=31535526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990032517U Expired - Fee Related JPH087636Y2 (ja) 1990-03-28 1990-03-28 電子部品付きフィルムコネクタ

Country Status (1)

Country Link
JP (1) JPH087636Y2 (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09274948A (ja) * 1996-02-05 1997-10-21 Yazaki Corp フラットケーブルとジョイント端子との接合体
JP2007157393A (ja) * 2005-12-01 2007-06-21 Fujitsu Component Ltd ケーブルコネクタ型トランシーバモジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09274948A (ja) * 1996-02-05 1997-10-21 Yazaki Corp フラットケーブルとジョイント端子との接合体
JP2007157393A (ja) * 2005-12-01 2007-06-21 Fujitsu Component Ltd ケーブルコネクタ型トランシーバモジュール

Also Published As

Publication number Publication date
JPH087636Y2 (ja) 1996-03-04

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees