JPH0311547B2 - - Google Patents

Info

Publication number
JPH0311547B2
JPH0311547B2 JP1300684A JP1300684A JPH0311547B2 JP H0311547 B2 JPH0311547 B2 JP H0311547B2 JP 1300684 A JP1300684 A JP 1300684A JP 1300684 A JP1300684 A JP 1300684A JP H0311547 B2 JPH0311547 B2 JP H0311547B2
Authority
JP
Japan
Prior art keywords
cooling
heat transfer
printed board
heat exchanger
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1300684A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60160151A (ja
Inventor
Haruhiko Yamamoto
Yukihisa Katsuyama
Mitsuhiko Nakada
Shunichi Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59013006A priority Critical patent/JPS60160151A/ja
Priority to CA000472335A priority patent/CA1227886A/en
Priority to AU37943/85A priority patent/AU552537B2/en
Priority to DE8585400098T priority patent/DE3586661T2/de
Priority to EP85400098A priority patent/EP0151546B1/en
Priority to ES539843A priority patent/ES8602339A1/es
Priority to BR8500360A priority patent/BR8500360A/pt
Priority to KR1019850000461A priority patent/KR900002214B1/ko
Publication of JPS60160151A publication Critical patent/JPS60160151A/ja
Priority to US07/251,978 priority patent/US5050037A/en
Publication of JPH0311547B2 publication Critical patent/JPH0311547B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59013006A 1984-01-26 1984-01-26 集積回路の冷却方式 Granted JPS60160151A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP59013006A JPS60160151A (ja) 1984-01-26 1984-01-26 集積回路の冷却方式
CA000472335A CA1227886A (en) 1984-01-26 1985-01-17 Liquid-cooling module system for electronic circuit components
AU37943/85A AU552537B2 (en) 1984-01-26 1985-01-21 Liquid-cooling module system for electronic components
DE8585400098T DE3586661T2 (de) 1984-01-26 1985-01-22 Bauelemente-anordnung auf einer leiterplatte mit einem modularen, fluessigen kuehlsystem.
EP85400098A EP0151546B1 (en) 1984-01-26 1985-01-22 Printed circuit board assembly having a liquid-cooling module system
ES539843A ES8602339A1 (es) 1984-01-26 1985-01-25 Una disposicion de placa de circuito impreso para componen- tes electronicos
BR8500360A BR8500360A (pt) 1984-01-26 1985-01-25 Conjunto de quadro de circuito impresso
KR1019850000461A KR900002214B1 (ko) 1984-01-26 1985-01-25 인쇄회로기판 조립체
US07/251,978 US5050037A (en) 1984-01-26 1988-09-29 Liquid-cooling module system for electronic circuit components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59013006A JPS60160151A (ja) 1984-01-26 1984-01-26 集積回路の冷却方式

Publications (2)

Publication Number Publication Date
JPS60160151A JPS60160151A (ja) 1985-08-21
JPH0311547B2 true JPH0311547B2 (enrdf_load_stackoverflow) 1991-02-18

Family

ID=11821087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59013006A Granted JPS60160151A (ja) 1984-01-26 1984-01-26 集積回路の冷却方式

Country Status (1)

Country Link
JP (1) JPS60160151A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2809281B1 (fr) * 2000-05-22 2002-07-12 Alstom Dispositif electronique de puissance
KR100471357B1 (ko) * 2002-07-24 2005-03-10 미래산업 주식회사 반도체 소자 테스트 핸들러용 캐리어 모듈
US9036352B2 (en) * 2012-11-30 2015-05-19 Ge Aviation Systems, Llc Phase change heat sink for transient thermal management

Also Published As

Publication number Publication date
JPS60160151A (ja) 1985-08-21

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term