JPH0311548B2 - - Google Patents

Info

Publication number
JPH0311548B2
JPH0311548B2 JP1300784A JP1300784A JPH0311548B2 JP H0311548 B2 JPH0311548 B2 JP H0311548B2 JP 1300784 A JP1300784 A JP 1300784A JP 1300784 A JP1300784 A JP 1300784A JP H0311548 B2 JPH0311548 B2 JP H0311548B2
Authority
JP
Japan
Prior art keywords
liquid refrigerant
integrated circuit
cooling
heat transfer
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1300784A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60160152A (ja
Inventor
Haruhiko Yamamoto
Yukihisa Katsuyama
Mitsuhiko Nakada
Shunichi Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59013007A priority Critical patent/JPS60160152A/ja
Priority to CA000472335A priority patent/CA1227886A/en
Priority to AU37943/85A priority patent/AU552537B2/en
Priority to DE8585400098T priority patent/DE3586661T2/de
Priority to EP85400098A priority patent/EP0151546B1/en
Priority to ES539843A priority patent/ES8602339A1/es
Priority to BR8500360A priority patent/BR8500360A/pt
Priority to KR1019850000461A priority patent/KR900002214B1/ko
Publication of JPS60160152A publication Critical patent/JPS60160152A/ja
Priority to US07/251,978 priority patent/US5050037A/en
Publication of JPH0311548B2 publication Critical patent/JPH0311548B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59013007A 1984-01-26 1984-01-26 集積回路冷却装置 Granted JPS60160152A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP59013007A JPS60160152A (ja) 1984-01-26 1984-01-26 集積回路冷却装置
CA000472335A CA1227886A (en) 1984-01-26 1985-01-17 Liquid-cooling module system for electronic circuit components
AU37943/85A AU552537B2 (en) 1984-01-26 1985-01-21 Liquid-cooling module system for electronic components
DE8585400098T DE3586661T2 (de) 1984-01-26 1985-01-22 Bauelemente-anordnung auf einer leiterplatte mit einem modularen, fluessigen kuehlsystem.
EP85400098A EP0151546B1 (en) 1984-01-26 1985-01-22 Printed circuit board assembly having a liquid-cooling module system
ES539843A ES8602339A1 (es) 1984-01-26 1985-01-25 Una disposicion de placa de circuito impreso para componen- tes electronicos
BR8500360A BR8500360A (pt) 1984-01-26 1985-01-25 Conjunto de quadro de circuito impresso
KR1019850000461A KR900002214B1 (ko) 1984-01-26 1985-01-25 인쇄회로기판 조립체
US07/251,978 US5050037A (en) 1984-01-26 1988-09-29 Liquid-cooling module system for electronic circuit components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59013007A JPS60160152A (ja) 1984-01-26 1984-01-26 集積回路冷却装置

Publications (2)

Publication Number Publication Date
JPS60160152A JPS60160152A (ja) 1985-08-21
JPH0311548B2 true JPH0311548B2 (enrdf_load_stackoverflow) 1991-02-18

Family

ID=11821112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59013007A Granted JPS60160152A (ja) 1984-01-26 1984-01-26 集積回路冷却装置

Country Status (1)

Country Link
JP (1) JPS60160152A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2708495B2 (ja) * 1988-09-19 1998-02-04 株式会社日立製作所 半導体冷却装置
JP2712872B2 (ja) * 1991-04-18 1998-02-16 日本電気株式会社 集積回路の冷却機構
US6519151B2 (en) 2001-06-27 2003-02-11 International Business Machines Corporation Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof
US7392660B2 (en) * 2004-08-05 2008-07-01 Isothermal Systems Research, Inc. Spray cooling system for narrow gap transverse evaporative spray cooling

Also Published As

Publication number Publication date
JPS60160152A (ja) 1985-08-21

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