JPH046100B2 - - Google Patents

Info

Publication number
JPH046100B2
JPH046100B2 JP6164586A JP6164586A JPH046100B2 JP H046100 B2 JPH046100 B2 JP H046100B2 JP 6164586 A JP6164586 A JP 6164586A JP 6164586 A JP6164586 A JP 6164586A JP H046100 B2 JPH046100 B2 JP H046100B2
Authority
JP
Japan
Prior art keywords
integrated circuit
refrigerant
heat exchanger
curved surface
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6164586A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62217647A (ja
Inventor
Masahiro Suzuki
Yoshiaki Udagawa
Haruhiko Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP6164586A priority Critical patent/JPS62217647A/ja
Publication of JPS62217647A publication Critical patent/JPS62217647A/ja
Publication of JPH046100B2 publication Critical patent/JPH046100B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4332—Bellows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP6164586A 1986-03-18 1986-03-18 集積回路素子冷却装置 Granted JPS62217647A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6164586A JPS62217647A (ja) 1986-03-18 1986-03-18 集積回路素子冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6164586A JPS62217647A (ja) 1986-03-18 1986-03-18 集積回路素子冷却装置

Publications (2)

Publication Number Publication Date
JPS62217647A JPS62217647A (ja) 1987-09-25
JPH046100B2 true JPH046100B2 (enrdf_load_stackoverflow) 1992-02-04

Family

ID=13177163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6164586A Granted JPS62217647A (ja) 1986-03-18 1986-03-18 集積回路素子冷却装置

Country Status (1)

Country Link
JP (1) JPS62217647A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984066A (en) * 1989-12-12 1991-01-08 Coriolis Corporation Cooling of large semi-conductor devices
JP2712872B2 (ja) * 1991-04-18 1998-02-16 日本電気株式会社 集積回路の冷却機構
JPH07115156A (ja) * 1993-10-19 1995-05-02 Nec Corp 集積回路の冷却構造
JPH07321267A (ja) * 1994-05-30 1995-12-08 Nec Corp 集積回路の冷却構造
JP5117988B2 (ja) * 2008-10-20 2013-01-16 株式会社ブリヂストン スプリンクラーヘッドの接続継手及びスプリンクラーシステム

Also Published As

Publication number Publication date
JPS62217647A (ja) 1987-09-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees