JPH01137598U - - Google Patents
Info
- Publication number
- JPH01137598U JPH01137598U JP1988034683U JP3468388U JPH01137598U JP H01137598 U JPH01137598 U JP H01137598U JP 1988034683 U JP1988034683 U JP 1988034683U JP 3468388 U JP3468388 U JP 3468388U JP H01137598 U JPH01137598 U JP H01137598U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flange
- chip package
- cooling
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000002826 coolant Substances 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988034683U JPH0642388Y2 (ja) | 1988-03-15 | 1988-03-15 | マルチチップ・パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988034683U JPH0642388Y2 (ja) | 1988-03-15 | 1988-03-15 | マルチチップ・パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01137598U true JPH01137598U (enrdf_load_stackoverflow) | 1989-09-20 |
| JPH0642388Y2 JPH0642388Y2 (ja) | 1994-11-02 |
Family
ID=31261374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988034683U Expired - Lifetime JPH0642388Y2 (ja) | 1988-03-15 | 1988-03-15 | マルチチップ・パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642388Y2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011211195A (ja) * | 2010-03-29 | 2011-10-20 | Hamilton Sundstrand Corp | 冷却板アセンブリ、および冷却板アセンブリの製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6380427B2 (ja) * | 2016-02-29 | 2018-08-29 | 株式会社安川電機 | リニアモータ |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59200495A (ja) * | 1983-04-27 | 1984-11-13 | 株式会社日立製作所 | マルチチツプ・モジユ−ル |
-
1988
- 1988-03-15 JP JP1988034683U patent/JPH0642388Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59200495A (ja) * | 1983-04-27 | 1984-11-13 | 株式会社日立製作所 | マルチチツプ・モジユ−ル |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011211195A (ja) * | 2010-03-29 | 2011-10-20 | Hamilton Sundstrand Corp | 冷却板アセンブリ、および冷却板アセンブリの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642388Y2 (ja) | 1994-11-02 |