JPS6294649U - - Google Patents
Info
- Publication number
- JPS6294649U JPS6294649U JP18657985U JP18657985U JPS6294649U JP S6294649 U JPS6294649 U JP S6294649U JP 18657985 U JP18657985 U JP 18657985U JP 18657985 U JP18657985 U JP 18657985U JP S6294649 U JPS6294649 U JP S6294649U
- Authority
- JP
- Japan
- Prior art keywords
- container
- resin
- semiconductor device
- buffering agent
- semiconductor elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 4
- 239000000872 buffer Substances 0.000 claims description 2
- 239000006172 buffering agent Substances 0.000 claims 2
- 239000012530 fluid Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18657985U JPS6294649U (enrdf_load_stackoverflow) | 1985-12-03 | 1985-12-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18657985U JPS6294649U (enrdf_load_stackoverflow) | 1985-12-03 | 1985-12-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6294649U true JPS6294649U (enrdf_load_stackoverflow) | 1987-06-17 |
Family
ID=31136260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18657985U Pending JPS6294649U (enrdf_load_stackoverflow) | 1985-12-03 | 1985-12-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6294649U (enrdf_load_stackoverflow) |
-
1985
- 1985-12-03 JP JP18657985U patent/JPS6294649U/ja active Pending
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