JPH0642388Y2 - マルチチップ・パッケージ - Google Patents

マルチチップ・パッケージ

Info

Publication number
JPH0642388Y2
JPH0642388Y2 JP1988034683U JP3468388U JPH0642388Y2 JP H0642388 Y2 JPH0642388 Y2 JP H0642388Y2 JP 1988034683 U JP1988034683 U JP 1988034683U JP 3468388 U JP3468388 U JP 3468388U JP H0642388 Y2 JPH0642388 Y2 JP H0642388Y2
Authority
JP
Japan
Prior art keywords
wiring board
flange
chip package
cooling plate
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988034683U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01137598U (enrdf_load_stackoverflow
Inventor
龍雄 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1988034683U priority Critical patent/JPH0642388Y2/ja
Publication of JPH01137598U publication Critical patent/JPH01137598U/ja
Application granted granted Critical
Publication of JPH0642388Y2 publication Critical patent/JPH0642388Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988034683U 1988-03-15 1988-03-15 マルチチップ・パッケージ Expired - Lifetime JPH0642388Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988034683U JPH0642388Y2 (ja) 1988-03-15 1988-03-15 マルチチップ・パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988034683U JPH0642388Y2 (ja) 1988-03-15 1988-03-15 マルチチップ・パッケージ

Publications (2)

Publication Number Publication Date
JPH01137598U JPH01137598U (enrdf_load_stackoverflow) 1989-09-20
JPH0642388Y2 true JPH0642388Y2 (ja) 1994-11-02

Family

ID=31261374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988034683U Expired - Lifetime JPH0642388Y2 (ja) 1988-03-15 1988-03-15 マルチチップ・パッケージ

Country Status (1)

Country Link
JP (1) JPH0642388Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017158226A (ja) * 2016-02-29 2017-09-07 株式会社安川電機 リニアモータ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110232887A1 (en) * 2010-03-29 2011-09-29 Zaffetti Mark A Cold plate with integral structural fluid port

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59200495A (ja) * 1983-04-27 1984-11-13 株式会社日立製作所 マルチチツプ・モジユ−ル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017158226A (ja) * 2016-02-29 2017-09-07 株式会社安川電機 リニアモータ

Also Published As

Publication number Publication date
JPH01137598U (enrdf_load_stackoverflow) 1989-09-20

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