JPH03106754U - - Google Patents

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Publication number
JPH03106754U
JPH03106754U JP1628290U JP1628290U JPH03106754U JP H03106754 U JPH03106754 U JP H03106754U JP 1628290 U JP1628290 U JP 1628290U JP 1628290 U JP1628290 U JP 1628290U JP H03106754 U JPH03106754 U JP H03106754U
Authority
JP
Japan
Prior art keywords
external lead
diode
diode chip
glass tube
back electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1628290U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1628290U priority Critical patent/JPH03106754U/ja
Publication of JPH03106754U publication Critical patent/JPH03106754U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図はそれぞれ本考案の第1及び
第2の実施例の断面図、第3図は従来のDHD型
ダイオードの一例の断面図である。 1……ダイオードチツプ、2,3……電極、4
a,4b……外部リード、5……ガラス管、6…
…樹脂、7……温度ヒユーズ、8……空間。
1 and 2 are cross-sectional views of the first and second embodiments of the present invention, respectively, and FIG. 3 is a cross-sectional view of an example of a conventional DHD type diode. 1... Diode chip, 2, 3... Electrode, 4
a, 4b...External lead, 5...Glass tube, 6...
...Resin, 7...Temperature fuse, 8...Space.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ガラス管の中央部にダイオードチツプが置かれ
前記ダイオードの表及び裏の電極を外部リードの
端面に接着させ前記ガラス管と前記外部リードの
ダイオードチツプ側端部近傍とを封止して成るダ
ブル・ヒートシンク型のダイオードにおいて、前
記表及び裏の電極の少くとも一方と前記外部リー
ドの接続部との間に温度ヒユーズを設けたことを
特徴とするダイオード。
A double diode chip is formed by placing a diode chip in the center of a glass tube, and bonding the front and back electrodes of the diode to the end face of an external lead to seal the glass tube and the vicinity of the end of the external lead on the side of the diode chip. A heat sink type diode, characterized in that a temperature fuse is provided between at least one of the front and back electrodes and a connecting portion of the external lead.
JP1628290U 1990-02-20 1990-02-20 Pending JPH03106754U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1628290U JPH03106754U (en) 1990-02-20 1990-02-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1628290U JPH03106754U (en) 1990-02-20 1990-02-20

Publications (1)

Publication Number Publication Date
JPH03106754U true JPH03106754U (en) 1991-11-05

Family

ID=31519556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1628290U Pending JPH03106754U (en) 1990-02-20 1990-02-20

Country Status (1)

Country Link
JP (1) JPH03106754U (en)

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