JPH0297680A - 絶縁表面をエッチング及び活性化するための溶液及び絶縁表面のメタライジング法 - Google Patents

絶縁表面をエッチング及び活性化するための溶液及び絶縁表面のメタライジング法

Info

Publication number
JPH0297680A
JPH0297680A JP1115240A JP11524089A JPH0297680A JP H0297680 A JPH0297680 A JP H0297680A JP 1115240 A JP1115240 A JP 1115240A JP 11524089 A JP11524089 A JP 11524089A JP H0297680 A JPH0297680 A JP H0297680A
Authority
JP
Japan
Prior art keywords
etching
solution
insulating surface
activator
activating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1115240A
Other languages
English (en)
Japanese (ja)
Inventor
Burkhard Bressel
ブルクハルト・ブレツセル
Hans-Joachim Grapentin
ハンス―ヨアヒム・グラペンチン
Detlef Tessmann
デートレフ・テスマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of JPH0297680A publication Critical patent/JPH0297680A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
JP1115240A 1988-05-10 1989-05-10 絶縁表面をエッチング及び活性化するための溶液及び絶縁表面のメタライジング法 Pending JPH0297680A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3816494A DE3816494A1 (de) 1988-05-10 1988-05-10 Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen
DE3816494.9 1988-05-10

Publications (1)

Publication Number Publication Date
JPH0297680A true JPH0297680A (ja) 1990-04-10

Family

ID=6354376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1115240A Pending JPH0297680A (ja) 1988-05-10 1989-05-10 絶縁表面をエッチング及び活性化するための溶液及び絶縁表面のメタライジング法

Country Status (4)

Country Link
US (1) US5112513A (enExample)
EP (1) EP0341465A1 (enExample)
JP (1) JPH0297680A (enExample)
DE (1) DE3816494A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002309375A (ja) * 2001-02-07 2002-10-23 Okuno Chem Ind Co Ltd 無電解めっき用触媒付与方法
JP2017517626A (ja) * 2014-04-01 2017-06-29 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 非導電性プラスチック表面を金属化するための組成物及び方法
WO2018216714A1 (ja) * 2017-05-23 2018-11-29 奥野製薬工業株式会社 無電解めっきの前処理用組成物、無電解めっきの前処理方法、無電解めっき方法
JP2023023770A (ja) * 2021-08-06 2023-02-16 株式会社太洋工作所 無電解めっき方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3928435A1 (de) * 1989-08-24 1991-02-28 Schering Ag Verfahren zur direkten metallisierung eines nicht leitenden substrats
DE3940407A1 (de) * 1989-12-04 1991-06-06 Schering Ag Verfahren zur galvanischen direktmetallisierung
DE4205190C2 (de) * 1992-02-20 1994-07-14 Blasberg Oberflaechentech Verfahren und Mittel zur Konditionierung von Substraten oder Basismaterialien für die nachfolgende Metallisierung
US5518760A (en) * 1994-10-14 1996-05-21 Macdermid, Incorporated Composition and method for selective plating
DE19628702A1 (de) * 1995-07-25 1997-01-30 Fraunhofer Ges Forschung Flußmittelfreie Kontaktierung von Bauelementen
JP3507628B2 (ja) * 1996-08-06 2004-03-15 昭和電工株式会社 化学的機械研磨用研磨組成物
EP1177329A4 (en) * 1998-05-20 2002-06-12 Henkel Corp COMPOSITION AND METHOD FOR TREATING THE SURFACES OF LIGHT METALS AND THEIR ALLOYS
US6485580B1 (en) 1998-05-20 2002-11-26 Henkel Corporation Composition and process for treating surfaces or light metals and their alloys
US6753293B1 (en) * 1999-06-30 2004-06-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process for coating substrates with catalytic materials
DE10138446A1 (de) * 2001-08-04 2003-02-13 Enthone Omi Deutschland Gmbh Verfahren zur Metallisierung von Kunststoffoberflächen
DK175025B1 (da) * 2002-09-26 2004-05-03 Inst Produktudvikling Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres
DE10259187B4 (de) * 2002-12-18 2008-06-19 Enthone Inc., West Haven Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren
US7354870B2 (en) * 2005-11-14 2008-04-08 National Research Council Of Canada Process for chemical etching of parts fabricated by stereolithography
LT5645B (lt) 2008-07-18 2010-03-25 Chemijos Institutas, , Plastikų ėsdinimo kompozicija
US9364822B2 (en) 2013-06-28 2016-06-14 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
US10151035B2 (en) * 2016-05-26 2018-12-11 Rohm And Haas Electronic Materials Llc Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE868380C (de) * 1951-07-04 1953-02-23 Friedr Blasberg Spezialfabrik Vorbereitung von Nichtleitern zur Metallisierung
US3561995A (en) * 1967-04-03 1971-02-09 M & T Chemicals Inc Method of activating a polymer surface and resultant article
BE756672A (fr) * 1969-09-25 1971-03-25 Schering Ag Procede pour le traitement prealable de surfaces en matiere synthetique, en vue de la galvanisation
DE2053921A1 (de) * 1970-10-23 1972-04-27 Schering Ag Verfahren zur Vorbehandlung von Kunststoffen für das Metallisieren
DK485275A (da) * 1974-11-07 1976-05-08 Kollmorgen Corp Fremgangsmade og blanding til fremstilling af emner med et fast vedheftende metallag pa harpiksagtige overflader
US4073740A (en) * 1975-06-18 1978-02-14 Kollmorgen Technologies Corporation Composition for the activation of resinous bodies for adherent metallization
US4597988A (en) * 1983-06-06 1986-07-01 Macdermid, Incorporated Process for preparing printed circuit board thru-holes
US4592929A (en) * 1984-02-01 1986-06-03 Shipley Company Inc. Process for metallizing plastics
US4629636A (en) * 1984-06-07 1986-12-16 Enthone, Incorporated Process for treating plastics with alkaline permanganate solutions
DE3511105A1 (de) * 1985-03-27 1986-10-02 Dornier Gmbh, 7990 Friedrichshafen Verfahren zur aufbringung metallischer schichten auf kunststoffoberflaechen
US4698124A (en) * 1985-05-31 1987-10-06 Morton Thiokol, Inc. Method of regenerating permanganate etch bath
US4601784A (en) * 1985-05-31 1986-07-22 Morton Thiokol, Inc. Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards
US4751106A (en) * 1986-09-25 1988-06-14 Shipley Company Inc. Metal plating process

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002309375A (ja) * 2001-02-07 2002-10-23 Okuno Chem Ind Co Ltd 無電解めっき用触媒付与方法
JP2017517626A (ja) * 2014-04-01 2017-06-29 アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ 非導電性プラスチック表面を金属化するための組成物及び方法
WO2018216714A1 (ja) * 2017-05-23 2018-11-29 奥野製薬工業株式会社 無電解めっきの前処理用組成物、無電解めっきの前処理方法、無電解めっき方法
JP6482049B1 (ja) * 2017-05-23 2019-03-13 奥野製薬工業株式会社 無電解めっきの前処理用組成物、無電解めっきの前処理方法、無電解めっき方法
JP2023023770A (ja) * 2021-08-06 2023-02-16 株式会社太洋工作所 無電解めっき方法

Also Published As

Publication number Publication date
DE3816494C2 (enExample) 1991-08-29
US5112513A (en) 1992-05-12
EP0341465A1 (de) 1989-11-15
DE3816494A1 (de) 1989-11-16

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