DE3816494A1 - Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen - Google Patents
Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechenInfo
- Publication number
- DE3816494A1 DE3816494A1 DE3816494A DE3816494A DE3816494A1 DE 3816494 A1 DE3816494 A1 DE 3816494A1 DE 3816494 A DE3816494 A DE 3816494A DE 3816494 A DE3816494 A DE 3816494A DE 3816494 A1 DE3816494 A1 DE 3816494A1
- Authority
- DE
- Germany
- Prior art keywords
- solution
- etching
- compounds
- etchant
- solution according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 27
- 230000004913 activation Effects 0.000 title claims description 9
- 239000000243 solution Substances 0.000 claims description 33
- 238000005530 etching Methods 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- 238000001465 metallisation Methods 0.000 claims description 16
- 150000001875 compounds Chemical class 0.000 claims description 15
- 230000008569 process Effects 0.000 claims description 11
- 150000003839 salts Chemical class 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 claims description 10
- 230000003213 activating effect Effects 0.000 claims description 9
- 239000012190 activator Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 239000007800 oxidant agent Substances 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 230000008021 deposition Effects 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 150000002823 nitrates Chemical class 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 claims description 2
- 150000003467 sulfuric acid derivatives Chemical class 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011135 tin Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- 229910052725 zinc Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 claims description 2
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 150000001734 carboxylic acid salts Chemical class 0.000 claims 1
- 239000003518 caustics Substances 0.000 claims 1
- 229910001430 chromium ion Inorganic materials 0.000 claims 1
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 claims 1
- 238000004070 electrodeposition Methods 0.000 claims 1
- 150000004820 halides Chemical class 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 238000002360 preparation method Methods 0.000 claims 1
- 150000002736 metal compounds Chemical class 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 10
- 230000009467 reduction Effects 0.000 description 8
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(I) nitrate Inorganic materials [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 8
- -1 fluoro- Chemical class 0.000 description 7
- 239000003365 glass fiber Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 239000003446 ligand Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000002244 precipitate Substances 0.000 description 5
- 241000972773 Aulopiformes Species 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 230000001464 adherent effect Effects 0.000 description 4
- 230000003750 conditioning effect Effects 0.000 description 4
- 230000029087 digestion Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- 235000019515 salmon Nutrition 0.000 description 4
- 101100165177 Caenorhabditis elegans bath-15 gene Proteins 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 235000011149 sulphuric acid Nutrition 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910004882 Na2S2O8 Inorganic materials 0.000 description 2
- 238000001311 chemical methods and process Methods 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000012286 potassium permanganate Substances 0.000 description 2
- 239000012279 sodium borohydride Substances 0.000 description 2
- 229910000033 sodium borohydride Inorganic materials 0.000 description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229910000375 tin(II) sulfate Inorganic materials 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical class NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 150000001409 amidines Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229940051880 analgesics and antipyretics pyrazolones Drugs 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 229940111121 antirheumatic drug quinolines Drugs 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 150000001642 boronic acid derivatives Chemical class 0.000 description 1
- SXDBWCPKPHAZSM-UHFFFAOYSA-M bromate Chemical class [O-]Br(=O)=O SXDBWCPKPHAZSM-UHFFFAOYSA-M 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 150000002019 disulfides Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 150000004673 fluoride salts Chemical class 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 150000004675 formic acid derivatives Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002475 indoles Chemical class 0.000 description 1
- 229910021432 inorganic complex Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 125000002346 iodo group Chemical class I* 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 150000002826 nitrites Chemical class 0.000 description 1
- 125000000449 nitro group Chemical class [O-][N+](*)=O 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000000018 nitroso group Chemical class N(=O)* 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- JEXVQSWXXUJEMA-UHFFFAOYSA-N pyrazol-3-one Chemical class O=C1C=CN=N1 JEXVQSWXXUJEMA-UHFFFAOYSA-N 0.000 description 1
- 150000003217 pyrazoles Chemical class 0.000 description 1
- 150000003219 pyrazolines Chemical class 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
- 150000003230 pyrimidines Chemical class 0.000 description 1
- 150000003233 pyrroles Chemical class 0.000 description 1
- 150000003248 quinolines Chemical class 0.000 description 1
- 150000003252 quinoxalines Chemical class 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- NVBFHJWHLNUMCV-UHFFFAOYSA-N sulfamide Chemical class NS(N)(=O)=O NVBFHJWHLNUMCV-UHFFFAOYSA-N 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3816494A DE3816494A1 (de) | 1988-05-10 | 1988-05-10 | Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen |
| EP89107191A EP0341465A1 (de) | 1988-05-10 | 1989-04-21 | Lösung und Verfahren zum Ätzen und Aktivieren von isolierenden Oberflächen |
| JP1115240A JPH0297680A (ja) | 1988-05-10 | 1989-05-10 | 絶縁表面をエッチング及び活性化するための溶液及び絶縁表面のメタライジング法 |
| US07/349,700 US5112513A (en) | 1988-05-10 | 1989-05-10 | Solution and process for etching and activating surfaces of a nonconductive substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3816494A DE3816494A1 (de) | 1988-05-10 | 1988-05-10 | Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3816494A1 true DE3816494A1 (de) | 1989-11-16 |
| DE3816494C2 DE3816494C2 (enExample) | 1991-08-29 |
Family
ID=6354376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE3816494A Granted DE3816494A1 (de) | 1988-05-10 | 1988-05-10 | Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5112513A (enExample) |
| EP (1) | EP0341465A1 (enExample) |
| JP (1) | JPH0297680A (enExample) |
| DE (1) | DE3816494A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4205190A1 (de) * | 1992-02-20 | 1993-08-26 | Blasberg Oberflaechentech | Verfahren und mittel zur konditionierung von substraten oder basismaterialien fuer die nachfolgende metallisierung |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3928435A1 (de) * | 1989-08-24 | 1991-02-28 | Schering Ag | Verfahren zur direkten metallisierung eines nicht leitenden substrats |
| DE3940407A1 (de) * | 1989-12-04 | 1991-06-06 | Schering Ag | Verfahren zur galvanischen direktmetallisierung |
| US5518760A (en) * | 1994-10-14 | 1996-05-21 | Macdermid, Incorporated | Composition and method for selective plating |
| DE19628702A1 (de) * | 1995-07-25 | 1997-01-30 | Fraunhofer Ges Forschung | Flußmittelfreie Kontaktierung von Bauelementen |
| JP3507628B2 (ja) * | 1996-08-06 | 2004-03-15 | 昭和電工株式会社 | 化学的機械研磨用研磨組成物 |
| EP1177329A4 (en) * | 1998-05-20 | 2002-06-12 | Henkel Corp | COMPOSITION AND METHOD FOR TREATING THE SURFACES OF LIGHT METALS AND THEIR ALLOYS |
| US6485580B1 (en) | 1998-05-20 | 2002-11-26 | Henkel Corporation | Composition and process for treating surfaces or light metals and their alloys |
| US6753293B1 (en) * | 1999-06-30 | 2004-06-22 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for coating substrates with catalytic materials |
| JP4670064B2 (ja) * | 2001-02-07 | 2011-04-13 | 奥野製薬工業株式会社 | 無電解めっき用触媒付与方法 |
| DE10138446A1 (de) * | 2001-08-04 | 2003-02-13 | Enthone Omi Deutschland Gmbh | Verfahren zur Metallisierung von Kunststoffoberflächen |
| DK175025B1 (da) * | 2002-09-26 | 2004-05-03 | Inst Produktudvikling | Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres |
| DE10259187B4 (de) * | 2002-12-18 | 2008-06-19 | Enthone Inc., West Haven | Metallisierung von Kunststoffsubstraten und Lösung zum Beizen und Aktivieren |
| US7354870B2 (en) * | 2005-11-14 | 2008-04-08 | National Research Council Of Canada | Process for chemical etching of parts fabricated by stereolithography |
| LT5645B (lt) | 2008-07-18 | 2010-03-25 | Chemijos Institutas, , | Plastikų ėsdinimo kompozicija |
| US9364822B2 (en) | 2013-06-28 | 2016-06-14 | Rohm And Haas Electronic Materials Llc | Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds |
| PT3660189T (pt) * | 2014-04-01 | 2024-02-14 | Atotech Deutschland Gmbh & Co Kg | Composição e processo para metalizar superfícies plásticas não condutoras |
| US10151035B2 (en) * | 2016-05-26 | 2018-12-11 | Rohm And Haas Electronic Materials Llc | Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts |
| KR20190137146A (ko) * | 2017-05-23 | 2019-12-10 | 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 | 무전해 도금의 전처리용 조성물, 무전해 도금의 전처리 방법, 무전해 도금 방법 |
| JP7138880B1 (ja) * | 2021-08-06 | 2022-09-20 | 株式会社太洋工作所 | 無電解めっき方法 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE868380C (de) * | 1951-07-04 | 1953-02-23 | Friedr Blasberg Spezialfabrik | Vorbereitung von Nichtleitern zur Metallisierung |
| GB1228593A (enExample) * | 1967-04-03 | 1971-04-15 | ||
| DE2053921A1 (de) * | 1970-10-23 | 1972-04-27 | Schering Ag | Verfahren zur Vorbehandlung von Kunststoffen für das Metallisieren |
| DE1794029B2 (de) * | 1968-08-28 | 1976-04-08 | Hoechst Ag, 6000 Frankfurt | Verfahren zur vorbehandlung der oberflaeche von gegenstaenden aus polyaethylen oder polypropylen oder entsprechenden mischpolymerisaten fuer die chemische vernickelung |
| DE2550597B2 (de) * | 1974-11-07 | 1978-02-02 | Kollmorgen Corp, Hartford, Conn | Verfahren zur vorbehandlung von kunststoffoberflaechen und kunststoffartikeln vor dem aufbringen von festhaftenden metallschichten |
| DE1949278B2 (de) * | 1969-09-25 | 1978-05-18 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zur Vorbehandlung von Kunststoffteilen für das chemische und galvanische Metallisieren auf Gestellen |
| US4592929A (en) * | 1984-02-01 | 1986-06-03 | Shipley Company Inc. | Process for metallizing plastics |
| US4597988A (en) * | 1983-06-06 | 1986-07-01 | Macdermid, Incorporated | Process for preparing printed circuit board thru-holes |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4073740A (en) * | 1975-06-18 | 1978-02-14 | Kollmorgen Technologies Corporation | Composition for the activation of resinous bodies for adherent metallization |
| US4629636A (en) * | 1984-06-07 | 1986-12-16 | Enthone, Incorporated | Process for treating plastics with alkaline permanganate solutions |
| DE3511105A1 (de) * | 1985-03-27 | 1986-10-02 | Dornier Gmbh, 7990 Friedrichshafen | Verfahren zur aufbringung metallischer schichten auf kunststoffoberflaechen |
| US4698124A (en) * | 1985-05-31 | 1987-10-06 | Morton Thiokol, Inc. | Method of regenerating permanganate etch bath |
| US4601784A (en) * | 1985-05-31 | 1986-07-22 | Morton Thiokol, Inc. | Sodium permanganate etch baths containing a co-ion for permanganate and their use in desmearing and/or etching printed circuit boards |
| US4751106A (en) * | 1986-09-25 | 1988-06-14 | Shipley Company Inc. | Metal plating process |
-
1988
- 1988-05-10 DE DE3816494A patent/DE3816494A1/de active Granted
-
1989
- 1989-04-21 EP EP89107191A patent/EP0341465A1/de not_active Withdrawn
- 1989-05-10 US US07/349,700 patent/US5112513A/en not_active Expired - Fee Related
- 1989-05-10 JP JP1115240A patent/JPH0297680A/ja active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE868380C (de) * | 1951-07-04 | 1953-02-23 | Friedr Blasberg Spezialfabrik | Vorbereitung von Nichtleitern zur Metallisierung |
| GB1228593A (enExample) * | 1967-04-03 | 1971-04-15 | ||
| DE1794029B2 (de) * | 1968-08-28 | 1976-04-08 | Hoechst Ag, 6000 Frankfurt | Verfahren zur vorbehandlung der oberflaeche von gegenstaenden aus polyaethylen oder polypropylen oder entsprechenden mischpolymerisaten fuer die chemische vernickelung |
| DE1949278B2 (de) * | 1969-09-25 | 1978-05-18 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Verfahren zur Vorbehandlung von Kunststoffteilen für das chemische und galvanische Metallisieren auf Gestellen |
| DE2053921A1 (de) * | 1970-10-23 | 1972-04-27 | Schering Ag | Verfahren zur Vorbehandlung von Kunststoffen für das Metallisieren |
| DE2550597B2 (de) * | 1974-11-07 | 1978-02-02 | Kollmorgen Corp, Hartford, Conn | Verfahren zur vorbehandlung von kunststoffoberflaechen und kunststoffartikeln vor dem aufbringen von festhaftenden metallschichten |
| US4597988A (en) * | 1983-06-06 | 1986-07-01 | Macdermid, Incorporated | Process for preparing printed circuit board thru-holes |
| US4592929A (en) * | 1984-02-01 | 1986-06-03 | Shipley Company Inc. | Process for metallizing plastics |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4205190A1 (de) * | 1992-02-20 | 1993-08-26 | Blasberg Oberflaechentech | Verfahren und mittel zur konditionierung von substraten oder basismaterialien fuer die nachfolgende metallisierung |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3816494C2 (enExample) | 1991-08-29 |
| US5112513A (en) | 1992-05-12 |
| JPH0297680A (ja) | 1990-04-10 |
| EP0341465A1 (de) | 1989-11-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8110 | Request for examination paragraph 44 | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |