PT3660189T - Composição e processo para metalizar superfícies plásticas não condutoras - Google Patents
Composição e processo para metalizar superfícies plásticas não condutorasInfo
- Publication number
- PT3660189T PT3660189T PT201524790T PT20152479T PT3660189T PT 3660189 T PT3660189 T PT 3660189T PT 201524790 T PT201524790 T PT 201524790T PT 20152479 T PT20152479 T PT 20152479T PT 3660189 T PT3660189 T PT 3660189T
- Authority
- PT
- Portugal
- Prior art keywords
- composition
- plastic surfaces
- nonconductive plastic
- metallizing
- metallizing nonconductive
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
- C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- ing And Chemical Polishing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Physical Vapour Deposition (AREA)
- Dental Preparations (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP14163083 | 2014-04-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PT3660189T true PT3660189T (pt) | 2024-02-14 |
Family
ID=50434027
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT201524790T PT3660189T (pt) | 2014-04-01 | 2015-03-24 | Composição e processo para metalizar superfícies plásticas não condutoras |
| PT157115296T PT3126547T (pt) | 2014-04-01 | 2015-03-24 | Composição e processo para metalizar superfícies plásticas não condutoras |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PT157115296T PT3126547T (pt) | 2014-04-01 | 2015-03-24 | Composição e processo para metalizar superfícies plásticas não condutoras |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US10174250B2 (pt) |
| EP (2) | EP3126547B1 (pt) |
| JP (2) | JP6622712B2 (pt) |
| KR (1) | KR102447849B1 (pt) |
| CN (1) | CN106471155B (pt) |
| BR (1) | BR112016017812B1 (pt) |
| ES (2) | ES2785400T3 (pt) |
| PT (2) | PT3660189T (pt) |
| TW (1) | TWI658122B (pt) |
| WO (1) | WO2015150156A1 (pt) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| LT2015105A (lt) * | 2015-12-18 | 2017-06-26 | Vmti Fiziniå² Ir Technologijos Mokslå² Centras | Plastikų paviršiaus adhezinio paruošimo prieš metalizavimą būdas |
| US10151035B2 (en) * | 2016-05-26 | 2018-12-11 | Rohm And Haas Electronic Materials Llc | Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts |
| CN118064879A (zh) * | 2017-05-23 | 2024-05-24 | 奥野制药工业株式会社 | 无电解镀的前处理用组合物、无电解镀的前处理方法、无电解镀方法 |
| JP2020526638A (ja) * | 2017-07-10 | 2020-08-31 | エスアールジー グローバル インコーポレイテッド | 六価クロムを含まないエッチングマンガン回収システム |
| KR102241457B1 (ko) * | 2019-06-19 | 2021-04-19 | 대영엔지니어링 주식회사 | 비 전도성 플라스틱의 습식 표면처리 방법 |
| KR102232079B1 (ko) * | 2019-06-19 | 2021-03-25 | 대영엔지니어링 주식회사 | 비 전도성 플라스틱의 표면특성 개선을 위한 도금방법 |
| CN110438500B (zh) * | 2019-07-30 | 2022-07-12 | 广东硕成科技股份有限公司 | 一种塑料/金属制品及其制备方法 |
| GB2587662A (en) | 2019-10-04 | 2021-04-07 | Macdermid Inc | Prevention of unwanted plating on rack coatings for electrodeposition |
| WO2022180197A1 (en) | 2021-02-26 | 2022-09-01 | Atotech Deutschland GmbH & Co. KG | Method for etching at least one surface of a plastic substrate |
| EP4326462A1 (en) * | 2021-04-19 | 2024-02-28 | SABIC Global Technologies B.V. | Etchless metal plating using cold sintering |
| JP7138880B1 (ja) * | 2021-08-06 | 2022-09-20 | 株式会社太洋工作所 | 無電解めっき方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DD94540A (pt) | ||||
| DE94540C (pt) | ||||
| BE756045A (fr) | 1969-09-12 | 1971-03-11 | Macdermid Inc | Procede de regeneration de solutions de decapage a l'acide chromique |
| US4204013A (en) * | 1978-10-20 | 1980-05-20 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine |
| SU1104377A1 (ru) | 1983-01-28 | 1984-07-23 | Всесоюзный Научно-Исследовательский И Проектный Институт Технологии Химического И Нефтяного Аппаратостроения | Реактив дл вы влени границы между нержавеющими и углеродистыми стал ми и сплавами |
| DE3816494A1 (de) * | 1988-05-10 | 1989-11-16 | Schering Ag | Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen |
| CA2222158C (en) | 1993-03-18 | 2001-01-30 | Nayan Harsukhrai Joshi | Self accelerating and replenishing non-formaldehyde immersion coating method and composition |
| GB9722028D0 (en) * | 1997-10-17 | 1997-12-17 | Shipley Company Ll C | Plating of polymers |
| ATE266107T1 (de) | 1998-11-13 | 2004-05-15 | Lpw Chemie Gmbh | Verfahren zur metallisierung einer kunststoffoberfläche |
| JP2003013244A (ja) | 2001-07-03 | 2003-01-15 | Okuno Chem Ind Co Ltd | 樹脂基材表面への無電解めっき用触媒付与方法 |
| DE102004026489B3 (de) | 2004-05-27 | 2005-09-29 | Enthone Inc., West Haven | Verfahren zur Metallisierung von Kunststoffoberflächen |
| GB0515480D0 (en) | 2005-07-28 | 2005-08-31 | Shin Etsu Handotai Europ Ltd | Product |
| ATE445667T1 (de) * | 2007-08-10 | 2009-10-15 | Enthone | Chromfreie beize für kunststoffoberflächen |
| JP2009228083A (ja) * | 2008-03-25 | 2009-10-08 | Ebara-Udylite Co Ltd | プラスチック表面への金属めっき方法 |
| EP2639333A1 (de) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen |
| EP2639334A1 (de) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen |
| ES2556981T3 (es) | 2012-04-24 | 2016-01-21 | Enthone Inc. | Composición de pre-ataque químico y proceso de ataque químico para sustratos de plástico |
| CN103305822A (zh) | 2013-05-31 | 2013-09-18 | 海安县申菱电器制造有限公司 | 一种提高铝合金耐蚀性的处理方法 |
-
2015
- 2015-03-24 BR BR112016017812-2A patent/BR112016017812B1/pt active IP Right Grant
- 2015-03-24 PT PT201524790T patent/PT3660189T/pt unknown
- 2015-03-24 US US15/112,700 patent/US10174250B2/en active Active
- 2015-03-24 ES ES15711529T patent/ES2785400T3/es active Active
- 2015-03-24 CN CN201580018742.XA patent/CN106471155B/zh active Active
- 2015-03-24 ES ES20152479T patent/ES2972552T3/es active Active
- 2015-03-24 EP EP15711529.6A patent/EP3126547B1/en active Active
- 2015-03-24 PT PT157115296T patent/PT3126547T/pt unknown
- 2015-03-24 KR KR1020167024200A patent/KR102447849B1/ko active IP Right Grant
- 2015-03-24 WO PCT/EP2015/056195 patent/WO2015150156A1/en active Application Filing
- 2015-03-24 EP EP20152479.0A patent/EP3660189B1/en active Active
- 2015-03-24 JP JP2016559915A patent/JP6622712B2/ja active Active
- 2015-04-01 TW TW104110771A patent/TWI658122B/zh active
-
2019
- 2019-01-03 US US16/238,596 patent/US10377947B2/en active Active
- 2019-11-22 JP JP2019211405A patent/JP2020045574A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| ES2785400T3 (es) | 2020-10-06 |
| JP2020045574A (ja) | 2020-03-26 |
| EP3126547A1 (en) | 2017-02-08 |
| JP6622712B2 (ja) | 2019-12-18 |
| EP3660189B1 (en) | 2023-11-15 |
| ES2972552T3 (es) | 2024-06-13 |
| EP3660189A1 (en) | 2020-06-03 |
| CN106471155A (zh) | 2017-03-01 |
| KR20160140609A (ko) | 2016-12-07 |
| JP2017517626A (ja) | 2017-06-29 |
| BR112016017812A2 (pt) | 2017-08-08 |
| TW201546241A (zh) | 2015-12-16 |
| KR102447849B1 (ko) | 2022-09-26 |
| PT3126547T (pt) | 2020-05-19 |
| TWI658122B (zh) | 2019-05-01 |
| US20170166812A1 (en) | 2017-06-15 |
| US20190144747A1 (en) | 2019-05-16 |
| EP3126547B1 (en) | 2020-03-04 |
| BR112016017812B1 (pt) | 2021-08-17 |
| CN106471155B (zh) | 2019-11-15 |
| US10377947B2 (en) | 2019-08-13 |
| WO2015150156A1 (en) | 2015-10-08 |
| US10174250B2 (en) | 2019-01-08 |
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