JPH0284757A - Manufacture of lead frame - Google Patents

Abstract

PURPOSE:To enable the lead frame capable of mounting various types of semiconductor chips to be supplied within a short term of delivery by a method wherein the die pad of a lead frame whereon inner leads are arranged to be radiately expanded is manufactured in the dimension conforming to a chip size using a laser, etc. CONSTITUTION:A die pad of a lead frame 7 whereon inner leads 8 are arranged to be radiately expanded from the center of a resin sealed semiconductor device to the outside is manufactured or formed in the dimension conforming to a chip size using a laser or metallic mold. For example, when the applicable lead frame 7 is initially made, the inner leads 8 are arranged as innerly as possible. Finally, a laser head 4 installed on the lead frame 7 is arbitrarily shifted in the dimension conforming to the chip size by a shifting part 5 using a laser processor composed of a laser oscillator 1, a fiber 3, the laser head 4, the shifting part 5 and a controller 6 so that laser beams may be directed from the laser head 4 to cut off the inner leads 8 for manufacturing the lead frame 7.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a lead frame used in a resin-sealed semiconductor device, and particularly relates to a method for manufacturing a lead frame that can be applied to a wide variety of semiconductor chip sizes. .

[Conventional technology]

Conventionally, this type of lead frame has an internal pattern corresponding to each chip size, as shown in FIGS. 5 and 6.

For this reason, lead frame manufacturing methods include punching one type of frame using one die or etching.

[Problem to be solved by the invention]

In the conventional lead frame manufacturing method described above, the lead frame is manufactured to have an internal pattern corresponding to each chip size.

For this reason, in the case of high-variety, low-volume, quick-delivery products that require semiconductor chips of various sizes to be mounted, lead frames made using conventional lead frame manufacturing methods have the disadvantage of longer production lead times and higher costs. .

[Means to solve the problem]

The lead frame manufacturing method of the present invention includes a laser processing machine (a moving section for moving a laser oscillator and a laser target section, and a control section for controlling these) for cutting the inner leads of the lead frame.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view of one embodiment of the present invention.

FIG. 2 is a side view of FIG. 1. Third. FIG. 4 represents an example lead frame diagram manufactured according to the present invention. According to this embodiment, the configuration of the laser processing machine includes a laser oscillator 1. Fiber 3. Laser head 4. Moving part 5. It consists of a control section 6.

Further, the lead frame 7 used in the present invention is a lead frame in which the inner leads 8 are placed as far inside as possible when first manufactured. Next, as a method for manufacturing the lead frame, the laser head 4 installed on the lead frame γ is moved arbitrarily by the moving unit 5 in a dimension according to the chip size, and the laser beam 2 is focused from the laser head 4. The inner lead 8 is cut to produce a lead frame.

FIG. 7 is a front view of another embodiment of the present invention, and FIG. 8 is a side view of FIG. 7. According to this embodiment, FIG.
The lead frame shown in FIG. 4 is produced. The configuration of this embodiment is press 13. A mold section 17 and a lead frame moving section 18. It consists of a lead frame holding section 19 and a control section 6. In this embodiment, the punch 14 of the mold part 17 has the minimum necessary size (opening 1) to cut the inner lead 8.
(about mm). As a lead frame manufacturing method, the lead frame 7 is moved to the lead frame moving section 1.
8, while operating with dimensions according to the chip size.
The mold section 17 is operated in several steps to cut 8 inner leads to produce a lead frame.

〔Effect of the invention〕

As explained above, the present invention uses a laser to cut the semiconductor element mounting portion of the lead frame, which is arranged so that the inner leads radiate outward from the center of the resin-sealed semiconductor device, into dimensions according to the chip size. By processing and molding the inner leads, lead frames capable of mounting semiconductor chips of various sizes can be supplied in a short lead time or by being directly connected to a production line.

[Brief explanation of drawings]

Figures 5 and 6 are diagrams of the conventional lead frame, Figure 7 is a plan view of another embodiment of the present invention, and Figure 8 is a side view of Figure 7. . DESCRIPTION OF SYMBOLS 1... Laser oscillator, 2... Laser light, 3... Fiber 4... Laser head, 5... Moving part, 6... ...control section,
7... Lead frame, 8... Inner lead, 9 a r b r c + d...
... Tie bar 10 ... Outer lead, 1
1...Resin sealing part range, 12...Island, 13...Pressed part, 14...
Punch, 15... Stripper plate, 16
...Die, 17...Mold part, 18...
...Lead frame moving section, 19...Lead frame holding section. Megumi〈Representative Patent Attorney Susumu Uchihara...” ” ” ” ” ”
JINNNCY> too

Claims (1)

[Claims] The semiconductor mounting part of the lead frame, which is arranged so that the inner leads spread radially outward from the center of the resin-sealed semiconductor device, is processed using a laser or a mold to the dimensions according to the chip size. , a method for manufacturing a lead frame characterized by molding.