JPS60189956A - Manufacture of lead frame for semiconductor device - Google Patents

Manufacture of lead frame for semiconductor device

Info

Publication number
JPS60189956A
JPS60189956A JP4525284A JP4525284A JPS60189956A JP S60189956 A JPS60189956 A JP S60189956A JP 4525284 A JP4525284 A JP 4525284A JP 4525284 A JP4525284 A JP 4525284A JP S60189956 A JPS60189956 A JP S60189956A
Authority
JP
Japan
Prior art keywords
pellet
lead
size
lead frame
lead frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4525284A
Other languages
Japanese (ja)
Inventor
Tetsuro Okatome
岡留　哲朗
Kouichi Sohara
曽原　光一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4525284A priority Critical patent/JPS60189956A/en
Publication of JPS60189956A publication Critical patent/JPS60189956A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Abstract

PURPOSE:To enable inexpensive alteration in shape by a method wherein outer leads and inner leads continuous to the pellet mount are formed by punching by the use of the same press metal mold; thereafter, a pellet mount suitable for each pellet size is punched by a metal mold corresponding to another pellet size. CONSTITUTION:In the case of forming lead frames different in size only of islands, first, utilizing a punch used to form the inner leads 2 and the outer leads 4 of the lead frame, parts a'-i' are punched to form inner leads 2' and the outer leads 4. Thereafter, lead frames different in island size can be offered by punching the B2 part with punches provided individually. Thereby, if many kinds of punches forming islands are prepared, lead frames suitable for pellet sizes can be supplied, and the yield in the assembly process can be largely improved.

Description

【発明の詳細な説明】 （技術分野） 本発明は樹脂封止集積回路（■Ｃ）Ｋ使用されるリード
フレームの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method for manufacturing a lead frame used in resin-sealed integrated circuits (■C)K.

（発明の背影） 一般にリードフレームはペレットを搭載するアイランド
と内部リード部、外部リード部とその各々を連結する連
結部にて構成されている。またリードフレームを用いて
ペレットにリード付けの連続作業による組立を行うには
、リードフレームのアイランドにペレットをマウントし
、ボンディングワイヤによりペレットと内部リード部と
の間を接続後パッケージ封入、リード切断、成形を行う
ことにより製造されている。このリードフレームは帯状
の薄い金属材料からプレス加工またはエツチングで製造
されているが、コストの面から少量品にはエツチング品
、大量品にはプレス品が適している。これはプレス金型
が非常に高価なことによる。(Background of the Invention) Generally, a lead frame is composed of an island on which pellets are mounted, an internal lead portion, an external lead portion, and a connecting portion that connects each of the islands. In addition, in order to assemble the pellet by continuous work of attaching leads to the pellet using a lead frame, the pellet is mounted on the island of the lead frame, the pellet is connected to the internal lead part using a bonding wire, and then packaged, the lead is cut, and the lead is cut. Manufactured by molding. This lead frame is manufactured from a thin band-shaped metal material by pressing or etching, but from the viewpoint of cost, an etched product is suitable for small quantities, and a pressed product is suitable for large quantities. This is because press molds are very expensive.

従来、リードフレームはベレットナイズにあわせて製品
ごとに開発してきた。このため、先にも述べたように製
品を開発するたびにプレス金型を新らたに準備すること
になり、製品コストが非常に高価なものとなっていた。Traditionally, lead frames have been developed for each product in accordance with pelletization. For this reason, as mentioned above, a new press mold must be prepared each time a product is developed, making the product extremely expensive.

（発明の目的） 本発明は上記欠点を解消し、安価に形状の変更が可能な
半導体装置用リードフレームの製造方法を得ることにあ
る。(Object of the Invention) An object of the present invention is to eliminate the above-mentioned drawbacks and provide a method for manufacturing a lead frame for a semiconductor device, which allows the shape to be changed at low cost.

（発明の構成） 本発明によれば、外部リードの形状が同じで使用半導体
ベレットの大きさが異なるリードフレームを製作する場
合、ベレットサイズに関係なく同一のプレス金型を用い
て外部リードとペレット搭載部に連らなる内部リードと
を打ち抜き形成し、その後裔ペレットサイズに適したペ
レット搭載部を別のベレットサイズに応じた金型で打ち
抜き形成する半導体装置用リードフレームの製造方法を
得る。(Structure of the Invention) According to the present invention, when producing lead frames in which the external leads have the same shape and the semiconductor pellets used are different in size, the external leads and pellets can be assembled using the same press mold regardless of the pellet size. To obtain a method for manufacturing a lead frame for a semiconductor device, in which an internal lead connected to a mounting part is punched out, and a pellet mounting part suitable for a descendant pellet size is punched out using a mold corresponding to another pellet size.

次に図面を参照して本発明をより詳細に説明する。Next, the present invention will be explained in more detail with reference to the drawings.

（従来技術） 一般にリードフレームをプレス加工する方法としては、
第１図に示すようにまず内部リード２゜外部リード４．
アイ２ンドつり部３を成形すべく、ａ部から１部まで一
度に２ケ所ずつポンチを用いて打ち抜いている。しかる
後ペレットを搭載するアイランドｌを８１部を打ち抜く
ことにより成形している。(Prior art) Generally, the method of press working a lead frame is as follows:
As shown in FIG. 1, first, the internal lead 2°, the external lead 4.
In order to form the eye 2 hanging part 3, two places from part a to part 1 are punched out at a time using a punch. Thereafter, the island L on which the pellets are mounted is formed by punching out 81 parts.

（実施例） 本発明によれはアイランドの大きさのみ違うリードフレ
ームを成形する場合、第２．３図に示すように、まず内
部リード２′（２“）外部リード４を成形するために第
１図に示したリードフレームの部）を打ち抜く、シかる
後Ｂ＊（Ｂｓ）部を個別に設けたポンチにて打ち抜くこ
とによりアイランドサイズの異なるリードフレームを提
供することができる。(Example) According to the present invention, when molding a lead frame that differs only in island size, as shown in FIG. Lead frames with different island sizes can be provided by punching out the lead frame shown in FIG. 1 using a punch provided with separate B* (Bs) parts.

このため、アイランドを成形するポンチを何種類本準備
しておけば、ベレットサイズにあったリードフレームを
供給することができ組立工程における歩留を大幅に向上
出来るだけでなくプレス金型のほとんどを共用すること
ができ、金型費用が非常に安価なものとなり製品コスト
を低減できるものである。Therefore, by preparing several types of punches for forming islands, you can supply a lead frame that matches the pellet size, which not only greatly improves the yield in the assembly process, but also allows most of the press molds to be used. It can be shared, the mold cost is very low, and the product cost can be reduced.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のリードフレームを示す平面図、第２図お
よび第３図は本発明の一実織例によりそれぞれ作られる
リードフレームの平面図である。 １　、１’、　１”・・・・・・アイランド部、２．２
’、２“・・・・・・内部リード部、３・・・・・・ア
イランドつり部、４・・・・・・外・部リード部、ＡＩ
・・・・・・従来フレームのアイランド寸法、Ａ、、Ａ
、・・・・・・本発明によるリードフレームのアイラン
ド寸法（ＡＩ＜Ａｓ＜Ａｓ　）、Ｂｓ・・・・・・従来
フレームのアイランドを成形するためにポンチで打ち抜
く部分、ａ−ｘｉ、ａ’〜ｉ’、ａ“〜ｌ“・・・・・
・内部リード及び外部リードを成形するためにポンチで
打ち抜く部分。 （ ）− ） （FIG. 1 is a plan view showing a conventional lead frame, and FIGS. 2 and 3 are plan views of lead frames each made by one example of the present invention. 1, 1', 1"...Island part, 2.2
', 2''...Inner lead part, 3...Island suspension part, 4...Outer/external lead part, AI
・・・・・・Island dimensions of conventional frame, A,,A
,... Island dimensions of the lead frame according to the present invention (AI<As<As), Bs... Parts punched out with a punch to form the island of the conventional frame, a-xi, a'~i',a"~l"...
・The part that is punched out to form the internal and external leads. ( )− ) (

Claims (1)

【特許請求の範囲】[Claims] ペレット搭載部、内部リード部、外部リード部とその各
々を連結す石連結部とからなる半導体装置用リードフレ
ームのパンチングによる製造方法において、前記内部リ
ード部の先端が前記ペレット搭載部に連結したリードフ
レーム中間製品を形成し、その後該内部リード先端部と
ペレット搭載部を搭載ペレットサイズに合わせた金型で
打ち抜くことにより作成する事′ｆｔ％徴とする半導体
装置用リードフレームの製造方法。In a method for manufacturing a lead frame for a semiconductor device by punching, which comprises a pellet mounting part, an internal lead part, an external lead part, and a stone connecting part connecting each of them, the lead in which the tip of the internal lead part is connected to the pellet mounting part A method for manufacturing a lead frame for a semiconductor device, which comprises forming an intermediate frame product, and then punching out the internal lead tip and pellet mounting part using a mold matching the size of the mounted pellet.
JP4525284A 1984-03-09 1984-03-09 Manufacture of lead frame for semiconductor device Pending JPS60189956A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4525284A JPS60189956A (en) 1984-03-09 1984-03-09 Manufacture of lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4525284A JPS60189956A (en) 1984-03-09 1984-03-09 Manufacture of lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS60189956A true JPS60189956A (en) 1985-09-27

Family

ID=12714080

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4525284A Pending JPS60189956A (en) 1984-03-09 1984-03-09 Manufacture of lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS60189956A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475724A (en) * 1990-07-13 1992-03-10 Nec Corp Manufacture of lead frame for semiconductor device and semiconductor device with utilizing above
WO1998032172A1 (en) * 1995-07-17 1998-07-23 Siemens Aktiengesellschaft Electronic component
US6870245B1 (en) 1997-01-22 2005-03-22 Siemens Aktiengesellschaft Electric component with an integrated circuit mounted on an island of a lead frame

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0475724A (en) * 1990-07-13 1992-03-10 Nec Corp Manufacture of lead frame for semiconductor device and semiconductor device with utilizing above
WO1998032172A1 (en) * 1995-07-17 1998-07-23 Siemens Aktiengesellschaft Electronic component
US6870245B1 (en) 1997-01-22 2005-03-22 Siemens Aktiengesellschaft Electric component with an integrated circuit mounted on an island of a lead frame

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