JPH0281084U - - Google Patents
Info
- Publication number
- JPH0281084U JPH0281084U JP16100888U JP16100888U JPH0281084U JP H0281084 U JPH0281084 U JP H0281084U JP 16100888 U JP16100888 U JP 16100888U JP 16100888 U JP16100888 U JP 16100888U JP H0281084 U JPH0281084 U JP H0281084U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- land
- land portions
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例によるプリント配線
板の正面図、第２図は同ランド部周囲の詳細図、
第３図は同部品実装後のプリント配線板の正面図
、第４図は従来のプリント配線板の正面図、第５
図は同部品実装後のプリント配線板の正面図、第
６図は同重量部品実装後のプリント配線板の断面
図を示す。
１……挿入孔、２……ランド部、３……補強ラ
ンド、４……導通パターン、５……プリント配線
板、６……電子部品。
Fig. 1 is a front view of a printed wiring board according to an embodiment of the present invention, Fig. 2 is a detailed view of the surrounding area of the land,
Figure 3 is a front view of the printed wiring board after mounting the same components, Figure 4 is a front view of a conventional printed wiring board, and Figure 5 is a front view of the printed wiring board after mounting the same components.
The figure shows a front view of the printed wiring board after mounting the same components, and FIG. 6 shows a cross-sectional view of the printed wiring board after mounting the same weight components. DESCRIPTION OF SYMBOLS 1...Insertion hole, 2...Land portion, 3...Reinforcement land, 4...Continuity pattern, 5...Printed wiring board, 6...Electronic component.
Claims (1)
備え、少なくとも重量部品を取付けるランド部の
外周にランド剥離を防止するための放射状の補強
ランドを設けたプリント配線板。 A printed wiring board that has land portions and conductive patterns on one or both sides, and has radial reinforcing lands on the outer periphery of at least the land portions on which heavy components are attached to prevent land peeling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16100888U JPH0281084U (en) | 1988-12-12 | 1988-12-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16100888U JPH0281084U (en) | 1988-12-12 | 1988-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0281084U true JPH0281084U (en) | 1990-06-22 |
Family
ID=31443576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16100888U Pending JPH0281084U (en) | 1988-12-12 | 1988-12-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0281084U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010080946A (en) * | 2008-08-26 | 2010-04-08 | Panasonic Electric Works Co Ltd | Method of producing electric circuit, and electric circuit board obtained by the method |
-
1988
- 1988-12-12 JP JP16100888U patent/JPH0281084U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010080946A (en) * | 2008-08-26 | 2010-04-08 | Panasonic Electric Works Co Ltd | Method of producing electric circuit, and electric circuit board obtained by the method |