JPH0277137A - Method of sealing electronic circuit with resin - Google Patents
Method of sealing electronic circuit with resinInfo
- Publication number
- JPH0277137A JPH0277137A JP63229602A JP22960288A JPH0277137A JP H0277137 A JPH0277137 A JP H0277137A JP 63229602 A JP63229602 A JP 63229602A JP 22960288 A JP22960288 A JP 22960288A JP H0277137 A JPH0277137 A JP H0277137A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electronic circuit
- thermoplastic resin
- resin
- resin sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 33
- 239000011347 resin Substances 0.000 title claims abstract description 33
- 238000007789 sealing Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims description 12
- 239000002775 capsule Substances 0.000 claims abstract description 5
- 230000006378 damage Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 19
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 5
- 239000007787 solid Substances 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 abstract 4
- 230000035939 shock Effects 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、熱可塑性樹脂を用いた電子回路の樹脂封止方
法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a resin sealing method for an electronic circuit using a thermoplastic resin.
、［従来の技術］
従来、電子回路の樹脂封止には、主として２液性の熱硬
化性樹脂を用いていた。又、第５図は、従来の樹脂封止
方法を示す図面であり、粘度の低い熱硬化性の樹脂６を
塗出装置５を用いて、ボンディングの終了したＩＣチッ
プ上に供給しているさらに第６図も従来の樹脂封止の別
の方法を示す図面であり、液体塗布用のへケアを用℃・
て、熱硬化性の樹脂６を塗る。この場合、熱硬化性の樹
脂６の供給される際の荷重及び衝撃で金ワイヤーが下が
りＩＯチップ４０表面端部に接触し、電気的ショートと
なる場合が多い。又、樹脂を供給する際のハケ等で金ワ
イヤーに損傷を与える場合もあり、安定的な樹脂供給は
困難である。, [Prior Art] Conventionally, two-component thermosetting resins have been mainly used for resin sealing of electronic circuits. Furthermore, FIG. 5 is a drawing showing a conventional resin sealing method, in which a thermosetting resin 6 with a low viscosity is supplied onto an IC chip after bonding using a coating device 5. Figure 6 is also a drawing showing another method of conventional resin sealing, using Hecare for liquid application.
Then apply thermosetting resin 6. In this case, the gold wire falls down due to the load and impact when the thermosetting resin 6 is supplied and comes into contact with the surface end of the IO chip 40, often resulting in an electrical short. Furthermore, the gold wire may be damaged by brushing when supplying the resin, making it difficult to supply the resin stably.
［発明が解決しようとする課Ｎ］
しかしながら゛従来技術では、封止部分に手作業で樹脂
を供給する際に、使用する樹脂が常温中で低粘度の流動
状態の為、適正供給量の判断が困難である、不必要部分
への流出の可能性が高い、ハケ等の供給治具によりＩＣ
チップボンディング部分の破壊が起きる等の問題点があ
った。[Problem N to be solved by the invention] However, in the prior art, when manually supplying resin to the sealing part, it is difficult to judge the appropriate supply amount because the resin used is in a fluid state with low viscosity at room temperature. It is difficult to clean the IC, there is a high possibility that it will leak to unnecessary parts, and there is a high possibility that it will leak into unnecessary parts.
There were problems such as destruction of the chip bonding part.
そこで本発明は、従来のこの様な問題点を解決する為、
熱可塑性樹脂を用いて、良好な樹脂封止方法を提供する
事を目的とする。Therefore, in order to solve these conventional problems, the present invention
The purpose is to provide a good resin sealing method using thermoplastic resin.
［課題を解決する為の手段］
上記問題点を解決する為に、本発明の樹脂封止方法は、
ＩＣチップの実装された電子回路基板の表面を封止する
樹脂封止方法において、常温雰囲気中では、工Ｃチップ
のボンディング部分を損傷１−、１．ｃい様な形状で存
在させ、前記工Ｃチップ実装部分にカプセル状に覆わせ
、溶融・再硬化に必要な温度サイクルを加える事で樹脂
封止作業を完了出来る様に、熱可塑性を持たせる事を特
徴とする［実施例コ
以下に本発明の実施例を図面に基づいて説明する。第１
図は、本発明の実施例を示す電子回路基板の断面図であ
る。固化した熱可塑性樹脂１をカプセル状にして、電子
回路基板２上へ実装された工０チップ６の上に覆いかぶ
せる。この際に、前記熱可塑性樹脂１は、工０チップ３
と電子回路基板２との電気的接続をとる金ワイヤ−４に
触れる事があってはならない。この状態で熱可塑性樹脂
が軟化・溶融する温度を雰囲気として加えると、第２図
に示す様に、熱可塑性樹脂はその特性上、軟化・溶融を
開始し極めて低速塵、低衝撃でＩＣチップ５と接触し始
める。さらに時間を経過させると、第５図に示す様に、
熱可塑性樹脂１と電子回路基板２及び工０チップ３との
間隔は無（なり、完全に封止された状態となる。この際
、熱可塑性樹脂１は、溶融した状態であるが、その粘度
により円形古噴状の形状を保持する。この後再度雰囲気
温度を常温に戻すと、熱可塑性樹脂１は、第５図の形状
のまま硬化し固体状態となり、電子回路基板２上のＩＣ
チップ６の樹脂封止は完了する第４図は、本発明の他の
実施例を示すもので、熱可塑性樹脂１を箱型にしたもの
である。この場合、樹脂で封止される面積は小さくなり
、他の実装部品への影響は少なくなる。[Means for Solving the Problems] In order to solve the above problems, the resin sealing method of the present invention includes the following:
In a resin sealing method for sealing the surface of an electronic circuit board on which an IC chip is mounted, the bonding portion of the C chip may be damaged in a normal temperature atmosphere 1-, 1. It is made to exist in a C-like shape, and is made to have thermoplasticity so that the resin sealing work can be completed by covering the chip mounting part in a capsule shape and applying the temperature cycle necessary for melting and re-hardening. Embodiments Examples of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view of an electronic circuit board showing an embodiment of the present invention. The solidified thermoplastic resin 1 is made into a capsule shape and is placed over the chip 6 mounted on the electronic circuit board 2. At this time, the thermoplastic resin 1 is
The gold wire 4 that makes the electrical connection between the electronic circuit board 2 and the electronic circuit board 2 must not be touched. In this state, if a temperature at which the thermoplastic resin softens and melts is added to the atmosphere, as shown in Figure 2, the thermoplastic resin will begin to soften and melt due to its characteristics, and the IC chip will be blown away by extremely low-speed dust and low impact. start contacting. As time passes further, as shown in Figure 5,
There is no gap between the thermoplastic resin 1, the electronic circuit board 2, and the chip 3, resulting in a completely sealed state.At this time, the thermoplastic resin 1 is in a molten state, but its viscosity When the atmospheric temperature is returned to room temperature again, the thermoplastic resin 1 hardens into a solid state as shown in FIG. 5, and the IC on the electronic circuit board 2
FIG. 4, in which the resin sealing of the chip 6 is completed, shows another embodiment of the present invention, in which the thermoplastic resin 1 is shaped into a box. In this case, the area sealed with resin becomes smaller and the influence on other mounted components is reduced.
［発明の効果］
本発明は、以上説明した様に、電子回路の樹脂封止にカ
プセル状の熱可塑性樹脂を使用する事により、ＩＣチッ
プのワイヤーボンディング部分を破壊する事なく安定的
に、しかも簡単に樹脂封止が出来る効果がある。[Effects of the Invention] As explained above, the present invention uses a capsule-shaped thermoplastic resin for resin sealing of an electronic circuit, thereby stably and without damaging the wire bonding portion of an IC chip. It has the effect of being easily resin-sealed.
第１図は本発明にかかる電子回路の樹脂封止方法を示す
断面図、第２図、第３図は、本発明を実施した際の樹脂
封止経過図、第４図は、本発明の他の実施例を示す図で
ある。又、第５図、第６図は、従、来の電子回路の樹脂
封止方法を示す図である。
１・・・・・・カプセル状の熱可塑性樹脂２・・・・・
・回路基板
３・・・・・・工０チップ
４・・・・・・金ワイヤ−
５・・・・・・熱硬化性樹脂封止塗出装置６・・・・・
・熱硬化性樹脂
７・・・・・・熱硬化性樹脂塗布用ハゲ以上
出願人 セイコーエプソン株式会社
代理人 弁理士 鈴木喜三部（他１名）第４図
第５図
第６図FIG. 1 is a sectional view showing the resin sealing method for an electronic circuit according to the present invention, FIGS. 2 and 3 are resin sealing progress charts when the present invention is carried out, and FIG. 4 is a cross-sectional view showing the resin sealing method of the present invention. It is a figure which shows another Example. Further, FIGS. 5 and 6 are diagrams showing a conventional resin sealing method for an electronic circuit. 1... Capsule-shaped thermoplastic resin 2...
・Circuit board 3... Process 0 chip 4... Gold wire 5... Thermosetting resin sealing coating device 6...
・Thermosetting resin 7... Bald or above for thermosetting resin coating Applicant: Seiko Epson Co., Ltd. Agent Patent attorney: Kizobe Suzuki (and 1 other person) Figure 4 Figure 5 Figure 6
Claims (1)
路基板の表面を封止する樹脂封止方法において、常温雰
囲気中では、ＩＣチップのボンディング部分を損傷しな
い様な形状で存在させ、前記ＩＣチップ実装部分にカプ
セル状に覆わせ、溶融・再硬化に必要な温度サイクルを
加える事で樹脂封止作業を完了出来る様に、熱可塑性を
持たせた事を特徴とする、電子回路の樹脂封止方法。In a resin sealing method for sealing the surface of an electronic circuit board on which an integrated circuit (hereinafter abbreviated as IC) chip is mounted, the IC chip is placed in a shape that does not damage the bonding part of the IC chip in an atmosphere at room temperature. Resin sealing for electronic circuits is characterized by having thermoplastic properties so that the resin sealing work can be completed by covering the chip mounting area in a capsule shape and applying the necessary temperature cycles for melting and re-hardening. How to stop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63229602A JPH0277137A (en) | 1988-09-13 | 1988-09-13 | Method of sealing electronic circuit with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63229602A JPH0277137A (en) | 1988-09-13 | 1988-09-13 | Method of sealing electronic circuit with resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0277137A true JPH0277137A (en) | 1990-03-16 |
Family
ID=16894753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63229602A Pending JPH0277137A (en) | 1988-09-13 | 1988-09-13 | Method of sealing electronic circuit with resin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0277137A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6001671A (en) * | 1996-04-18 | 1999-12-14 | Tessera, Inc. | Methods for manufacturing a semiconductor package having a sacrificial layer |
| US6821821B2 (en) | 1996-04-18 | 2004-11-23 | Tessera, Inc. | Methods for manufacturing resistors using a sacrificial layer |
-
1988
- 1988-09-13 JP JP63229602A patent/JPH0277137A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6001671A (en) * | 1996-04-18 | 1999-12-14 | Tessera, Inc. | Methods for manufacturing a semiconductor package having a sacrificial layer |
| US6093584A (en) * | 1996-04-18 | 2000-07-25 | Tessera, Inc. | Method for encapsulating a semiconductor package having apertures through a sacrificial layer and contact pads |
| US6294830B1 (en) | 1996-04-18 | 2001-09-25 | Tessera, Inc. | Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer |
| US6821821B2 (en) | 1996-04-18 | 2004-11-23 | Tessera, Inc. | Methods for manufacturing resistors using a sacrificial layer |
| US6856235B2 (en) | 1996-04-18 | 2005-02-15 | Tessera, Inc. | Methods for manufacturing resistors using a sacrificial layer |
| US7165316B2 (en) | 1996-04-18 | 2007-01-23 | Tessera, Inc. | Methods for manufacturing resistors using a sacrificial layer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100214555B1 (en) | Method for manufacture of semiconductor package | |
| JPH06204272A (en) | Manufacture of semiconductor device | |
| JPH0277137A (en) | Method of sealing electronic circuit with resin | |
| JP3281859B2 (en) | Manufacturing method of hybrid integrated circuit device | |
| JPH0312942A (en) | Sealing of semiconductor device and semiconductor chip | |
| JPH01315167A (en) | Semiconductor device | |
| JPH09214095A (en) | Board and circuit module, and method for manufacturing circuit module | |
| JPH01248546A (en) | Manufacture of electronic parts | |
| JP2810309B2 (en) | Method for producing box-shaped resin molded product for semiconductor device | |
| JPH04199661A (en) | Manufacture of semiconductor device | |
| JPH03280452A (en) | Structure for mounting semiconductor device | |
| JPH06283564A (en) | Wire bonding method | |
| JPS62198143A (en) | Lead frame | |
| JPS6351660A (en) | Electronic circuit device and manufacture of the same | |
| JP2662015B2 (en) | Method for manufacturing semiconductor device | |
| JPS59172794A (en) | Method of soldering lead terminal | |
| JPS61287197A (en) | Manufacture of electronic component | |
| KR100214553B1 (en) | Method of making buttom lead package | |
| JPH05243070A (en) | Electronic parts molded with resin and its mounting method on board | |
| JPH03241860A (en) | Resin sealing structure and method of hybrid integrated circuit board | |
| JPS61120431A (en) | Manufacture of package of semiconductor or the like | |
| JPH0251260A (en) | Manufacture of semiconductor device | |
| JPH09181223A (en) | Semiconductor device | |
| JPH03201554A (en) | Electronic part to be packaged on board | |
| JPH0845980A (en) | Semiconductor production apparatus |