KR100214553B1 - Method of making buttom lead package - Google Patents

Method of making buttom lead package Download PDF

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Publication number
KR100214553B1
KR100214553B1 KR1019970002580A KR19970002580A KR100214553B1 KR 100214553 B1 KR100214553 B1 KR 100214553B1 KR 1019970002580 A KR1019970002580 A KR 1019970002580A KR 19970002580 A KR19970002580 A KR 19970002580A KR 100214553 B1 KR100214553 B1 KR 100214553B1
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KR
South Korea
Prior art keywords
lead
mold
exposed
wire
package
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KR1019970002580A
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Korean (ko)
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KR19980066837A (en
Inventor
허성재
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구본준
엘지반도체주식회사
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Priority to KR1019970002580A priority Critical patent/KR100214553B1/en
Publication of KR19980066837A publication Critical patent/KR19980066837A/en
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Publication of KR100214553B1 publication Critical patent/KR100214553B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Abstract

본 발명은 버팀 리드 패키지의 제조 방법에 관한 것으로, 종래 기술에 의한 버텀 리드 패키지의 제조 방법은 외부의 회로와 연결되는 노출리드에 내열성이 강하고 고가인 접착 테이프를 사용하여야 하므로 생산비가 상승하고, 또 몰딩공정 후 상기 접착 테이프를 제거하여야 공정이 난이하여 생산성이 저하되는 문제점을 초래하였다. 이러한 문제점을 해결하기 위하여 본 발명은 외부의 회로 단자와 통전될 수 있도록 연결하는 노출리드부(12a')에 도포물질인 몰드 마킹 러버(14)를 도포하여 몸체를 몰딩한 후, 상기 몰드 마킹 러버(14)를 제거하여 상기 버텀 리드 패키지를 제조하므로써, 상기 몰드 마킹 러버(14)의 제거가 용이하게 되어 생산성이 향상되고, 또 상기 몰드 마킹 러버(14)의 가격이 저렴하여 생산비를 절감할 수 있는 효과가 있다.The present invention relates to a method of manufacturing a butt lead package. In the method of manufacturing a bottom lead package according to the related art, a production cost increases because an adhesive tape having a high heat resistance and high resistance is used for an exposed lead connected to an external circuit. After the molding process, the adhesive tape has to be removed, resulting in a difficulty in productivity and a decrease in productivity. In order to solve this problem, the present invention applies a mold marking rubber 14, which is a coating material, to the exposed lead portion 12a 'which is connected to an external circuit terminal so as to be energized, and then molding the body. By removing the 14 to manufacture the bottom lid package, the mold marking rubber 14 can be easily removed, thereby improving productivity, and the mold marking rubber 14 can be cheaper to reduce production costs. It has an effect.

Description

버텀 리드 패키지의 제조 방법Manufacturing method of bottom lead package

본 발명은 버텀 리드 패키지의 제조 방법에 관한 것으로, 특히 반도체 칩의 패드와 통전될 수 있도록 와이어 본딩한 노출리드에 2액상형의 몰드마킹러버를 도포한 후, 에폭시 수지와 같은 몰드물로 몰딩하므로써 상기 노출리드에 플래쉬(Flash)가 배제된 패키지를 형성할 수 있음과 아울러 생산비를 절감할 수 있도록 한 버텀 리드 패키지의 제조 방법에 관한 것이다.The present invention relates to a method of manufacturing a bottom lid package, and in particular, by applying a two-component mold marking rubber to a wire-bonded exposed lead so as to conduct electricity with a pad of a semiconductor chip, and then molding the mold with a mold such as an epoxy resin. The present invention relates to a method of manufacturing a bottom lead package that can form a package without flash on an exposed lead and reduce production costs.

일반적으로, 반도체 패키지의 하나인 버텀 리드 패키지는 상기 도1에 도시된 바와 같이, 다수개의 패드(미도시)가 형성된 반도체 칩(1)과 그 칩의 패드와 외부의 회로단자(미도시)와 연결되는 리드(2a)가 통전될 수 있도록 와이어(3)본딩되고, 상기 리드(2a)를 외부의 회로단자와 연결할 수 있도록 노출시킴과 아울러 상기 반도체 칩(1)과 와이어(3)를 외부의 파손인자로부터 보호할 수 있도록 에폭시 수지와 같은 몰드물로 몰딩된 몸체(4)가 형성되어 있다.In general, as shown in FIG. 1, the bottom lead package, which is one of the semiconductor packages, includes a semiconductor chip 1 having a plurality of pads (not shown), pads of the chip, and external circuit terminals (not shown). A wire 3 is bonded so that the lead 2a to be connected is energized, and the lead 2a is exposed to be connected to an external circuit terminal, and the semiconductor chip 1 and the wire 3 are exposed to the outside. A body 4 molded from a mold such as an epoxy resin is formed to protect against breakage factors.

상기와 같이 구성된 버텀 리드 패키지의 제조 방법을 상기 제2도와 재3도를 참고하여 상세하게 설명하면, 다음과 같다.A method of manufacturing the bottom lead package configured as described above will be described in detail with reference to FIGS. 2 and 3 as follows.

먼저, 패턴이 형성된 상기 반도체 칩(1)의 패드와 리드프레임(2)에 형성된 리드(2a)와 통전될 수 있도록 와이어(3)본딩하고, 상기와 같이 리드프레임(2)에 다수개의 반도체 칩(1)이 와이어(3) 본딩된 리드프레임(2)에서 외부의 회로단자와 연결하는 노출리드부(2a')에 내열성이 있는 접착 테이프(5)로 붙인 다음, 하금형(6)에 상기와 같이 접착 테이프(5)가 붙여지고 반도체 칩(1)이 와이어(3) 본딩된 리드프레임(2)을 위치시킨 다음, 상금형(7)을 상기 하금형(6)에 클램핑한 후, 에폭시 수지와 같은 몰드물을 주입하여 상기 버텀 리드 패키지의 몸체(4)를 형성한다.First, the wire 3 is bonded so as to be energized with the pad of the semiconductor chip 1 on which the pattern is formed and the lead 2a formed on the lead frame 2, and a plurality of semiconductor chips are formed on the lead frame 2 as described above. (1) is attached to the exposed lead portion (2a ') connecting to the external circuit terminal in the lead frame (2) bonded to the wire (3) with a heat resistant adhesive tape (5), and then to the lower mold (6) After placing the lead frame 2 to which the adhesive tape 5 is attached and the semiconductor chip 1 is bonded to the wire 3, the upper mold 7 is clamped to the lower mold 6, and then the epoxy A mold such as resin is injected to form the body 4 of the bottom lid package.

상기와 같이 에폭시 수지와 같은 몰딩물로 몸체(4)를 형성한 버텀 리드 패키지를 상기 금형(6,7)에서 분리한 후, 상기 접착 테이프(5)를 절단하고, 상기 노출리드(2a')에 붙어 있는 상기 접착 테이프(5)를 제거하여 상기 버텀 리드 패키지를 제조하는 것이다.After separating the bottom lead package in which the body 4 is formed of a molding such as epoxy resin from the molds 6 and 7, the adhesive tape 5 is cut and the exposed lead 2a ′ is removed. The bottom lead package is manufactured by removing the adhesive tape 5 attached thereto.

그러나, 상기와 같은 버텀 리드 패키지의 제조 방법은 외부의 회로와 연결되는 노출리드에 내열성이 강하고 고가인 접착 테이프를 사용하여야 하므로 생산비가 상승하고, 또 몰딩공정 후 상기 접착 테이프를 제거하여야 공정이 난이하여 생산성이 저하되는 문제점을 초래하였다.However, in the method of manufacturing the bottom lead package as described above, since the heat resistant and expensive adhesive tape must be used for the exposed lead connected to the external circuit, the production cost increases, and the adhesive tape must be removed after the molding process. This caused a problem that the productivity is lowered.

따라서, 본 발명의 목적은 상기의 문제점을 해결하여 생산비를 절감함과 아울러 생산성을 향상할수 있는 버텀 리드 패키지를 제공함에 있다.Accordingly, an object of the present invention is to provide a bottom lid package that can solve the above problems and reduce productivity and improve productivity.

제1도는 일반적인 버텀 리드 패키지의 종단구조를 단면도.1 is a cross-sectional view of a termination structure of a general bottom lead package.

제2도는 종래 기술에 의한 버텀 리드 패키지의 제조 방법을 도시한 설명도.2 is an explanatory diagram showing a method for manufacturing a bottom lid package according to the prior art.

제3도는 종래 기술에 의한 방법으로 만들어진 버텀 리드 패키지에서 접착 테이프를 제거하기 전의 상태를 보인 측면도.3 is a side view showing a state before removing the adhesive tape from the bottom lid package made by the method according to the prior art.

제4도는 본 발명에 의한 방법으로 반도체 칩의 패드와 리드프레임의 리드를 와이어 본딩하고, 상기 리드의 노출리드부에 도포물질을 도포한 상태를 보인 측면도.4 is a side view showing a state in which a pad of a semiconductor chip and a lead of a lead frame are wire-bonded by the method according to the present invention, and a coating material is applied to the exposed lead portion of the lead.

제5도는 노출리드부에 도포물질을 도포하기 위하여 사용하는 실크 프린트 기판의 구조를 보인 사시도.5 is a perspective view showing the structure of a silk printed substrate used to apply a coating material to the exposed lead portion.

제6도는 본 발명에 의한 방법으로 만들어진 버텀 리드 패키지의 구조를 보인 사시도.Figure 6 is a perspective view showing the structure of the bottom lid package made by the method according to the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

6 : 하금형 7 : 상금형6: lower mold 7: upper mold

11 : 반도체 칩 12 : 리드프레임11: semiconductor chip 12: lead frame

12a : 리드 12a' : 노출리드부12a: Lead 12a ': exposed lead part

13 : 와이어 14 : 몰드 마킹 러버13: wire 14: mold marking rubber

15 : 실크 스크린 기관 16 : 몸체15: silk screen organ 16: body

본 발명의 목적은 외부의 회로 단자와 연결할 수 있는 노출드리부를 갖는 리드와 통전될 수 있도록 반도체 칩의 패드를 와이어로 본딩하는 단계와, 상기와 같이 반도체 칩의 패드와 와이어로 본딩된 상기 리드의 노출리드부에 내열성이 강한 도포물질을 도포하는 단계와, 상기와 같이 반도체 칩의 패드와 리드가 와이어 본딩되고 노출리드부가 도포물질로 도포된 상태에서 상기 반도체 칩과 와이어를 외부의 파손인자들로부터 보호할 수 있는 몰딩물로 몸체를 만들기 위하여 금형에 장입하는 단계와, 상기 금형에 몰딩물을 주입하여 몸체를 만드는 단계와, 상기 몸체가 만들어진 상태에서 상기 금형을 분리하고 상기 노출리드부에 도포된 도포물질을 제거하는 단계로 만들어지는 것을 특징으로 하는 버텀 리드 패키지의 제조 방법에 의하여 달성된다.An object of the present invention is to bond a pad of a semiconductor chip with a wire so as to be energized with a lead having an exposed drift portion that can be connected to an external circuit terminal, and as described above of the lead bonded to the pad and the wire of the semiconductor chip Applying a coating material having a high heat resistance to the exposed lead; and as described above, the semiconductor chip and the wire may be removed from external damage factors while the pad and the lead of the semiconductor chip are wire-bonded and the exposed lead is coated with the coating material. Charging the mold to form a body with a protectable molding, injecting a molding into the mold to form a body, separating the mold in the state where the body is made, and applying the exposed lead portion It is achieved by a method of manufacturing a bottom lid package, characterized in that the step of removing the coating material.

다음은, 본 발명에 의한 버텀 리드 패키지의 제조 방법의 일실시예를 첨부된 도면에 의거하여 상세하세 설명한다.Next, an embodiment of a method of manufacturing a bottom lid package according to the present invention will be described in detail with reference to the accompanying drawings.

제4도는 본 발명에 의한 방법으로 반도체 칩의 패드와 리드프레임의 리드를 와이어 본딩하고 상기 리드의 노출리드부에 도포물질을 도포한 상태를 보인 측면도이고, 제5도는 노출리드부에 도포물질을 도포하기 위하여 사용하는 실크 프린트 기관의 구조를 보인 사시도이며, 제6도는 본 발명에 의한 방법으로 만들어진 버텀 리드 패키지의 구조를 보인 사시도이다.FIG. 4 is a side view illustrating a state in which a pad of a semiconductor chip and a lead of a lead frame are wire-bonded by the method according to the present invention and a coating material is applied to the exposed lead of the lead, and FIG. Fig. 6 is a perspective view showing the structure of a silk print organ used for application, and Fig. 6 is a perspective view showing the structure of a bottom lid package made by the method according to the present invention.

본 발명에 의한 버텀 리드 패키지의 제조 방법은 상기 제4도에 도시된 바와 같이, 패턴이 형성된 반도체 칩(11)의 패드(미도시)와 리드프레임(12)에 형성된 리드(12a)와 통전될 수 있도록 와이어(13)본딩하고, 상기와 같이 리드프레임(12)에 다수개의 반도체 칩(11)이 와이어(13)본딩된 리드프레임(12)에서 외부의 회로단자와 연결하는 노출리드부(12a)'에 내열성이 강한 도포물질의 하나인 2액상형의 몰드 마킹 러버(Mold Marking Rubber)(14)를 실크 스크린 방법으로 도포한다.In the method of manufacturing the bottom lead package according to the present invention, as shown in FIG. 4, the pad (not shown) of the patterned semiconductor chip 11 and the lead 12a formed in the lead frame 12 are energized. The exposed lead portion 12a for bonding the wire 13 so as to be connected to an external circuit terminal in the lead frame 12 in which the plurality of semiconductor chips 11 are bonded to the lead frame 12 as described above. The two-component mold marking rubber 14, which is one of coating materials having high heat resistance, is applied by the silk screen method.

이때, 상기 실크 스크린을 하기 위하여 상기 제5도에 도시된 바와 같은 상기 노출리드부(12a')에만 상기 몰드 마킹 러버(14)가 도포될 수 있도록 그 노출리드부(12a')에 대응되는 부분만 관통된 실크 프린트 기판(15)을 형성하여 사용된다.At this time, the portion corresponding to the exposed lead portion 12a 'so that the mold marking rubber 14 can be applied only to the exposed lead portion 12a' as shown in FIG. 5 for the silk screen. Only the perforated silk printed board 15 is formed and used.

상기와 같이 상기 노출리드부(12a')에 몰드 마킹 러버(14)를 도포한 후, 하금형(6)에 상기 반도체 칩(11)이 와이어(13) 본딩된 리드프레임(12)을 위치시킨 다음, 상금형(7)을 상기 하금형(6)에 클램핑하여 에폭시 수지와 같은 몰드물을 주입하므로써, 상기 버텀 리드 패키지의 몸체(16)를 형성하게 된다.After applying the mold marking rubber 14 to the exposed lead portion 12a 'as described above, the lead frame 12 in which the semiconductor chip 11 is bonded to the wire 13 is placed on the lower die 6. Next, the upper mold 7 is clamped to the lower mold 6 to inject a mold such as an epoxy resin, thereby forming the body 16 of the bottom lid package.

상기와 같이 몸체(16)를 형성한 후, 상기 금형(6,7)을 분리하면 상기 도6에 도시된 바와 같이, 노출리드부(12a')에 몰드 마킹 러버(14)가 도포된 다수개의 버텀 리드 패키지가 형성되고, 상기의 버텀 리드 패키지는 하나하나 분리한 후, 상기 노출리드부(12a')에 도포된 몰드 마킹 러버(14)를 진공 흡착기(미도시)를 이용하여 간단하게 제거한다.After the body 16 is formed as described above, when the molds 6 and 7 are separated, as shown in FIG. 6, a plurality of mold marking rubbers 14 are applied to the exposed lead portion 12a ′. A bottom lead package is formed, and the bottom lead package is separated one by one, and then the mold marking rubber 14 applied to the exposed lead portion 12a 'is simply removed using a vacuum adsorber (not shown). .

이때, 상기 노출리드부(12a')에 도포된 몰드 마킹 러버(14)는 상기 몰딩 공정시에 수반되는 열(170℃)에 의하여 고상의 테이프상으로 변화함과 아울러 접착력이 미미하게 되어 상기 진공 흡착기로 손쉽게 제거할 수 있게 되는 것이다.At this time, the mold marking rubber 14 applied to the exposed lead portion 12a 'is changed into a solid tape shape by heat (170 ° C) accompanying the molding process, and the adhesive force is insignificant. It can be easily removed with an adsorber.

상기와 같이 외부의 회로 단자와 통전될 수 있도록 연결하는 노출리드부에 도포물질인 몰드 마팅 러버를 도포하여 몸체를 몰딩한 후, 상기 몰드 마킹 러버를 제거하여 상기 버텀 리드 패키지를 제조하므로써, 상기 몰드 마킹 러버의 제거가 용이하게 되어 생산성이 향상되고, 또 상기 몰드 마킹 러버의 가격이 저렴하여 생산비를 절감할 수 있는 효과가 있다.By molding a body by applying a mold marking rubber, which is a coating material, to an exposed lead portion which is connected to an external circuit terminal so as to be energized as described above, by removing the mold marking rubber to manufacture the bottom lead package, Since the marking rubber is easily removed, productivity is improved, and the mold marking rubber is inexpensive, thereby reducing the production cost.

Claims (3)

외부의 회로 단자와 연결할 수 있는 노출리드부를 갖는 리드와 통전될 수 있도록 반도체 칩의 패드를 와이어로 본딩하는 단계와, 상기와 같이 반도체 칩의 패드와 와이어로 본딩된 상기 리드의 노출리드부에 내열성이 강한 도포물질을 도포하는 단계와, 상기와 같이 반도체 칩의 패드와 리드가 와이어 본딩되고 노출리드부가 도포물질로 도포된 상태에서 상기 반도체 칩과 와이어를 외부의 파손인자들로부터 보호할 수 있는 몰딩물로 몸체를 만들기 위하여 금형에 장입하는 단계와, 상기 금형에 몰딩물을 주입하여 몸체를 만드는 단계와, 상기 몸체가 만들어진 상태에서 상기 금형을 분리하고 상기 노출리드부에 도포된 도포물질을 제거하는 단계로 만들어지는 것을 특징으로 하는 버텀 리드 패키지의 제조 방법.Bonding a pad of the semiconductor chip with a wire so as to be energized with a lead having an exposed lead portion that can be connected to an external circuit terminal, and heat-resistant to the exposed lead portion of the lead bonded with the pad and the wire of the semiconductor chip as described above Applying the strong coating material, and molding which can protect the semiconductor chip and wire from external damage factors while the pad and the lead of the semiconductor chip are wire-bonded and the exposed lead is coated with the coating material as described above. Charging a mold to make a body with water, injecting a molding into the mold to make a body, separating the mold while the body is made, and removing the coating material applied to the exposed lead portion; A method of manufacturing a bottom lead package, characterized in that the step is made. 제1항에 있어서, 상기 도포물질은 2액상형의 몰드 마킹 러버를 사용함을 특징으로 하는 버텀 리드 패키지의 제조 방법.The method of claim 1, wherein the coating material is a two-component mold marking rubber. 제1항에 있어서, 도포물질의 도포는 실크 스크린 방법으로 도포하는 것을 특징으로 하는 버텀 리드 패키지의 제조 방법.The method of claim 1, wherein the coating material is applied by a silk screen method.
KR1019970002580A 1997-01-29 1997-01-29 Method of making buttom lead package KR100214553B1 (en)

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