JPH0263289B2 - - Google Patents
Info
- Publication number
- JPH0263289B2 JPH0263289B2 JP57089088A JP8908882A JPH0263289B2 JP H0263289 B2 JPH0263289 B2 JP H0263289B2 JP 57089088 A JP57089088 A JP 57089088A JP 8908882 A JP8908882 A JP 8908882A JP H0263289 B2 JPH0263289 B2 JP H0263289B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- inert gas
- chemical
- valve
- pressurized inert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Coating Apparatus (AREA)
- Weting (AREA)
- Nozzles (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57089088A JPS58205153A (ja) | 1982-05-25 | 1982-05-25 | 薬液散布装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57089088A JPS58205153A (ja) | 1982-05-25 | 1982-05-25 | 薬液散布装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58205153A JPS58205153A (ja) | 1983-11-30 |
| JPH0263289B2 true JPH0263289B2 (Sortimente) | 1990-12-27 |
Family
ID=13961113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57089088A Granted JPS58205153A (ja) | 1982-05-25 | 1982-05-25 | 薬液散布装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58205153A (Sortimente) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60139354A (ja) * | 1983-12-28 | 1985-07-24 | Nissei Oobaru Kk | 低圧噴霧装置 |
| KR100582837B1 (ko) * | 2003-12-23 | 2006-05-23 | 동부일렉트로닉스 주식회사 | 웨이퍼 평탄화 장치 및 방법 |
| JP5887089B2 (ja) * | 2011-09-14 | 2016-03-16 | アドバンス電気工業株式会社 | 液体供給装置 |
| JP6173192B2 (ja) * | 2013-12-03 | 2017-08-02 | 株式会社ディスコ | 液体噴射装置 |
| JP2016172244A (ja) * | 2015-03-18 | 2016-09-29 | リンテック株式会社 | 塗工液供給装置、塗工液供給方法、積層体の製造方法、ガスバリアフィルムの製造方法、積層体、およびガスバリアフィルム |
-
1982
- 1982-05-25 JP JP57089088A patent/JPS58205153A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58205153A (ja) | 1983-11-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8136477B2 (en) | Apparatus for and method of dispensing chemical solution in spin-coating equipment | |
| US9086190B2 (en) | Chemical supply system, substrate treatment apparatus incorporating the same, and coating and developing system incorporating the same apparatus | |
| JPH0220135B2 (Sortimente) | ||
| US7942967B2 (en) | Method and system of coating polymer solution on a substrate in a solvent saturated chamber | |
| US7237581B2 (en) | Apparatus and method of dispensing photosensitive solution in semiconductor device fabrication equipment | |
| JPH0263289B2 (Sortimente) | ||
| US5858466A (en) | Photoresist supply system with air venting | |
| JPH0929158A (ja) | 回転式塗布装置 | |
| JP2815064B2 (ja) | 半導体ウエハに液を塗布する塗布装置及び塗布方法 | |
| US5279926A (en) | Method and apparatus for removing vapor from a pressurized sprayed liquid in the manufacture of semiconductor integrated circuits | |
| JP2558490B2 (ja) | 現像装置 | |
| JP2759152B2 (ja) | 液体処理装置及び液体処理方法及びレジスト塗布装置 | |
| JPS62121670A (ja) | 薬液塗布装置 | |
| JPS60247642A (ja) | スプレ−方法 | |
| JP3542880B2 (ja) | 液供給装置 | |
| JPS6376327A (ja) | レジスト吐出・吸引装置 | |
| JPH0217968A (ja) | 塗布装置およびこれを用いた塗布方法 | |
| WO2019205390A1 (zh) | 显影装置及方法 | |
| JP2929641B2 (ja) | スピン塗布装置用のチャンバ装置及び塗膜形成方法 | |
| JPH07153671A (ja) | 気体圧力式液体噴出方法及びその実施装置 | |
| JPH03263816A (ja) | 処理方法 | |
| JPH1119570A (ja) | 液供給機構 | |
| JPH01244618A (ja) | 処理液供給方法 | |
| JPH0746347Y2 (ja) | 薬品処理装置 | |
| KR100545214B1 (ko) | 반도체 제조공정의 포토레지스트 도포량 저감장치 |