JPS58205153A - 薬液散布装置 - Google Patents
薬液散布装置Info
- Publication number
- JPS58205153A JPS58205153A JP57089088A JP8908882A JPS58205153A JP S58205153 A JPS58205153 A JP S58205153A JP 57089088 A JP57089088 A JP 57089088A JP 8908882 A JP8908882 A JP 8908882A JP S58205153 A JPS58205153 A JP S58205153A
- Authority
- JP
- Japan
- Prior art keywords
- inert gas
- nozzle
- chemical solution
- pressurized inert
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Coating Apparatus (AREA)
- Weting (AREA)
- Nozzles (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57089088A JPS58205153A (ja) | 1982-05-25 | 1982-05-25 | 薬液散布装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57089088A JPS58205153A (ja) | 1982-05-25 | 1982-05-25 | 薬液散布装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58205153A true JPS58205153A (ja) | 1983-11-30 |
| JPH0263289B2 JPH0263289B2 (Sortimente) | 1990-12-27 |
Family
ID=13961113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57089088A Granted JPS58205153A (ja) | 1982-05-25 | 1982-05-25 | 薬液散布装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58205153A (Sortimente) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60139354A (ja) * | 1983-12-28 | 1985-07-24 | Nissei Oobaru Kk | 低圧噴霧装置 |
| JP2005184008A (ja) * | 2003-12-23 | 2005-07-07 | Dongbuanam Semiconductor Inc | ウェハ平坦化装置及び方法 |
| JP2013059735A (ja) * | 2011-09-14 | 2013-04-04 | Advance Denki Kogyo Kk | 液体供給装置 |
| JP2015109304A (ja) * | 2013-12-03 | 2015-06-11 | 株式会社ディスコ | 液体噴射装置 |
| JP2016172244A (ja) * | 2015-03-18 | 2016-09-29 | リンテック株式会社 | 塗工液供給装置、塗工液供給方法、積層体の製造方法、ガスバリアフィルムの製造方法、積層体、およびガスバリアフィルム |
-
1982
- 1982-05-25 JP JP57089088A patent/JPS58205153A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60139354A (ja) * | 1983-12-28 | 1985-07-24 | Nissei Oobaru Kk | 低圧噴霧装置 |
| JP2005184008A (ja) * | 2003-12-23 | 2005-07-07 | Dongbuanam Semiconductor Inc | ウェハ平坦化装置及び方法 |
| JP2013059735A (ja) * | 2011-09-14 | 2013-04-04 | Advance Denki Kogyo Kk | 液体供給装置 |
| JP2015109304A (ja) * | 2013-12-03 | 2015-06-11 | 株式会社ディスコ | 液体噴射装置 |
| JP2016172244A (ja) * | 2015-03-18 | 2016-09-29 | リンテック株式会社 | 塗工液供給装置、塗工液供給方法、積層体の製造方法、ガスバリアフィルムの製造方法、積層体、およびガスバリアフィルム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0263289B2 (Sortimente) | 1990-12-27 |
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