JPH0262770U - - Google Patents

Info

Publication number
JPH0262770U
JPH0262770U JP14127888U JP14127888U JPH0262770U JP H0262770 U JPH0262770 U JP H0262770U JP 14127888 U JP14127888 U JP 14127888U JP 14127888 U JP14127888 U JP 14127888U JP H0262770 U JPH0262770 U JP H0262770U
Authority
JP
Japan
Prior art keywords
pad
lead
solder
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14127888U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14127888U priority Critical patent/JPH0262770U/ja
Publication of JPH0262770U publication Critical patent/JPH0262770U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図は本考案の一実施例の斜視図、第2図は
第1図の印刷配線板に表面実装型電子部品を実装
した状態に対応するA―A′線断面図、第3図は
従来の印刷配線板の一例の斜視図である。 1……表面実装型IC、1a……リード、2…
…パツド、3……はんだ部、4……ソルダレジス
ト層、5……導体回路層、6……非貫通スルーホ
ール。

Claims (1)

    【実用新案登録請求の範囲】
  1. 表面実装型電子部品のリードの先端部をはんだ
    で溶着するパツドと、該パツドの中心部に設けら
    れた前記パツドよりも小さくかつ前記リードより
    も大きい径の非貫通スルーホールと、前記パツド
    の周囲を取囲むソルダレジスト層とを含むことを
    特徴とする印刷配線板。
JP14127888U 1988-10-28 1988-10-28 Pending JPH0262770U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14127888U JPH0262770U (ja) 1988-10-28 1988-10-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14127888U JPH0262770U (ja) 1988-10-28 1988-10-28

Publications (1)

Publication Number Publication Date
JPH0262770U true JPH0262770U (ja) 1990-05-10

Family

ID=31406214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14127888U Pending JPH0262770U (ja) 1988-10-28 1988-10-28

Country Status (1)

Country Link
JP (1) JPH0262770U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270426A (ja) * 2007-04-18 2008-11-06 Alps Electric Co Ltd 電気部品モジュール

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622692A (ja) * 1985-06-28 1987-01-08 株式会社東芝 印刷配線基板
JPS6357774B2 (ja) * 1981-11-06 1988-11-14 Toppan Printing Co Ltd

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6357774B2 (ja) * 1981-11-06 1988-11-14 Toppan Printing Co Ltd
JPS622692A (ja) * 1985-06-28 1987-01-08 株式会社東芝 印刷配線基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270426A (ja) * 2007-04-18 2008-11-06 Alps Electric Co Ltd 電気部品モジュール

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