JPH0258787B2 - - Google Patents

Info

Publication number
JPH0258787B2
JPH0258787B2 JP56122353A JP12235381A JPH0258787B2 JP H0258787 B2 JPH0258787 B2 JP H0258787B2 JP 56122353 A JP56122353 A JP 56122353A JP 12235381 A JP12235381 A JP 12235381A JP H0258787 B2 JPH0258787 B2 JP H0258787B2
Authority
JP
Japan
Prior art keywords
metal layer
metal
contact
semiconductor device
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56122353A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5753932A (show.php
Inventor
Ee Kotsukuramu Chaaruzu
Kee Chia Joan
Efu Kuraidaa Jeimuzu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Santa Barbara Research Center
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Santa Barbara Research Center filed Critical Santa Barbara Research Center
Publication of JPS5753932A publication Critical patent/JPS5753932A/ja
Publication of JPH0258787B2 publication Critical patent/JPH0258787B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10P14/69394—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H10D64/011—
    • H10D64/0116—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/62—Electrodes ohmically coupled to a semiconductor
    • H10P14/60—
    • H10P14/6314—
    • H10P14/6324—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
  • Light Receiving Elements (AREA)
JP56122353A 1980-08-04 1981-08-04 Expired - Lifetime JPH0258787B2 (show.php)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17496380A 1980-08-04 1980-08-04

Publications (2)

Publication Number Publication Date
JPS5753932A JPS5753932A (show.php) 1982-03-31
JPH0258787B2 true JPH0258787B2 (show.php) 1990-12-10

Family

ID=22638251

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56122353A Expired - Lifetime JPH0258787B2 (show.php) 1980-08-04 1981-08-04

Country Status (3)

Country Link
EP (1) EP0045644B1 (show.php)
JP (1) JPH0258787B2 (show.php)
DE (1) DE3176025D1 (show.php)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5954228A (ja) * 1982-09-22 1984-03-29 Toshiba Corp 化合物半導体の陽極酸化装置
JPS60249337A (ja) * 1984-05-24 1985-12-10 Fujitsu Ltd 半導体装置の製造方法
JPS6467964A (en) * 1987-09-08 1989-03-14 Mitsubishi Electric Corp Multilayer electrode structure
JP3278951B2 (ja) * 1992-10-23 2002-04-30 ソニー株式会社 オーミック電極の形成方法
JP2009206357A (ja) * 2008-02-28 2009-09-10 Asahi Kasei Electronics Co Ltd 化合物半導体装置及び化合物半導体装置の製造方法
TWI693642B (zh) * 2017-12-22 2020-05-11 美商雷森公司 用於控制具有將由設置在半導體上的結構所吸收的預定波長之輻射量的方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1469953A (en) * 1973-05-18 1977-04-14 Philips Electronic Associated Semiconductor devices
JPS5141473A (en) * 1974-10-01 1976-04-07 Berumanto Futsuzu Nv Merengeseihin oyobi sonoruijibutsu
US4000508A (en) * 1975-07-17 1976-12-28 Honeywell Inc. Ohmic contacts to p-type mercury cadmium telluride

Also Published As

Publication number Publication date
EP0045644A3 (en) 1984-02-08
EP0045644A2 (en) 1982-02-10
JPS5753932A (show.php) 1982-03-31
DE3176025D1 (en) 1987-04-23
EP0045644B1 (en) 1987-03-18

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