JPH0257353B2 - - Google Patents
Info
- Publication number
- JPH0257353B2 JPH0257353B2 JP60079422A JP7942285A JPH0257353B2 JP H0257353 B2 JPH0257353 B2 JP H0257353B2 JP 60079422 A JP60079422 A JP 60079422A JP 7942285 A JP7942285 A JP 7942285A JP H0257353 B2 JPH0257353 B2 JP H0257353B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric
- internal electrode
- sheet
- electrodes
- raw sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 claims abstract description 24
- 238000010030 laminating Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 18
- 238000003475 lamination Methods 0.000 claims description 8
- 238000010304 firing Methods 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 abstract 1
- 238000006073 displacement reaction Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000010410 layer Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 230000010287 polarization Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000007569 slipcasting Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
Landscapes
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60079422A JPS61239682A (ja) | 1985-04-16 | 1985-04-16 | 積層型圧電バイモルフ素子の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60079422A JPS61239682A (ja) | 1985-04-16 | 1985-04-16 | 積層型圧電バイモルフ素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61239682A JPS61239682A (ja) | 1986-10-24 |
JPH0257353B2 true JPH0257353B2 (US08063081-20111122-C00115.png) | 1990-12-04 |
Family
ID=13689425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60079422A Granted JPS61239682A (ja) | 1985-04-16 | 1985-04-16 | 積層型圧電バイモルフ素子の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61239682A (US08063081-20111122-C00115.png) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3185226B2 (ja) * | 1991-01-30 | 2001-07-09 | 株式会社村田製作所 | 圧電バイモルフ素子の駆動方法及び圧電バイモルフ素子 |
DE4332966A1 (de) * | 1993-09-28 | 1995-03-30 | Philips Patentverwaltung | Torsionsaktuator und ein Verfahren zu dessen Herstellung |
JP7036604B2 (ja) * | 2018-01-30 | 2022-03-15 | 太陽誘電株式会社 | 積層圧電セラミック部品及び圧電デバイス |
JP2019134037A (ja) * | 2018-01-30 | 2019-08-08 | 太陽誘電株式会社 | 積層圧電セラミック部品の製造方法、積層圧電セラミック部品及び圧電デバイス |
JP6998223B2 (ja) * | 2018-01-30 | 2022-01-18 | 太陽誘電株式会社 | 圧電デバイス |
JP7158151B2 (ja) * | 2018-01-30 | 2022-10-21 | 太陽誘電株式会社 | 積層圧電セラミック部品及び圧電デバイス |
US11309481B2 (en) * | 2018-01-30 | 2022-04-19 | Taiyo Yuden Co., Ltd | Multi-layer piezoelectric ceramic component-mounted piezoelectric device |
-
1985
- 1985-04-16 JP JP60079422A patent/JPS61239682A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS61239682A (ja) | 1986-10-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |