JPH0256816B2 - - Google Patents

Info

Publication number
JPH0256816B2
JPH0256816B2 JP59156802A JP15680284A JPH0256816B2 JP H0256816 B2 JPH0256816 B2 JP H0256816B2 JP 59156802 A JP59156802 A JP 59156802A JP 15680284 A JP15680284 A JP 15680284A JP H0256816 B2 JPH0256816 B2 JP H0256816B2
Authority
JP
Japan
Prior art keywords
epoxy resin
aln
powder
resin composition
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59156802A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6135542A (ja
Inventor
Tooru Kamata
Shozo Noguchi
Yasuhiro Kurokawa
Kazuaki Uchiumi
Hideo Takamizawa
Keiichi Yotsuyanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP59156802A priority Critical patent/JPS6135542A/ja
Publication of JPS6135542A publication Critical patent/JPS6135542A/ja
Publication of JPH0256816B2 publication Critical patent/JPH0256816B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59156802A 1984-07-27 1984-07-27 樹脂封止型半導体装置 Granted JPS6135542A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59156802A JPS6135542A (ja) 1984-07-27 1984-07-27 樹脂封止型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59156802A JPS6135542A (ja) 1984-07-27 1984-07-27 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS6135542A JPS6135542A (ja) 1986-02-20
JPH0256816B2 true JPH0256816B2 (cs) 1990-12-03

Family

ID=15635638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59156802A Granted JPS6135542A (ja) 1984-07-27 1984-07-27 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPS6135542A (cs)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2583261B2 (ja) * 1988-01-14 1997-02-19 電気化学工業株式会社 充填剤
JPH01182357A (ja) * 1988-01-14 1989-07-20 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPH03287654A (ja) * 1990-04-05 1991-12-18 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JPH0496929A (ja) * 1990-08-14 1992-03-30 Shin Etsu Chem Co Ltd エポキシ樹脂組成物及び半導体装置
JPH06163751A (ja) * 1992-11-17 1994-06-10 Kyocera Corp 半導体装置
JP2826049B2 (ja) * 1992-11-18 1998-11-18 松下電子工業株式会社 半導体装置およびその製造方法
WO1996020501A1 (en) * 1994-12-27 1996-07-04 National Semiconductor Corporation An integrated circuit package encapsulated by fiber laden molding material and its method of manufacturing
JP2004063656A (ja) * 2002-07-26 2004-02-26 Toshiba Corp 熱電変換装置
JP7735830B2 (ja) * 2021-12-03 2025-09-09 株式会社プロテリアル 抵抗器及びその製造方法

Also Published As

Publication number Publication date
JPS6135542A (ja) 1986-02-20

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