JPH025551Y2 - - Google Patents
Info
- Publication number
- JPH025551Y2 JPH025551Y2 JP6498685U JP6498685U JPH025551Y2 JP H025551 Y2 JPH025551 Y2 JP H025551Y2 JP 6498685 U JP6498685 U JP 6498685U JP 6498685 U JP6498685 U JP 6498685U JP H025551 Y2 JPH025551 Y2 JP H025551Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- connecting arms
- rack
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 6
- 239000010949 copper Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6498685U JPH025551Y2 (zh) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6498685U JPH025551Y2 (zh) | 1985-04-30 | 1985-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61182071U JPS61182071U (zh) | 1986-11-13 |
JPH025551Y2 true JPH025551Y2 (zh) | 1990-02-09 |
Family
ID=30596575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6498685U Expired JPH025551Y2 (zh) | 1985-04-30 | 1985-04-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH025551Y2 (zh) |
-
1985
- 1985-04-30 JP JP6498685U patent/JPH025551Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61182071U (zh) | 1986-11-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3607707A (en) | Plating and anodizing bath racks | |
US5020677A (en) | Common rack system for anodizing and painting large parts | |
US3118545A (en) | Anodizing rack structure | |
JPH025551Y2 (zh) | ||
JPH05148693A (ja) | 電気銅鍍金用治具 | |
JP3001882B1 (ja) | プリント基板の保持装置 | |
CN218621107U (zh) | 一种电镀阳极机构和电镀设备 | |
CN217438331U (zh) | 挂具 | |
JP2615863B2 (ja) | 電解用陰極板 | |
JPS6029169U (ja) | 電気めっき装置 | |
CN218860946U (zh) | 挂具 | |
JP2002047599A (ja) | プリント基板メッキ用治具 | |
US1963363A (en) | Plating fixture | |
JPS621249Y2 (zh) | ||
JPH04106365U (ja) | 薄板用めつき治具 | |
KR102512502B1 (ko) | 도금용 행거 | |
KR102380080B1 (ko) | 전기도금용 지그 | |
JPH05320994A (ja) | プリント回路板の電解メッキ用治具 | |
JPH0368189A (ja) | 印刷配線基板の電気めっき治具 | |
JP3582830B2 (ja) | ワークハンガーの幅決め具の連結構造 | |
KR0130424Y1 (ko) | 전착도장용 행거 | |
JPH0342041Y2 (zh) | ||
JPS5917898Y2 (ja) | めつき用ラツク | |
JP2971047B2 (ja) | プリント基板めっき用の保持ラック | |
JPH0643178Y2 (ja) | プリント配線基板の電解めっきにおける基板連結用ブラケット |