JPH025551Y2 - - Google Patents
Info
- Publication number
- JPH025551Y2 JPH025551Y2 JP6498685U JP6498685U JPH025551Y2 JP H025551 Y2 JPH025551 Y2 JP H025551Y2 JP 6498685 U JP6498685 U JP 6498685U JP 6498685 U JP6498685 U JP 6498685U JP H025551 Y2 JPH025551 Y2 JP H025551Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- connecting arms
- rack
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 6
- 239000010949 copper Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
【考案の詳細な説明】
「産業上の利用分野」
本考案はプリント基板のメツキ用ハンガーに係
り、更に詳しくは、プリント基板をメツキ液中に
吊るす為のハンガーであつて、メツキ層厚を一定
にすることができると共に、製作が容易なプリン
ト基板のメツキ用ハンガーに関する。[Detailed description of the invention] "Industrial application field" The present invention relates to a hanger for plating printed circuit boards, and more specifically, it is a hanger for suspending printed circuit boards in a plating liquid, and the thickness of the plating layer is kept constant. The present invention relates to a hanger for plating printed circuit boards that can be easily manufactured.
「従来の技術」
周知の通り、プリント基板を電気メツキする時
には、プリント基板をメツキ液中に吊るして行な
つている。即ち、プリント基板と、該プリント基
板にメツキしようとする金属（一般的にはプリン
ト基板に鋼メツキする場合が多く、従つて金属は
銅であることが多い。）をメツキ液中に吊るし、
金属には直流のプラス電極を接続し、プリント基
板には同じく直流のマイナスを接続して行なつて
いる。このように接続して各々の電極に電流を流
すと、液中のプラスの金属イオンはマイナスのプ
リント基板に到達して表面に固着し、液中のマイ
ナスイオンはプラスの金属に到達して金属を溶か
してメツキは進行する。``Prior Art'' As is well known, when electroplating a printed circuit board, the printed circuit board is suspended in a plating solution. That is, a printed circuit board and the metal to be plated on the printed circuit board (generally, printed circuit boards are often plated with steel, so the metal is often copper) are suspended in a plating solution,
A positive DC electrode is connected to the metal, and a negative DC electrode is connected to the printed circuit board. When connected in this way and a current is applied to each electrode, the positive metal ions in the liquid reach the negative printed circuit board and stick to the surface, and the negative ions in the liquid reach the positive metal and become oxidized. Metsuki progresses by melting.
電気メツキは上記のようなメカニズムで進行す
るものであるから、プリント基板の全面に均一に
メツキする為には、プリント基板の全面に均一に
電流を流すようにすることが必要である。 Since electroplating proceeds according to the mechanism described above, in order to uniformly plate the entire surface of the printed circuit board, it is necessary to uniformly apply current to the entire surface of the printed circuit board.
従来は、プリント基板をメツキ液中に吊るす為
のハンガーとしては、直線状の部材を対向配置せ
しめ、各々の部材の側面上に所定間隔を置いて枝
を突設したものを多く使用している。 Conventionally, hangers for suspending printed circuit boards in plating liquid often consist of linear members arranged opposite each other, with branches protruding from the sides of each member at predetermined intervals. .
そしてプリント基板のハンガーへの固定は、プ
リント基板を上記枝に掛止めして行なつている。 The printed circuit board is fixed to the hanger by hanging the printed circuit board on the branch.
「考案が解決しようとする問題点」
上記のように枝に掛止めしてプリント基板をハ
ンガーに固定しているので、次のような不具合、
又は改善すべき問題点を内在している。即ち、
イ．メツキ層が不均一になることが多い。これ
は、ハンガーからプリント基板への電流が主とし
て枝の部分から集中的に行なわれている為に、電
流がプリント基板の全面に渡つて均一的に流れな
い為と思われる。特にプリント基板の周縁が濃
く、中央部分が薄くなる傾向がある。又ロ．ハン
ガーから枝が突設されているので、この枝が他に
掛かり易く、取扱いが大変である。更にハ．枝の
取着に手間費間を要し、製作工数が多くなつてし
まう。``Problems that the invention attempts to solve'' Since the printed circuit board is fixed to the hanger by hanging it on a branch as described above, the following problems occur.
Or there are problems that need to be improved. That is,
stomach. The plating layer is often uneven. This seems to be because the current from the hanger to the printed circuit board is concentrated mainly from the branches, and therefore the current does not flow uniformly over the entire surface of the printed circuit board. In particular, the edges of the printed circuit board tend to be thicker and the center portion tends to be thinner. Also b. Since branches protrude from the hanger, these branches tend to hang onto other objects, making it difficult to handle. Furthermore c. Attaching the branches requires time and effort, and the number of manufacturing steps increases.
本考案は述上の点に鑑み成されたものであり、
従つてその目的とする所は、プリント基板上に
形成するメツキ層厚を一定にすることができ、特
に周縁が濃くなることを防止することができ、又
プリント基板をハンガー上にしつかりと固定す
ることができ、更に、取り扱いが容易であつ
て、そして又製作が容易なプリント基板のメツ
キ用ハンガーを提供するにある。 This invention was created in view of the above points,
Therefore, the purpose of this is to make the thickness of the plating layer formed on the printed circuit board constant, to prevent thickening of the plating layer especially at the periphery, and to firmly fix the printed circuit board on the hanger. To provide a hanger for plating printed circuit boards that is easy to handle, easy to manufacture, and easy to handle.
「問題点を解決する為の手段」
本考案は上記問題点を解決する為に次の技術的
手段を有する。"Means for solving the problems" The present invention has the following technical means to solve the above problems.
即ち、実施例に対応する添付図面中の符号を用
いて、これを説明すると、一方と他方の直線状部
材を対向配置せしめてラツク部を形成し、該ラツ
ク部にプリント基板を固定してメツキ液中に吊す
ようにしたプリント基板のメツキ用ハンガーに於
いて、上記一方と他方の直線状部材８，９を、細
長い帯状の金属板１７を順次折曲げして形成する
と共に、これらの直線状部材８，９の上端部１０
には上部接続アーム１１，１２を、下端部１３に
は下部接続アーム１４，１５を各々取着し、上部
接続アーム１１，１２及び下部接続アーム１４，
１５の内、少なくともいずれか一方の上下の接続
アーム１２，１５には長さ調節用の長孔１６を形
成し、これらの上部アーム１１，１２同志及び下
部アーム１４，１５同志を、ボルト締めしてラツ
ク部３を形成し、且つ上記金属板の折り曲げを、
左右両側部１８，１９を中央に向けて折り返して
中央部を帯状の支持面２０として形成すると共
に、一側端部１７ａ及び他側端部１７ｂ間に所定
間隔ｔが存するように、それらを立ち上げて、そ
の間隔ｔを存して面対する一側端部１７ａと他側
端部１７ｂ間をプリント基板２を挟持する為の溝
２１として形成したプリント基板のメツキ用ハン
ガーである。 That is, to explain this using the reference numerals in the attached drawings that correspond to the embodiments, one linear member and the other linear member are arranged facing each other to form a rack portion, and a printed circuit board is fixed to the rack portion and plated. In a hanger for plating a printed circuit board that is suspended in a liquid, the one and the other linear members 8 and 9 are formed by sequentially bending a long and narrow metal plate 17, and these linear members Upper end 10 of members 8, 9
Upper connecting arms 11, 12 are attached to the upper connecting arms 11, 12, and lower connecting arms 14, 15 are attached to the lower end portion 13, respectively.
A long hole 16 for adjusting the length is formed in at least one of the upper and lower connecting arms 12, 15 among the upper and lower connecting arms 12, 15, and the upper arms 11, 12 and the lower arms 14, 15 are bolted together. to form the rack part 3, and bend the metal plate,
The left and right sides 18 and 19 are folded back toward the center to form a belt-shaped support surface 20 at the center, and they are stood up so that a predetermined distance t exists between one end 17a and the other end 17b. This is a hanger for plating a printed circuit board, in which a groove 21 for holding the printed circuit board 2 is formed between one end 17a and the other end 17b which face each other with a distance t between them.
「作用」
本考案のプリント基板のメツキ用ハンガーは上
記の如く構成したものであるから、プリント基板
をハンガー本体に固定する時には、一方と他方の
直線状部材に形成された挟持部にプリント基板の
左右両端面を挟持せしめて行う。このようにして
プリント基板を挟持部に挟持させた後は、上部ア
ーム同志及び下部アーム同志をボルト締にてしつ
かりと固定する。このようにしてプリント基板を
ラツク部に固定するものであるからしつかりと固
定することができ、不測にはずれたりすることが
無い。"Function" Since the printed circuit board plating hanger of the present invention is constructed as described above, when fixing the printed circuit board to the hanger main body, the printed circuit board is held in the clamping portion formed on one and the other linear member. This is done by pinching both the left and right end surfaces. After the printed circuit board is held between the holding parts in this manner, the upper arms and the lower arms are firmly fixed with bolts. Since the printed circuit board is fixed to the rack in this way, it can be firmly fixed and will not come off unexpectedly.
そしてプリント基板とラツク部との接触は、プ
リント基板の左右両端の表裏全面が挟持部に挟持
されて広く行なわれている。その為電気よけ効果
があり、基板サイドの部分のメツキ厚が調整され
て、均一なメツキ層を形成することができる。 The contact between the printed circuit board and the rack section is generally made such that the front and back surfaces of both left and right ends of the printed circuit board are held by the holding sections. Therefore, it has an electric shielding effect, and the plating thickness on the side of the substrate can be adjusted to form a uniform plating layer.
又、ラツク部には枝等が突設されていないの
で、保管や作業が容易で取扱い易い。 Furthermore, since there are no protruding branches or the like on the rack, it is easy to store and work, and is easy to handle.
「実施例」
次に添付図面に従い本考案の好適な実施例につ
いて詳述する。"Embodiments" Next, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
図中１はハンガー本体１を示し、プリント基板
２を固定する為のラツク部３と、その上部に取着
された掛止用フツク４，４により構成されてい
る。 In the figure, reference numeral 1 indicates a hanger main body 1, which is composed of a rack part 3 for fixing a printed circuit board 2, and hooks 4, 4 for hanging attached to the upper part of the rack part 3.
上記ラツク部３は一方と他方のラツク部材５，
６を有し、これらのラツク部材５，６はボルト・
ナツト７によつて互いに連結されている。 The rack part 3 includes one rack member 5 and the other rack member 5,
6, and these rack members 5, 6 have bolts and
They are connected to each other by nuts 7.
そして、これらのラツク部材５，６は直線状部
材８，９の各々の上端部１０に、それを構成する
上部接続アーム１１，１２を側方に向けて取着す
ると共に、下端部１３に、それを構成する下部接
続アーム１４，１５を取着して構成したものであ
る。これらの上下の接続アーム１１，１２，１
３，１４には各々ボルト挿通孔が形成されてお
り、他方のラツク部材６側に取着された上部接続
アーム１２と下部接続アーム１５上には長さ調節
用の長孔１６，１６が形成されている。 These rack members 5 and 6 are attached to the upper end portions 10 of each of the linear members 8 and 9 with the upper connecting arms 11 and 12 composing the rack members facing sideways, and to the lower end portions 13 of the rack members 5 and 6. It is constructed by attaching the lower connecting arms 14 and 15 that constitute it. These upper and lower connecting arms 11, 12, 1
3 and 14 are each formed with a bolt insertion hole, and elongated holes 16 and 16 for length adjustment are formed on the upper connecting arm 12 and lower connecting arm 15 attached to the other rack member 6 side. has been done.
即ち、一方のラツク部材５の上部接続アーム１
１と、他方のラツク部材６の上部接続アーム１
２、及び一方のラツク部材５の下部接続アーム１
４と他方のラツク部材１５を各々ボルト・ナツト
７……によつて連結せしめた時に、一方と他方の
直線状部材８，９間の長さｌを調節することがで
きるようになつている。 That is, the upper connecting arm 1 of one rack member 5
1 and the upper connecting arm 1 of the other rack member 6
2, and the lower connecting arm 1 of one rack member 5
4 and the other rack member 15 are connected by bolts and nuts 7, respectively, the length l between the one and the other linear members 8, 9 can be adjusted.
上記直線状部材８，９はラツク部３を構成する
為の部材であり、又それ自体でプリント基板２を
固定することができるように形成されており、細
長い金属板を順次折り曲げて形成したものであ
る。 The linear members 8 and 9 are members for constructing the rack part 3, and are formed so as to be able to fix the printed circuit board 2 by themselves, and are formed by sequentially bending elongated metal plates. It is.
この折り曲げは第３図に示すような、細長く形
成された薄い金属板１７、例えばステンレス板の
左右両側１８，１９を先ず中央に向けて折り返し
て、中央部を細長い帯状の支持面２０として形成
する。次いで、一側端部１７ａと他側端部１７ｂ
間に所定間隔ｔが存するように、それらを立ち上
げて、この左右両側部１８，１９を面対せしめて
形成した溝２１がプリント基板基板２を挟持する
為の挟持部である。 In this bending, as shown in FIG. 3, the left and right sides 18 and 19 of an elongated thin metal plate 17, for example, a stainless steel plate, are first folded back towards the center to form an elongated belt-shaped support surface 20 at the center. . Next, one end 17a and the other end 17b
A groove 21 formed by raising the left and right sides 18 and 19 so that a predetermined interval t exists between them and facing each other is a holding part for holding the printed circuit board 2.
このように形成した溝２１の上端部及び下端部
は第５図に示すようにせばめられ、且つ側面には
第４図に示すようにボルト挿通孔２２がそれぞれ
２個ずつ穿設されて、上下の接続アームの取付部
２３として形成されている。 The upper and lower ends of the groove 21 thus formed are narrowed as shown in FIG. 5, and two bolt insertion holes 22 are formed in each side as shown in FIG. It is formed as a mounting part 23 of the connecting arm.
尚、図中２４はカソードバー、２５は掛止用フ
ツクに配設された抜け止めである。 In the figure, 24 is a cathode bar, and 25 is a retainer provided on the hook.
次に上記実施例に基き使用例を説明する。 Next, a usage example will be explained based on the above embodiment.
先ず、第７図に示すようなプリント基板２をラ
ツク部３に固定する。上記固定はプリント基板２
の一側端部２ａを、例えば一方の直線状部材８上
に形成された溝２１内に次々に差し込んで挟持さ
せていき、所定の枚数のプリント基板を差し込ん
だら、次に他方の直線状部材９をプリント配線基
板側に押し付けて他側端部２側を、他方の直線状
部材９に形成された溝２１内に差し込む。次いで
ボルト・ナツト７……によつて、上記接続アーム
１１，１２及び下部接続アーム１４，１５同志を
接続せしめればよい。 First, a printed circuit board 2 as shown in FIG. 7 is fixed to the rack part 3. The above fixation is printed circuit board 2
For example, one side end 2a is inserted one after another into a groove 21 formed on one linear member 8 and held therebetween, and when a predetermined number of printed circuit boards are inserted, then the other linear member 8 is inserted. 9 is pressed against the printed wiring board side, and the other end 2 side is inserted into the groove 21 formed in the other linear member 9. Next, the connecting arms 11 and 12 and the lower connecting arms 14 and 15 may be connected to each other using bolts and nuts 7.
このようにしてラツク部３上に固定されたプリ
ント基板２……は左右両側端部２ａ，２ｂの表面
及び裏面の全長に渡つて溝２１内に挟持され、且
つ一方と他方の直線状部材８，９は上部接続アー
ム１１，１２と下部接続アーム１４，１５を介し
てしつかりと固定されてるので、不測に離脱した
りすること無く確実に固定することができる。 The printed circuit board 2 . , 9 are firmly fixed via the upper connecting arms 11, 12 and the lower connecting arms 14, 15, so that they can be securely fixed without accidentally coming off.
上記のようにラツク部３に固定されたプリント
基板２……は第１０図に示すようにメツキ液２６
中に吊るされる。上記メツキ液２６は、銅メツキ
を行う場合には、硫酸銅、硫酸及び水から成り、
メツキ槽２７の上部に配設されたカソードバー２
４に掛止用フツク４を掛止して吊り下げが行われ
る。 The printed circuit board 2 fixed to the rack part 3 as described above is coated with plating liquid 2 as shown in FIG.
hung inside. When performing copper plating, the plating liquid 26 consists of copper sulfate, sulfuric acid and water,
Cathode bar 2 arranged at the top of plating tank 27
4 is hung with a hook 4 for hanging.
他方陽極２８側には銅板２９が吊り下げられて
おり、各々の電極２４，２８に直流を流すと、メ
ツキ液２６中のプラスの銅イオンCu2+はマイナ
ス側に接続されたプリント基板２に到達して金属
銅となり、マイナスの硫酸イオンSO4 2-はプラス
側に接続された銅板２９に到達して銅を溶かし、
メツキは進行する。 On the other hand, a copper plate 29 is suspended on the anode 28 side, and when direct current is applied to each electrode 24 and 28, the positive copper ions Cu 2+ in the plating liquid 26 are transferred to the printed circuit board 2 connected to the negative side. The negative sulfate ion SO 4 2- reaches the copper plate 29 connected to the positive side and melts the copper.
Metsuki progresses.
電気メツキは上記のようにして行なわれるの
で、プリント基板の全面に渡つて電流が均一に流
れるようにすることが重要である。 Since electroplating is performed as described above, it is important to ensure that the current flows uniformly over the entire surface of the printed circuit board.
何故ならば、例えば第７図に示すような、ガラ
ス板３０の表面と裏面に銅板３１，３２を配設
し、配線パターンに応じた複数の透孔３３が穿設
されたプリント基板２を、表面と裏面の銅板３
１，３２間を導通せしめる為に電気メツキする場
合に、プリント基板２の全面に渡つて均一的なメ
ツキ層を形成することが重要である。これは電気
メツキを行なつた後に、プリント基板上に例えば
写真焼付法等によつて配線パターンを描き、配線
パターン以外の銅をエツチング液で溶かして除去
する時に、メツキ層厚にムラがあると良好なエツ
チングがしにくい為である。 This is because, for example, as shown in FIG. 7, a printed circuit board 2 in which copper plates 31 and 32 are arranged on the front and back surfaces of a glass plate 30 and a plurality of through holes 33 are bored according to the wiring pattern is used. Copper plate 3 on the front and back sides
When electroplating is performed to establish conduction between the printed circuit board 2 and the printed circuit board 2, it is important to form a uniform plating layer over the entire surface of the printed circuit board 2. This is because after electroplating, a wiring pattern is drawn on the printed circuit board by photoprinting, etc., and when copper other than the wiring pattern is removed by dissolving it with an etching solution, there may be unevenness in the thickness of the plating layer. This is because good etching is difficult.
本件の場合はプリント基板２の一側端部２ａと
他側端部２ｂの表裏を全長に渡つて溝２１で挟持
しながら、電流を流すようにしたものであるか
ら、電流が表面及び裏面上を均一的に流れやすく
なり、従つて均一なメツキ層を形成することがで
きるものである。 In this case, the current is passed through the groove 21 across the entire length of the printed circuit board 2 between the front and back sides of the one end 2a and the other end 2b. It becomes easy to flow uniformly, and therefore a uniform plating layer can be formed.
いわゆる。プリント基板の周縁だけが厚くな
る、焦げを防止できるものである。 So-called. This prevents only the peripheral edges of the printed circuit board from becoming thicker and scorching.
このようにプリント基板２を溝２１内に挟持し
てラツク部３に固定するようにしたので、邪魔な
枝等が突設されておらず、従つて保管時に積み重
ねて保管したりすることが容易であり、作業時に
枝が無いので作業しやすい。 Since the printed circuit boards 2 are sandwiched in the grooves 21 and fixed to the rack part 3 in this way, there are no protruding branches or the like that would get in the way, and therefore it is easy to stack them for storage. It is easy to work because there are no branches when working.
更に、一方と他方の直線状部材８，９は細長い
金属板１７を折り曲げて形成したものであつて容
易に製作することができる利点がある。 Furthermore, the linear members 8 and 9 on one side and the other side are formed by bending a long and thin metal plate 17, which has the advantage of being easy to manufacture.
「考案の効果」
以上詳述した如く本考案はプリント基板２の
一側端部２ａと他側端部２ｂの表面及び裏面の全
面を溝２１で挟持し、且つ電流が流れるようにし
たので、プリント基板の表面及び裏面の全面に渡
つて均一的に電流を流し易く、プリント基板の周
縁のメツキ厚が厚くなり、焦げが防止でき、従つ
て均一的なメツキ層を形成することができ、又
プリント基板２の左右両端部２ａ，２ｂを一方と
他方の直線状部材８，９によつてしつかりと確実
に固定することができて、一担固定したら不測に
離脱したりすることが無く、更にプリント基板
を掛止する為の枝が外方に向けて突設されてない
ので保管や作業時の取扱いが容易であり、そして
又一方と他方の直線状部材８，９は、細長い金
属板１７を折り曲げるだけで形成することができ
るので、製作が容易であるプリント基板のメツキ
用ハンガーを提供する等種々の利点を有する。"Effects of the Invention" As detailed above, in the present invention, the entire surfaces of the front and back surfaces of the one end 2a and the other end 2b of the printed circuit board 2 are sandwiched between the grooves 21, and the current is allowed to flow. It is easy to pass current uniformly over the entire front and back surfaces of the printed circuit board, the plating thickness at the periphery of the printed circuit board becomes thicker, scorching can be prevented, and a uniform plating layer can be formed. Both left and right ends 2a and 2b of the printed circuit board 2 can be firmly and reliably fixed by the linear members 8 and 9 on one side and the other, and once fixed, they will not come off unexpectedly. Furthermore, since there are no branches protruding outward for hanging the printed circuit board, it is easy to store and handle during work, and the linear members 8 and 9 on one side and the other side are made of elongated metal plates. Since it can be formed by simply bending the plate 17, it has various advantages such as providing a hanger for plating printed circuit boards that is easy to manufacture.
添付図面は本考案の実施例を示し、第１図は正
面図、第２図は側面図、第３図は一方と他方の直
線状部材を形成する為の金属板の平面図、第４図
は直線状部材の側面図、第５図は同じく直線状部
材の正面図、第６図は第５図中Ａ−Ａ線に沿う断
面図、第７図はプリント基板の斜視図、第８図は
第７図中Ｂ−Ｂ線に沿う拡大断面図、第９図はプ
リント基板を挟持している態様を示す斜視図、第
１０図は電気メツキの原理説明である。
尚、図中１……本体、２……プリント基板、８
……一方の直線状部材、９……他方の直線状部
材、１０……上端部、１１，１２……上部接続ア
ーム、１３……下端部、１４，１５……下部接続
アーム、１６……長孔、１７……金属板、１７ａ
……一側端部、１７ｂ……他側端部、１８……左
側部、１９……右側部、２０……支持面、２１…
…溝、ｔ……所定間隔を示している。
The accompanying drawings show an embodiment of the present invention; FIG. 1 is a front view, FIG. 2 is a side view, FIG. 3 is a plan view of a metal plate for forming one and the other linear member, and FIG. is a side view of the linear member, FIG. 5 is a front view of the same linear member, FIG. 6 is a sectional view taken along line A-A in FIG. 5, FIG. 7 is a perspective view of the printed circuit board, and FIG. 7 is an enlarged sectional view taken along the line B-B in FIG. 7, FIG. 9 is a perspective view showing a mode in which a printed circuit board is held, and FIG. 10 is an explanation of the principle of electroplating. In addition, in the figure 1...Main body, 2...Printed circuit board, 8
...One linear member, 9... Other linear member, 10... Upper end, 11, 12... Upper connecting arm, 13... Lower end, 14, 15... Lower connecting arm, 16... Long hole, 17...Metal plate, 17a
...One side end, 17b...Other side end, 18...Left side, 19...Right side, 20...Supporting surface, 21...
...Groove, t... indicates a predetermined interval.
Claims (1)
ツク部を形成し、該ラツク部にプリント基板を固
定してメツキ液中に吊すようにしたプリント基板
のメツキ用ハンガーに於いて、上記一方と他方の
直線状部材８，９の上端部１０には上部接続アー
ム１１，１２を、下端部１３には下部接続アーム
１４，１５を各々取着し、上部接続アーム１１，
１２及び下部接続アーム１４，１５の内、少なく
ともいずれか一方の上下の接続アーム１２，１５
には長さ調節用の長孔１６を形成し、これらの上
部接続アーム１１，１２同志及び下部接続アーム
１４，１５同志をボルト締めしてラツク部３を形
成し、且つ上記一方と他方の直線状部材８，９
は、細長い帯状の金属板を順次折曲して形成した
ものであつて、この金属板の折り曲げは、左右両
側１８，１９を中央に向けて折り返して中央部を
帯状の支持面２０として形成すると共に、一側端
部１７ａ及び他側端部１７ｂ間に所定間隔ｔが存
するように、それらを立ち上げて、その間隔ｔを
存して面対する一側端部１７ａと他側端部１７ｂ
間をプリント基板２を挟持する為の溝２１となる
ように形成したことを特徴とするプリント基板の
メツキ用ハンガー。 In a hanger for plating a printed circuit board, the one and the other linear members are disposed facing each other to form a rack, and the printed circuit board is fixed to the rack and suspended in a plating solution. Upper connecting arms 11 and 12 are attached to the upper ends 10 of the linear members 8 and 9, and lower connecting arms 14 and 15 are attached to the lower ends 13 of the linear members 8 and 9, respectively.
12 and lower connecting arms 14, 15, at least one of the upper and lower connecting arms 12, 15
A long hole 16 for adjusting the length is formed in the upper connecting arms 11, 12 and the lower connecting arms 14, 15 are bolted together to form the rack part 3, and the straight line between the one and the other is shaped members 8, 9
is formed by sequentially bending an elongated strip-shaped metal plate, and this metal plate is bent by folding the left and right sides 18 and 19 toward the center to form a strip-shaped support surface 20 in the center. At the same time, one end 17a and the other end 17b are raised so that a predetermined distance t exists between them, and the one end 17a and the other end 17b face each other with the distance t between them.
A hanger for plating a printed circuit board, characterized in that a groove 21 for holding a printed circuit board 2 is formed between the gaps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6498685U JPH025551Y2 (en) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6498685U JPH025551Y2 (en) | 1985-04-30 | 1985-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61182071U JPS61182071U (en) | 1986-11-13 |
| JPH025551Y2 true JPH025551Y2 (en) | 1990-02-09 |
Family
ID=30596575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6498685U Expired JPH025551Y2 (en) | 1985-04-30 | 1985-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH025551Y2 (en) |
-
1985
- 1985-04-30 JP JP6498685U patent/JPH025551Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61182071U (en) | 1986-11-13 |
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