JPH0250499A - Device for mounting of electronic component - Google Patents

Abstract

PURPOSE:To eliminate regulating work and to prevent an electronic component from damaging by automatically regulating pressure at the time of mounting the component on a printed board or the like by moving down a suction nozzle in response to the type of the component. CONSTITUTION:A pressurizing drive source 53 for differentiating pressurizing force according to the degree of driving, memory means 103 for storing data relating to pressurizing force at the time of moving in response to the type of an electronic component, and control means 101 for controlling the source 53 on the basis of the data stored in the means 102 are provided. When a nozzle which sucks the component is horizontally moved to move down it on a printed board to mount the component, the source 53 is controlled by the means 101 on the basis of the data stored in the means 103 to mount it while applying predetermined pressurizing force to the nozzle through an elastic member. Thus, a regulating work can be eliminated, and it can prevent the component from being damaged.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component mounting device having a component suction nozzle for transferring components onto a frame or the like.

(B) Prior Art A conventional mounting device of this type is disclosed in Japanese Patent Application Laid-Open No. 61-264792 and the like. According to this, a balance spring is used to remove the influence of the suction nozzle's own weight.
The elastic force of the spring is set so that the elastic force of the suction nozzle cancels out the own weight of the suction nozzle, and the pressure spring applies pressing pressure when mounting the electronic component on the board, lint board, or lead frame. . Furthermore, when an electronic component is suctioned, the pressure spring applies pressing pressure of the suction nozzle to the electronic component.

(8) Problems to be Solved by the Invention Therefore, according to the prior art, it is necessary to replace the pressure spring with one having a different elasticity for each type of electronic component, which has a different size and surface condition, and the pressure resistance of each component itself is different. In addition, the operator had to turn the pressure adjustment bolt to adjust the pressure, which was very troublesome.

Therefore, the present invention aims to automatically adjust the pressure when the component is attached to a printed circuit board or the like by lowering the suction nozzle, and the pressure during suction, depending on the type of electronic component.

(d) Means for Solving the Problems For this purpose, the present invention applies a predetermined pressing force of a printed circuit board, etc., to a nozzle for sucking electronic components using an elastic body, and prints electronic components using the nozzle. In an electronic component mounting device for transferring onto a board, etc., a pressurizing drive source that varies the pressurizing force depending on the degree of driving, and data regarding the pressurizing force during transfer according to the type of the electronic component are stored. It is composed of a storage means and a control means for controlling the drive source based on the data stored in the storage means.

The present invention also provides an electronic component mounting device that applies a predetermined pressure to the electronic component to a nozzle for sucking the electronic component using an elastic body to suction and hold the electronic component and transfer it to a printed circuit board or the like. a pressurizing drive source that varies the pressurizing force depending on the degree of driving; a storage means that stores data regarding the pressurizing force during suction according to the type of the electronic component; and the data stored in the storage means. and control means for controlling the drive source based on.

(v) Function: When the suction nozzle is lowered onto the component supply section to suction the electronic component, the drive source is controlled by the control means based on the pressurizing force data stored in the storage means. A predetermined pressure is applied to the nozzle through the nozzle.

In addition, when the nozzle that has picked up the electronic component is moved horizontally and lowered onto the printed circuit board to mount the electronic component, the drive source is controlled by the control means based on the pressure data stored in the storage means, so that the nozzle is elastically moved. The nozzle is worn while applying a predetermined pressure force to the nozzle through the body.

(f) Example An embodiment of the present invention will be described below based on the drawings.

) is the main body of the electronic component mounting device, and the main body (1) has a conveyor (2) for conveying printed circuit boards (including thick film boards) (P), lead frames, etc. A pair of substrate positioning devices provided (3) <4)
and with four wafer tables <51 (6)
Wafer supports (7) <8> that are movable in the Y force direction and rotatable in the plane direction, and mounting heads (10) (11) that are suspended from the top plate (9) and movable in the XY force directions are provided. It is being

The conveyor (2) has a pair of drive sprockets (12
1 (121, driven sprocket (+31 (131) consists of a pair of chains (14A) (14B) stretched between 6, conveying the material from the upstream side to the downstream side;
At the second time, the chains (14A) and (14B) are provided with engagement pieces (15) standing at a predetermined interval and engaging the rear end of the board (P) in the feeding direction, and the board (P) is held on both sides. Chain (14A
> (14B) and is intermittently conveyed from the upstream side to the downstream side while being locked by each engaging piece (15).

Next, a pair of substrate positioning devices (3i (4i) will be explained, but since both have the same configuration, only one (3) will be explained. The positioning devices (3) and (4) are
Although positioning is performed in the feeding direction of the substrate (P), the positive direction perpendicular to this direction, and the thickness direction of the substrate (P), only the positioning in the feeding direction of the substrate (P) will be described below.

The shaft (18) passing through the bearings (16) (17) of the
) is provided with a clamp cam (19), and the shaft rod (1
8) Left end 1-ri (20) and positioning motor (21)
A belt (23) is stretched between the output shaft pulleys (22). Therefore, by energizing the motor (21), the shaft rod (1
8) rotates, the cam (19) rotates, the vertical member (25) moves up and down via the cam follower (24), and the cam lever (261) also moves up and down accordingly.

Also, when the cam lever (26) moves upward, the movable clamp (
27A) is rotated outward via the pin (28), and the reference clamp (27B) is also rotated by the spring (29) into the bin (30).
both clamps (27A) (27
B) will be located below the substrate (P). Therefore, the cam followers (24) at the ends of the upper and lower members (25) are
Since it comes into pressure contact with the clamp cam (19), the cam (19)
The upper and lower members (25) have a length of 52 that moves up and down in accordance with the shape of.

Next, the wafer support stands (7) and (8) will be explained in detail, but since both have the same structure, only the support stand (7) will be explained. (31) is the XY cable, and the X movement motor (32
), Y movement motor (33), Xl[11i direction guide (34) and Y*4! It is movable in the plane direction along the direction guide (35). Also, the XY child table 3
1) The wafer table (5) placed thereon can be rotated forward and backward by the θ motor (36) 6 Therefore, the desired wafer sheet (38) is placed above the push-up needle device (37). will be located.

Since there are four wafer tables (5), at least one to four types of wafers, each having a different size, can be handled.

Next, one mounting head (10) will be described in detail.

The head (lO) can be moved in the X direction by an X-movement motor (41) shown in FIG. 9 along a ball screw (40A) supported by a support member (39) supported on the top plate (9). , and Y along the guide body (421 (42)
Movement in the Y direction is enabled by the N motor (43).

The output shaft pulley (46) of the vertical motor (45) and the screw shaft (4
7) A belt (49) is stretched between the pulley (48) at the end, and the vertical moving body (50) can be moved up and down by the nut body (51) via the guide body (52).

The vertical moving body (50) is equipped with a pressurizing motor (53).
and a lock solenoid (54) are fixed, and the output shaft of the motor (53) is provided with a lever (5) having a spring-mounted pin (55). The solenoid (5
A mounting bin (58) is provided protruding from the plunger (57) of 4), and the mounting bin (60) is provided protruding from an L-shaped support (59) fixed to the vertical moving body (50). A spring A (61) is stretched between the ends.

The bearing part (62) of the vertical moving body f50 has a support shaft (63).
allows the rocking body (64) to rotate, and the rocking body (64)
4) A U-shaped groove is cut out at the upper end, into which the mounting pin (58) fits, and a pressurized bearing body (65) is provided at the other end of the rocking body (64). ing.

(66) is a fixed bearing body that sandwiches the collar body (b8) protruding from the low rigidity joint (67) with the pressure bearing body (65), and is attached to the end of the support body (59). Between the mounting bin (69) protruding from the three rocking bodies (64) provided and the mounting bin (55) protruding from the lever (56) fixed to the output shaft of the pressurizing motor (53). The pressure bearing body (65) is not required to be moved downward by the spring B (70) which is stretched over the spring B (70).

By controlling the rotation angle of this pressurizing motor (53), the pressing force exerted by the pressurizing bearing body (65)' on the rotary joint (67) and the fixed bearing body (66) can be made variable. . This Pi-B (TO) as an elastic body is similar to Beret (71A), (71
Applying pressing pressure when attaching B) to the substrate (P), or applying pressure when attaching B) to the substrate (P), or attaching the pellet (71A) on the wafer sheath (38).
(71B) is used to apply displacing pressure when adsorbing it.

In addition, a mounting bin (72) protruding from the vertical moving body (50) is provided.
) and a mounting pin (73) protruding from the rotary joint (67), a balance spring C (74) is stretched between the elastic force of the spring C (74) and the suction nozzle body (75).
This elastic force is set so that the self-weights of the adsorption collet (76) and the suction collet (76) are approximately equal, thereby eliminating the influence of the self-weight.

A pin (77) is provided protruding from the rotary joint (67), and a locking piece (78) that fits into this pin (77) is provided.
) prevents the joint (67) from rotating itself.

The suction nozzle body (75) has a rotary joint (67
), a hose (68), etc., to a vacuum source (not shown). The suction nozzle body (75) has an upper and lower guide body (
The nozzle body (75) is movable up and down within the nozzle body (79), but a collection part (80) is formed in the upper part of the nozzle body (75) and the regulating bearing (
81), θ rotation within the upper and lower guide bodies (79) is not possible.

Further, a drive motor (82) is provided inside the head body (44).
), and a belt (85) is stretched between the output shaft pulley (83) and a pulley (84) fixed around the upper and lower guide body (79), and the belt (85) is stretched when the motor (82) is energized. The vertical guide body (79) rotates while being guided by the bearing body (86) via (85), thereby also rotating the suction nozzle body (75) by θ.

The stabbing needle device f (37) has two guide bodies (8
7) (94) are provided, and can be used depending on the size of the pellet. One guide body (87)
corresponds to a small pellet (71A), and the outer diameter of its stage surface is small, which is smaller than the hole diameter of the suction hole (88). A guide passage (90) is formed in the center of the guide body (87) to enable the up-and-down movement of the push-up needle (89), and four suction holes (88) each form one gathering chamber ( 91) and then to a vacuum source via one communication passage (92) and a conduit (93).

The other kite body (94) is a large beret (71).
Corresponding to B), the outer diameter of the stage surface is larger than that of the guide body (87), and the diameter of the suction hole (95) is also larger than that of the suction hole (88). The guide body (94) has, for example, four push-up needles (96).
A guide passageway (97) is formed that allows vertical movement of the suction holes (95), and each of the 8 suction holes (95) communicates with one collection chamber (98), and then connects through one communication passageway (99) and a conduit (1001). The guide body (94) is in communication with a vacuum source.
) is set to be larger than that of the guide body (87).

Next, a control block diagram will be described below based on FIG. A CPU (101) is a central processing unit that performs overall control of the entire electronic component mounting apparatus. (
102) is an RO that stores programs related to mounting operations.
M, +1031 is a RAM that stores various data set by the input device (104+), (105) is a C that displays a predetermined screen by operating the input device +104.
It is RT.

Then, the input device (104) sets the bullet number data as shown in FIG. 9, the bullet data as shown in FIG. 10, and the NC data as shown in FIG. 11, and stores them in the RAM (1031). In other words, Figure 9 shows that 11 types of pellets can be handled, and pellet number 1 is a small pellet with the name 2SC536, which means that n7 of these are bonded.
Figure 0 shows data regarding the size, thickness, pressure force when bonding, pressure force when adsorbing from the wafer sheet (38), etc. of the pellet whose name is 2SC536, and similarly data regarding four types of pellets. is set. Figure 11 shows the input contents of the coordinates on the printed circuit board (CP), the mounting angle of the bullet, and the bullet number. P) It means bonding on the upper bolt (xt, y+), and the next bullet to be bonded is a large one and its name is LA1234.

+1061 is an interface, each motor (53),
(211, (411, (43), (45), (32),
(33) and (36) are each drive circuit (107+, (10
8), (109), (1101, +1111, (11
2), (113), and (1141) are connected to this interface +1061.

The operation of the above configuration will be explained below.

When the drive motor (not shown) is energized, the drive sprocket (121 (12)) rotates and the driven sprocket (+3
1 (131), the printed circuit boards (P) on the chains (14A) (14B) are intermittently conveyed.

When it is detected by the chain (14A>(14B)) that the position of the positioning device (3) has been reached, the power supply to the drive motor is cut off and the conveyance of the printed circuit board (P) is stopped.

Then, the positioning motor (21) is energized and the belt (2
3), the shaft rod (18) rotates, so each cam (1
9) also rotates, and each upper and lower member (25) moves up and down via the cam follower (24) in accordance with the shape of the cam. This regulates the position of the printed circuit board (P) in the feeding direction.

That is, when the upper and lower members (25) descend in accordance with the clamp cam (19) rotated by the energization of the motor (21), the movable clamp (27A) resists the spring (29) and the reference clamp (27B) moves upward. Rotate printed circuit board (P)
The position in the feeding direction is regulated.

A printed circuit board whose position is regulated as described above (
P), but before this mounting, the desired wafer sheet (38
) is moved to station (A), the wafer support stand (7) is rotated in either forward or reverse direction by the θ motor (36).

Next, the X-motion motor (32) and Y-motion motor (33) move each guide (341 (351) along the XY table (
31) and the support stand (7) in the plane direction, and place a small pellet (71A with the name 2SC536) on the desired wafer sheet (38) at a position above the guide body (87) of the thrust needle device (37). ) is located.

Then, the vertical motor (45) is energized and each pulley (
46), (48), and the screw shaft (4) via the belt (49).
7) to lower the vertical moving body (50). Then, since the pressure bearing body (65) is pressed against the rotary joint (67) and the fixed bearing body (66) by the spring B (701) by the pressure motor (53), the suction nozzle body (75) Upper and lower guide body (79)
down to the wafer sheet (38). Therefore, as described above, in conjunction with the needle (89) of the push-up needle device (37), the pellet (71A) can be reliably attracted.

At this time, the RAM (+03)
Since the pressing force is set in the CPU (+01
1 controls the pressurizing drive circuit f107> via the interface (H) 6), and rotates the pressurizing motor (53) by a predetermined angle, and a predetermined pressurizing force is applied by the spring B (70). It will be done.

When picking up a large pellet (71B), the guide body (87) for the large pellet (71B) is positioned directly below the wafer seam (381), making it possible to push up the wafer seam (381). Since the pressurizing force according to the amount is set in the same manner as described above, the motor (53) is controlled so that a predetermined pressurizing force is applied during suction.

After attracting the pellet (71A), the rotation of the motor (45) is reversed, and the vertically moving body (50) is raised by the screw shaft (47) to horizontally move.

During this horizontal movement, energization of the motor (82) causes the pulleys (83), (84), and belt (85) to
The suction nozzle body (75) is rotated by θ by the vertical guide body (79) and the regulation bearing (81), and the bellet (7
1A) is aligned with the mounting direction of the board (P)/\ and moved to a position above the board (P), so that it can be mounted at a desired position on the board (P).

When installing the second part, the printed circuit board (
RAM + so as to apply a predetermined pressing force to P).
CPU U (1011) is set to 103).
controls the pressurization drive circuit (107), and the pressurization motor (5
3) is rotated by a predetermined angle, and the spring B (70
) is applied. Also a large bellet (7
1B), a pressing force corresponding to the bellet (71B>) is applied.

If it is desired to change this pressurizing force, this can be done by setting the rotation angle of the pressurizing motor (53) to a desired value using the input device j+04+.

For example, if the electronic component has a low pressure resistance per unit area, the pressing force is set to be small.

('-) Effects of the Invention As described above, the present invention can automatically adjust the pressure when mounting the component onto a printed circuit board etc. by lowering the suction nozzle and the pressure when sucking the component, depending on the type of electronic component. This eliminates the need for adjustment work and prevents damage to electronic components.

[Brief explanation of the drawing]

Fig. 1 is a plan view of the electronic component mounting device, Fig. 2 is a front view seen from inside the fixing device of the same device in the depth direction, Fig. 3 is a partially sectional front view of the mounting head, and Fig. 4 is Fig. 5 is a partially cutaway plan view of the same head, Fig. 6 is a vertical sectional view of the push-up guide for small pellets, and Fig. 7 is a cut-away plan view of the push-up guide for large pellets. 8 is a block diagram related to the control of this device, FIG. 9 is the pellet number data stored in the RAM, FIG. 10 is the same pellet data 5, FIG. 11 is the same <N
(Data not shown 9 (10) 1ll) ... Mounting head, (53) ...
Pressure motor,

Claims (2)

[Claims] (1) In an electronic component mounting device that applies a predetermined pressing force to a printed circuit board, etc., to a nozzle for adsorbing electronic components using an elastic body, and transfers the electronic component to the printed circuit board, etc. using the nozzle, a pressurizing drive source that varies the pressurizing force depending on the degree of driving; a storage means that stores data regarding the pressurizing force at the time of transfer according to the type of the electronic component; and the data stored in the storage means. and control means for controlling the drive source based on the control means. (2) In an electronic component mounting device that uses an elastic body to apply a predetermined pressure to an electronic component suction nozzle to suction and hold an electronic component and transfer it to a printed circuit board, etc. a pressurizing drive source that varies the pressurizing force depending on the degree of driving; a storage means that stores data regarding the pressurizing force during suction according to the type of the electronic component; and a pressurizing drive source that is based on the data stored in the storage means. and control means for controlling the drive source.