JPS61289693A - Electronic component inserter - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an electronic component insertion machine for inserting electronic components into a printed circuit board. The derived electronic components are made into printed circuit boards.

This invention relates to a device that suppresses the upper part of an electronic component downward when it is inserted.

2. Description of the Related Art In recent years, electronic component mounting technology has become smaller and more dense as products have become lighter, thinner, and smaller, and the types and shapes of electronic components have become more diverse.

Hereinafter, a conventional method for disassembling electronic components will be explained with reference to FIGS. 2 and 3 a-q. The electronic component 1 separated from the electronic component series 5 supplied from a component supply section (not shown) is transferred by holding the lead wire 2 on the transfer chuck 6, and then transferred to the holding claw 16. , lead II2 or electronic component 1
The main body is positioned below the push rod 12 while being held between the legs. Thereafter, the guide pin 8 rises from the lead m fixing device 9 located below the printed circuit board 3, passes through the insertion hole 4 formed in the printed circuit board 3, and passes through the tapered shape provided in the clamping claw 15. Lead #J2 guided to hole 7
is located below. Next, stain the magnetic valve 10 above the electronic component 1. The push rod 12 is lowered by pneumatic pressure from the action of the pressure reducing valve 11, and the gripping claws 16 are opened, so that the electronic component 1 is held between it and the guide pin 8.

Thereafter, the electronic component 1 is inserted into the insertion hole 4 of the printed circuit board 3 by simultaneous lowering of the insertion shaft 13° guide pin 8 holding the push rod 12, and the fixed blade provided in the lead wire fixing device 9 is inserted into the insertion hole 4 of the printed circuit board 3. 17. Lead wire 2 due to the action of movable blade 1e
is cut to a predetermined length and bent to fix the electronic component 1 to the printed circuit board 3, completing the insertion.

Problems to be Solved by the Invention However, with a push rod that maintains constant pressure as described above, if the lead wire is weak as shown in Figures 4 and 6 a and b, it will push the electronic components more than necessary. , the lead wire may buckle during insertion or bend under the neck of the electronic component. Furthermore, when pressing is applied to a weak lead wire, a hard lead wire cannot be sufficiently suppressed and becomes floating from the printed circuit board, resulting in weak adhesion. It is difficult to respond to the smaller diameter of lead wires due to the miniaturization of electronic components such as the This also meant that the range of electronic components that could be automatically inserted was narrowed.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, the present invention provides an electronic component valve control method that allows the suppression of the push rod to be set to an optimum force suitable for the strength of the lead wire of each electronic component.

Means for Solving the Problems In order to solve the above-mentioned problems, the present invention is provided with the ability to set the pressing force of the push rod to a plurality of values or more.

Function: With the above-described configuration, the present invention allows pressure to be set in accordance with the strength of the lead wire of the electronic component, and also enables suppression changes during one cycle of insertion, such as when inserting the electronic component or when the lead wire is stuck. .

Example An embodiment of the present invention will be described below with reference to FIG.

The electronic component 1 is separated from the electronic component series 6 supplied from a component supply section (not shown), and the lead wire 2 is held in the transfer chuck 6, and after being transferred, the receiver is passed to the clamping claws 16 and the lead wire is transferred. It is positioned below the push rod 12 with the main body of the electronic component 1 being clamped. Thereafter, the guide pin 8 rises from the lead wire fixing device 9 located below the printed circuit board 3, passes through the insertion hole 4 formed in the printed circuit board 3, and passes through the taper provided in the clamping claw 15. It is guided through a shaped hole 7 and positioned below the lead wire 2.

Next, the first solenoid valve 18 is set to a lower pressure from above the electronic component 1. Due to the action of the first pressure reducing valve 19, the push rod 1 is
2 is lowered and the gripping claws 15 are opened, whereby the electronic component 1 is held between it and the guide pin 8.

The steps shown in FIG. 3c, d, and e are at low pressure. After that, push rod 1
2 is fitted into the insertion shaft 13. By simultaneously lowering the guide pins 8, the electronic component 1 is inserted into the insertion hole 4 of the printed circuit board 3, and the fixed blade 17 provided in the lead wire fixing device 9 is inserted into the insertion hole 4 of the printed circuit board 3. The lead wire 2 is cut to a predetermined length by the action of the movable blade 16, bent, and the electronic component 1 is attached to the printed circuit board 3.
However, in the process shown in FIG. 3f, the low pressure is not sufficient to fix the electronic component 1 to the printed circuit board 3. In the case of a soft lead wire, the second solenoid valve 20. A second pressure reducing valve 21 is used to set the medium pressure, and in the case of a hard lead, a third solenoid valve 22. Set the third pressure reducing valve 23 to a high pressure and use it according to the lead wire.

Effects of the invention 8 Since there is no change in the shape of electronic components such as bending,
The quality of electronic components after insertion is stable. Furthermore, the independence of electronic components from the printed circuit board is improved, and the number of insertions can be increased and high-density insertion is possible.

Furthermore, it is possible to expand the number of insertable parts and improve the insertion rate. It goes without saying that the present invention also includes a presser method that allows for stepless setting as well as the multi-step setting of the embodiment.

[Brief explanation of the drawing]

FIG. 1 is a partially sectional front view of an electronic component insertion device according to an embodiment of the present invention, FIG. 2 is a partially sectional front view of a conventional component insertion device, and FIGS. FIG. 4 is an explanatory diagram showing that the lead wire is bent, and FIGS. 5 a and 5 b are explanatory diagrams showing the inclination of the lead wire. 1...Electronic component, 2...Lead wire, 3
......Printed circuit board, 12...Push rod, 10.1B, 20°22...Solenoid valve, 11.
19,21.23...Reducing valve. Name of agent: Patent attorney Toshio Nakao Haka1 person 1#
-/j41! Horse Figure 1 19-Yu/j Bowl Figure 2 Figure 3 (G) (bJ(C)

Claims (2)

[Claims] (1) In an electronic component insertion device that has a push rod that presses the main body of the electronic component from above to the bottom and a fixing device that fixes the electronic component to the printed circuit board, the pushing force of the push rod can be set to multiple values or more. An electronic component insertion device featuring: (2) The electronic component insertion device according to claim 1, characterized in that a plurality of pairs of electromagnetic valves and pressure reducing valves are provided so that a plurality of pressing forces of the push rod can be set.