JPS62293797A - Method and apparatus for mounting electronic parts with highdensity - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] 3. Detailed Description of the Invention [Field of Industrial Application] The present invention is a method for mounting electronic components on a printed circuit board by inserting lead wires into holes in the printed circuit board. Method for preventing interference between electronic components or chuck claws and mounted electronic components during so-called high-density mounting, in which other electronic components are inserted very close to the mounted electronic components during work, and the method therefor The invention relates to a device.

[Prior art and its problems] Conventionally, in order to mount a large number of electronic components on a printed circuit board at high density, it has been necessary to insert lead wires of the electronic components into insertion holes drilled in the printed circuit board. However, it has been done to insert a relatively thin fixed chuck claw between the already mounted electronic components and insert the already mounted electronic components while tilting the head of the mounted electronic components. -3711
6) Even with this, when trying to mount high-density to the extent that the heads of 1M1 child components adhere to each other, the electronic components that have already been mounted on the board will be the next electronic component to be mounted,
Otherwise, it comes into contact with the claws of the insertion chuck, making high-density mounting difficult.

In particular, in recent years, it has become necessary to mount a large number of electronic components having many functions on a small substrate, and the above-mentioned problem has become more prominent, and there has been a demand for a solution to the problem.

[Means for Solving the Problems] The present invention solves these problems and enables high-density mounting of electronic components. So as not to interfere with the parts,
A method and device for bending the lead wires of electronic components to the side to be mounted.A method and device for mounting electronic components on a printed circuit board by inserting the lead wires of the electronic components into a hole in the printed circuit board. The method includes a step of bending the lead wire of the electronic component laterally to create a gap into which the electronic component to be mounted in the next step is inserted, and a head that moves in the vertical direction, and a lower end of the head provided on the head. The cam surface formed on the shaft that slides further downward engages with the cam surface of the shaft, is constantly urged toward the cam surface, and as the shaft descends, the inserted/inserted electronic components are pushed outside. It is characterized by being a device consisting of a lever that swings in the direction.

[Example] Embodiments of the present invention will be described based on the drawings.

FIG. 1 is a side view showing four steps of a method for performing high-density packaging, and FIG. 2 is a side view showing a partially sectional view of a device according to the present invention.

Reference numeral 1 denotes an electronic component such as a radial lead electronic component or an axial lead electronic component having a lead wire 2 on the lower side of the main body.

A chuck claw 3 of a known electronic component inserting device that grips an electronic component 1 inserts a lead wire 2 into a predetermined insertion hole drilled in a printed circuit board 4, and the lead wire 2 protrudes below the printed circuit board 4. After clinching (Figure 1 (a)) ′F
When the L child part releases the parts and starts the operation of returning to the electronic part supply part (not shown) in order to grasp the next electronic part 1a to be inserted, the head of the apparatus according to the present invention, which will be described later, replaces it. is lowered, and lever 5 is moved accordingly.
When the mounted electronic component 1 is lowered (opening), the head of the electronic component enters the boring portion 5a formed at the tip of the lever 5 (c), and the lever 5 and the electronic component 1 are surely engaged.

Next, while the lever 5 is engaged with the electronic component 1, it swings in a direction to push the electronic component 1 outward, bends its lead wire 2 laterally, and then (d) rises and moves to the next position. The electronic component chuck claw 3 grips the electronic component 1a to be mounted on the
The lead wire 2 of the electronic component 1 is inserted into the insertion hole of the printed circuit board 4 that is drilled next to the electronic component 1 to be mounted (e).

In this way, the steps of inserting the electronic components and bending the lead wires of the inserted electronic components laterally are performed continuously, thereby achieving high-density mounting of the electronic components on the printed circuit board, which is the object of the present invention. Complete (to).

Next, the apparatus used in this method will be explained based on FIG. 2.

The head 6 of the high-density mounting apparatus for electronic components is attached to the main body of the apparatus so as to be movable in the vertical direction. The head 6
A shaft 7 passes through it so that it can be raised and lowered freely, and a lever 5
is attached to the shaft.

At the upper end of the shaft 7, there is a suppressing part 7b which comes into contact with an operating shaft 8 which slides downward by a drive source (not shown) at the lowering end of the head 6 to further lower the shaft 7, and at the lower end there is a suppressing part 7b which contacts the lever 5. A cam surface 7a that engages is formed. A spring 9 that constantly biases the shaft 7 upward is surrounded by the upper half of the shaft 7 that follows the pressing portion 7a.

The lever 5 is pivotally attached to the head 6 by a mounting shaft 10, and a cam follower 11 that engages with the cam surface 7a is attached to a position opposite to the cam surface 7a of the shaft 7, and furthermore, an electronic component at the lower end is attached to the lever 5. A boring portion 5a into which the head of the electronic component l enters is formed on the side where the electronic component l is pressed outward.

A spring 12 is installed between the lower position of the cam follower 11 of the lever 5 and the helad 6, which always biases the lever 5 in the direction of closing it inward toward the cam surface.

Note that 13 is a key groove provided in the shaft 7, and rotation of the shaft 7 is prevented by a rod-shaped key 14 provided in the head 6.

Next, the operation of this device will be explained.

The device is gripped by the chuck claw 3 of a known electronic component insertion device, the lead fi2 is inserted into a predetermined insertion hole drilled in the printed circuit board 4, and the device is moved onto the clinched electronic component l (the first After lowering the head 6 (Fig. 1 (b)), the head 6 is lowered so that the head of the mounted electronic component 1 enters the hollow portion 5a at the tip of the lever 5 at the lower end. is lowered (Fig. 1 (c)). The operating shaft 8 is lowered by a drive source (not shown) and comes into contact with the pressing portion 7b of the shaft 7, and the shaft 7 is lowered against the elasticity of the spring 9. Thus, the cam surface 7a acts to push the engaged cam follower 11 outward. The lever 5 swings in the direction of opening outward with the mounting shaft 10 as a fulcrum, and the electronic component l that has entered the boring portion 5a is moved sideways from the lead wire 2 portion as shown in FIG. 1(d). It will be bent.

When the bending process of the mounted electronic component 1 is completed, the head 6 and the operating shaft 8 rise, and the shaft 7 rises due to the elasticity of the spring 9, so that the cam surface 7a also rises, and the cam follower eye is no longer suppressed. The lever 5 moves inward to close due to the contraction force of the spring 12 and returns to its original state, and the head 6 also rises and replaces the electronic component chuck claw 3 in order to mount the next electronic component 1a.

Thereafter, the above-mentioned operations are performed continuously to achieve high-density mounting of the intended electronic components onto the printed circuit board.

Note that the above-described device according to the present invention can be used in combination with a known electronic component insertion device.

[Effects of the Invention] The present invention, which consists of the above-mentioned steps and configuration, bends the mounted electronic component laterally at the lead wire portion and mounts the primary electronic component in the gap created by the bending. , a large number of electronic components can be mounted at high density, and it can meet the recent demand for mounting a large number of electronic components with many functions on a small printed circuit board.

In particular, the device uses a spring to swing the lever by the sliding action of a cam surface provided on a shaft attached to a vertically moving head, and to return the lever to its original position. It has many advantages as a high-density mounting device for electronic components, such as being simple, having few failures, and being able to be used in combination with conventional electronic component insertion devices.

[Brief explanation of drawings]

FIG. 1 is a side view showing the steps of the high-density mounting method for electronic components of the present invention, and FIG. 2 is a side sectional view showing the apparatus. l...Electronic components 4...Printed circuit board 5...
・Lever 6...Head 7...Shaft 7a...Cam surface 9...Spring 11...Cam follower 12...Spring

Claims (2)

[Claims] (1) In a method of mounting electronic components on a printed circuit board by inserting the lead wires of the electronic components into the holes in the printed circuit board, the lead wires of the mounted electronic components are bent sideways in the next process. A method for high-density mounting of electronic components, the method comprising the step of creating a gap into which an electronic component to be mounted is inserted. (2) A head that moves in the vertical direction, a cam surface formed on a shaft that is provided on the head and slides further downward at the descending end of the head, and a cam surface that engages with the cam surface of the shaft and moves toward the cam surface. 1. A high-density mounting device for electronic components, comprising a lever that is constantly energized by the shaft and swings in a direction to push the inserted electronic components outward by lowering the shaft.