JPH02222200A - Automatic installation apparatus for electronic component - Google Patents

Abstract

PURPOSE:To enable corresponding to the difference of he length of a suction collet and the thickness of a pellet by adjusting the relative positions of a part sucked to the collet and a sensor on the basis of a data on the thickness of another component with respect to the thickness of a reference component. CONSTITUTION:Data regarding the difference of the length of a plurality of suction collets 76 and data regarding types such as the thickness of a pellet 71 are stored previously in a RAM 138. When vertical motion pitches are set, the pellet 71 is sucked by using the arbitrary collet 76 on the basis of both data, and movement to the position of detection of the state of suction by the light-emitting element 99 and photodetector 100 of a photoelectric detector 101 or the state of the completion of the exchange of the collet 76 is varied. A collet-length offset data and the value of half pellet thickness are added to the vertical motion pitches set, and the vertical motion pitches are changed to the value and the collet 76 is shifted. Accordingly, the device can correspond to the difference of the length of the collets and the thickness of the pellets.

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to a suction collet that vertically movably suctions components to a mounting head that is movable in XY for mounting electronic components on printed circuit boards, lead frames, etc. The present invention relates to an electronic component automatic mounting device that is provided with a sensor that detects the suction state of the component.

(b) Prior art As a prior art, the patent application filed in 1983 by the applicant
The specification attached to No. 122332 describes an electronic component mounting device in which a mounting head that is movable in XY is provided with a component suction collet that can be moved vertically and detachably in order to mount electronic components on printed circuit boards, lead frames, etc. and a sensor is provided on the mounting head so as to be movable up and down, and the sensor detects whether or not the collet is adsorbing an electronic component in its lowered state, and detects the attachment/detachment state of the collet in its raised state. The technology has been disclosed.

However, by replacing the collet with another collet during the above-mentioned attachment/detachment process, it is possible that collets of different lengths must be handled, and the vertical movement position of the sensor must be changed for each collet. .

Furthermore, even when pellets of different thicknesses were adsorbed, the detection of the adsorption state was unstable unless the vertical movement position of the sensor was changed, as described above.

(c) Problems to be Solved by the Invention Therefore, it is necessary to adjust the relative position of the sensor and the component attracted to the collet in response to the difference in the length of the collet and the thickness of the pellet.

(d) Means for Solving the Problems Therefore, the present invention provides a suction cholera 1 for attaching electronic components to a mounting head that is movable in In an electronic component automatic mounting apparatus provided with ~ and a sensor for detecting the suction state of the component, a storage device that stores data regarding the thickness of another component with respect to the thickness of a certain reference component; The apparatus is provided with a control device that adjusts the relative position of the sensor and the component sucked by the suction collet based on data stored in the storage device.

Further, in the present invention, a mounting head movable in XY direction is provided with a component suction collet that is movable up and down and detachable in order to mount electronic components on a printed circuit board, a lid frame, etc., and a sensor is provided to detect the suction state of the component. In an electronic component automatic mounting apparatus, there is provided a storage device that stores data regarding the length of another suction collet with respect to a certain standard suction collet length, and a storage device that stores data regarding the length of another suction collet, and a The system is equipped with a control device that adjusts the relative position of the sensor and the parts that are attracted to the root.

(e) Effect With the above configuration, the relative position between the sensor and the component that is attracted to the attraction collet by the control device based on the data regarding the thickness of other components with respect to the reference component thickness stored in the storage device. is adjusted.

Further, the relative position between the sensor and the component suctioned by the suction collet is adjusted by the control device based on data regarding the lengths of other suction collets with respect to the length of the suction collet serving as a reference stored in the storage device.

(f) Example Hereinafter, one embodiment of the present invention will be described in detail based on the drawings.

(1) is the main body of an automatic electronic component mounting device;
A conveyor (2) for conveying printed circuit boards (including thick film substrates) (P), lead frames, etc.;
A pair of substrate positioning devices (3) (4) provided in the middle of
) and four wafer tables (5) (6)
A wafer support stand (7) (8) that is movable in the Y length direction and rotatable in the plane direction, and a mounting head (10) (11) that is suspended from the top plate (9) and movable in the XY length direction are provided. It is being

The conveyor (2) has a pair of drive sprockets (12
) (12), consisting of a pair of chains (14A) (14B) stretched between driven sprockets (13) (13), placed on the chains (14A) (14B), and connected to the substrate (P). is transported from the upstream side to the downstream side. At this time, the chains (14A>, (14B) are provided with engagement pieces 5) that are fixed at a predetermined interval and that engage the rear end of the board (P) in the feeding direction, and the board (P) is held on both sides. Chain (14A) (14B)
It is placed on top and is intermittently conveyed from the upstream side to the downstream side in a state where it is locked by each engagement piece (15).

Next, a pair of substrate positioning devices (3) and (4) will be described, but since both have similar configurations, only one (4) will be described. The positioning device (3>(4) is
Although positioning is performed in each direction of the feeding direction of the substrate (P), the width direction perpendicular to this, and the thickness direction of the substrate (P), only the positioning of the substrate (P) in the feeding direction will be described below.

A clamp cam (19) is provided on the shaft (18) that passes through the pair of bearings (16) and (17), and a clamp cam (19) is installed between the pulley (20) at the left end of the shaft (18) and the positioning motor (21). A belt (23) is stretched between the output shafts (22). Therefore, when the motor (21) is energized and the shaft rod (18) rotates, the cam (19) rotates and the cam follower ( 2
4), the vertical member (25) moves up and down, and the cam lever (26) also moves up and down accordingly.

Furthermore, when the cam lever (26) moves upward, the movable clamp (27A) rotates outward via the pin (28>).
The reference clamp (27B) is also attached to the pin (3) by the spring (29).
0〉 and rotate outward through both clamps (27A) (
27B> is located below the substrate (P).

Therefore, the cam follower (24) at the end of the upper and lower members (25)
is in pressure contact with the clamp cam (19), so the cam (1
The upper and lower members (25) will move up and down according to the shape of 9).

Next, the wafer support stands (7) and (8) will be explained in detail, but since they have the same structure, only the support stand (7>) will be explained. (31> is the XY child table,
, the X-axis direction guide (34) is controlled by the Y-axis angle motor (33).
) and the X-axis direction guide <35) in the plane direction. Further, the wafer table (5) placed on the XY child table 31) can be rotated forward and backward by a θ motor (36). Therefore, the push-up needle device (37
) above the needle (37A), place the desired wafer sheet (
38) will be located.

Next, one mounting head holder O) will be described in detail. The head (10) is mounted on a support member (3
Movement in the X direction is possible by an X-axis circumferential motor (41) along the ball screw (4OA) supported by the guide body (42) (42), and a Y-axis angular motor <4
3) enables movement in the Y-j direction. A vertical motor (4
A belt (49) is stretched between the output shaft pulley 46) of 5) and the pulley (48) at the end of the screw shaft (47), and the vertical moving body (50) is connected to the guide body by the nut body (51). (
52), it can be moved up and down.

The vertical moving body (50) is equipped with a pressurizing motor (53).
A lock solenoid (54) is fixed thereto, and a lever (56) having a spring attachment pin (55) is provided on the output shaft of the motor (53). The solenoid (5
A mounting pin <58) is provided protruding from the plunge (57) of 4), and is connected to a mounting pin (60) protruding from an L-shaped support <59) fixed to the vertically movable body 50). A spring A (61) is stretched between them.

The bearing part (62) of the vertically moving body (50) has a support shaft (63).
allows the rocking body (64) to rotate, and the rocking body (64)
4) A U-shaped groove is cut out at the upper end, into which the mounting pin (58) fits, and a pressure bearing body (65) is provided at the other end of the rocking body <64). ing.

(6G) is a fixed bearing body that sandwiches a collar body 68) protruding from the low rigidity joint (67) with the pressurized bearing body (65), and is attached to the end of the support body (59). It is provided. It is stretched between a mounting pin (69) protruding from the rocking body (64) and a mounting pin (55) protruding from a lever (5G) fixed to the output shaft of the pressurizing motor (53). The pressure bearing body (65) is urged downward by a spring B (70).

By controlling the rotation angle of this pressurizing motor (53), the pressing force exerted by the pressurizing bearing body (65) on the locking joint (67) and the fixed bearing body 66) can be made variable. can. This spring B (70) as an elastic body is connected to a pellet (70) as an electronic component.
1) is used to apply pressing pressure when attaching to the substrate (P), or to apply pressing pressure when adsorbing the pellet (71) on the wafer sheet (38).

Further, a mounting pin (72) protruding from the vertical moving body (50)
A balance spring C (74) is stretched between the mounting pin (73) projecting from the rotary joint (67), and the elastic force of the spring C (74) and the suction nozzle body (75)
This elastic force is set so that the weights of the suction collet (76) and the suction collet (76) are approximately equal.

A pin (77) is provided protruding from the locking joint <67>, and a locking piece (78) that fits into this pin (77) is provided.
) prevents the joint (67) from rotating itself.

The suction nozzle body (75) is a rotary joint (67)
, are connected to a vacuum source (not shown) via a hose (68A). The suction nozzle body (75) has an upper and lower guide body (75).
A chamfered portion (80) is formed on the upper part of the nozzle body (75) so that the regulating bearing (8) can move up and down within the nozzle body (75).
1>, θ rotation within the upper and lower guide bodies (79) is not possible.

Also, inside the head body (44) is a drive motor (82).
), and a belt (85) is stretched between the output shaft pulley (83) and a pulley (84) fixed around the upper and lower guide body (79), and the belt (85) is stretched when the motor (82) is energized. (85), the upper and lower guide bodies (79) rotate while being guided by the bearing bodies (86), thereby also rotating the suction nozzle body (75) by θ.The lower end of the suction nozzle body (75) , the adsorbed cholera 1-(76) is provided so as to be detachable by locking and unlocking the locking mechanism (87).

(88) is a DC solenoid attached to the side surface of the head main body (44), and an operating lever (90) whose intermediate portion is pivotally supported is rotatably connected to its plunger (89). (91) is a vertical slider that can be moved up and down along a guide rail (not shown) extending up and down on the head body <44), and a pin (93) protruding from the slider (91).
) and a pin (94) protruding from the top of the head body (44), a spring D (95) is stretched between the slider (9
1) is urged upward.

And this slider (91) has a cam follower (
96), the head body (44) is provided with an upper limit stopper (97> and a lower limit stopper (98), and the operating lever (90) is in contact with the cam follower (96), so that the solenoid When (88) is energized, the actuating lever (90> rotates counterclockwise and pushes down the slider (91>), the cam follower (96) comes into contact with the stopper (98>) and stops, and when it is similarly demagnetized, the actuating lever ( 90) rotates clockwise and the slider (91) is pushed up by the spring D (95) until the lever <90) comes into contact with the upper limit stopper (97).

Accordingly, a photoelectric detection device (
101) at the lower end, the photoelectric detection device (101) also moves up and down as the up and down slider (91) moves up and down.

Therefore, when the detection device (101) is in the downward position,
Pellet (71) adsorbed by adsorption collet (76)
The presence or absence of the suction collet (76) itself can be detected when it is in the upper position (see FIG. 7).

Next, to explain the suction collet (76>), the lower end of the nozzle body (75) has a locking mechanism attachment part (
102), and a locking mechanism (
87). A hollow mounting space (103) is formed in the mounting portion (102), and the suction collet (7) is formed with a hollow mounting space (103).
The adapter (104) of 6) is fitted. Also, the mounting part (1
Lock claw bodies (106) are arranged between the bearing bodies (105) and (105) on both sides of the support shaft (105).
7) pass through the locking member, and the locking claw bodies (106) are arranged to face each other and are urged by a spring (108) so that their lower ends approach each other. <109) is the mounting part (10
2) It is a positioning pin protruding from the lower surface, and can be fitted into a U-shaped groove (110) to be described later.

The adsorbed cholera 1 to (76) includes an adapter (104) that fits into the mounting space (103) of the mounting part (102), and a lower part of the adapter (104) that has the mounting body ( 102) Adabuku flange part (1
11) and an adsorption part (u) that directly adsorbs the pellet (71).
2). Locking portions (113) whose lower portions are recessed inward are formed on both sides of the flange portion (111), and the lower ends of the locking pawls (106) are connected to the locking portions (113).
13) and lock it.

Next, the suction collet exchange device (114), (115)
However, since both have the same structure, one (
114). The exchange device (114) is broadly divided into a tool stocker (117) and a stocker stand (118) that can be moved up and down by a drive source (not shown) with respect to a mounting plate (116), and a plurality of locks at predetermined intervals. Pin mount (120) with release pin (119)
).

The stocker (117) and stocker stand (118)
The two have substantially the same shape, and both have a plurality of mounting holes (121) and (122) that match each other at a predetermined interval. And stocker (117) and stocker stand (
Two compliance pins (123) are loosely fitted into the holes drilled in the hole (118), and the head (124) and coil spring (125) move the slots (117) and the stocker stand (118) to The stocker table (118) is pressed against each other via a steel ball (126) in a groove formed on the upper surface thereof. This ball (126) allows the stocker (117) to roll on the stocker stand (118) J2. The compliance pin (123
) By making the diameter of the hole in which the pin (123) fits slightly smaller than the diameter of the hole, the center of the suction nozzle body 75) and the stocker (11
7) and the adapter (1
04) can absorb the misalignment of the center.

Lock release pins (119), each having the same length, are set upright from the pin mount (120) and pass through the stocker (117) and the stocker stand (118).

Adsorption collet supports (127) are erected at the front and rear sides of the upper opening periphery of the mounting hole (121) of the stocker (117), and positioning pins (128) are protruded from each of the suction collet supports (127). Therefore, when the suction collet (76) is placed on the exchanger (114), the support stand (12
7) The flange portion (111) abuts on the top, and the U-shaped groove (111) is provided at the longitudinal end of the flange portion (111).
10) (ito) are formed, and positioning pins (12) are formed, respectively.
8) (12g> fits into the grooves (110) (110),
Theta rotation of the collet (76) is prevented.

The pin mount (120) is connected to the guide (130) by a cylinder (129) attached to the mounting plate (116).
It is possible to move up and down while being guided by the shaft rods (131) (130). (132) (132) is a bearing body provided on the stocker stand (118), and a plurality of holding members (13
A shaft rod (134) to which 3) is fixed is rotatably supported. The holding member (133) has a substantially crank shape, and one end engages with the adapter flange portion (111) from above, and the other end of any holding member (133) is provided with a drive source for rotation. cylinders (135) are connected.

In addition, a plurality of mounting holes (121) (122) opened in the tool stocker (117) and the stocker stand (118)
), the opening pitch of the hole (not shown) into which the lock release bin (119) fits, and the opening pitch of the lock release bin (119),
119) all have the same mounting pitch. Note that the adsorption collet (76) has a number (hereinafter colelatona = 16).
- It is called a member. ), and since four types of suction collets (76) are used here, the collet numbers 'CI J' C2J 'C3J' C4J
becomes.

Next, the configuration circuit diagram shown in FIG. 1 will be explained in detail.

Reference numeral 136 denotes a CPU as a control device, which performs overall control of the entire electronic component automatic mounting device.

(137) is R that stores the program related to the mounting operation.
It's OM.

(138) is a RAM that stores various data set by the input device (139).

(140) is a CRT that displays a predetermined screen by operating the input device (139).

(141) is an interface.

The operation will be explained in detail below.

When the drive motor (not shown) is energized, the drive sprocket (12) (12) rotates and the driven sprocket (12) rotates.
13) By (13), chain (L4A) (14B>
The upper substrate (P) is intermittently conveyed, and the positioning device (3
), the power supply to the drive motor is cut off and the conveyance of the substrate (P) is stopped.

Then, the positioning motor 21) is energized and the belt (2
3) rotates, the clamp cam (19) also rotates, and each upper and lower member (25) is rotated through the cam follower (24) according to the shape of the cam (19).
will move up and down. As a result, the position of the substrate (P) in the feeding direction is regulated.

That is, when the upper and lower members (25) descend in accordance with the clamp cam (19) rotated by the energization of the motor (21), the movable clamp (27Δ) resists the spring (29) and the reference clamp (27B) The position of the substrate (P) in the feeding direction is regulated by rotating each of them.

The pellets (71) are attached to the substrate (P) whose position is regulated as described above, but before this attachment, the desired wafer sheet (3) is placed on the wafer table (5).
The wafer support stand (7>) is rotated forward or backward by the θ motor (36>) so that the wafer support stand (8) moves to the station (A).

Next, the XY table (31) and the support base (7> are moved in the plane j direction along the guides (34) and (35) by the X-axis circumferential motor (32) and the Y-axis circumferential motor (33). hand,
A pellet (71) of a desired wafer sheet (38) is positioned above the push-up needle device (37).

Incidentally, a mounting head (10) is located in the wafer seat 1-(38)-hizuj.

Then, an electronic component recognition device (not shown) installed in the vicinity of the mounting rod (10) determines the quality of the pellet (71), detects positional deviation and θ scratches, and determines that the pellet (71) is suitable. 71) is adsorbed by descending adsorbed cholera I476>. This point will be explained in detail below.

First, the vertical motor (45) is energized and each pulley (4
6)', (48), screw shaft (
Rotate 47) and lower the vertical moving body 50) 7↓°
Ru. Then, the spring B (70
), the pressurized hair ring body <65> is pressed against the low rigidity joint (67) and the fixed bearing body (66), so the suction nozzle body (75) is pressed against the upper and lower guide bodies (7).
9) down to the wafer sheet (38). For this reason, as mentioned above, one thrust is equivalent to the needle (3) of the needle device (37).
Together with 7A), pellet 1-(71) can be reliably adsorbed.

After this attraction, the rotation of the motor (45) is reversed to raise the vertically movable body 50) by the screw shaft (47), but after this raising, the lock solenoid (54) is energized. For this reason, the aspirated plunge + (57)
The oscillator (64) is rotated against the spring A (61) by the support shaft (
63) as a fulcrum. Therefore, the vertical moving body (5
A fixed bearing body <66> and a pressurized bearing body (65) installed on the support body (59>) fixed to
Lock the collar body 68) of the low join 1-(67) in a clamped state. Of course, this locking operation is performed while the mounting head (10>) is moving horizontally, and if necessary, after this locking operation, the suction nostle body 75) is rotated by θ to adjust the orientation of the pellet 1-(71,) in the plane direction. The substrate (P
).

Therefore, each pulley (83) is turned on by energizing the drive motor (82).
), (84), the suction nozzle body (75) is rotated by θ via the second lower guide body (79) and the regulating hair ring (81).

By the horizontal movement of the suction head (10), this suction nozzle body (75) moves to a position above the substrate (P) whose position is regulated as described above, and
) Pellet 1-(71) can be attached to a desired position.

That is, as described above, the motor (45) is energized to lower the vertical moving body (50) and the suction nozzle body (75) to the substrate (P), but on the way, the lock solenoid (54) ) to release the lock operation.

When this is installed, the pellet (
71) will be pressed against the substrate (P). Therefore,
If you want to change this pressing force, use the pressurizing motor (53
) can be done by setting the rotation angle to the desired value.

The loading operation will be performed as described above, but for example, the next Belen 1 to be loaded is a large pellet <71).
In this case, it must be replaced with a suitable adsorbed cholera 1176). Below is the first part about the exchange operation.
Description will be made based on FIGS. 3 to 20.

First, as shown in FIG. 10, the suction nozzle body (
75) and suction cholera 1- (76) are lowered, and the suction collet of the suction collet exchange device (114) is not stored! Tools!・Mounting hole (121) for hook (117)
) to the upper position.

Next, the pin mount (1) is driven by the cylinder (129).
20) and a tool stocker (
117) (see Figure 13).

After this, the nozzle body (75) and cholera l-(76)
When further lowered, the lock claw bodies (106) and (1
0'6) comes into contact with the lock release pin (119) and the support shaft <
107>, rotate and open using (107) as a fulcrum (
(See Figure 14).

Therefore, the lock is released, but the presser member (1), which was rotated outward by the cylinder (129),
33) is rotated inward by the drive of this cylinder (129) and presses the adapter flange portion (111).

Of course, at this time, the positioning pins 128 and 128 on the support base <127> fit into the U groove (110) completely formed in the flange part (111), and the adsorbed cholera 1-(7)
6) θ rotation is prevented.

Then, as shown in FIG. 15, when the stocker (117) is lowered by the drive source, the adapter (104> comes out of the take-up space 1 (103) and lowers.Next, the adsorption nostle body (75) Raise as described above and attach the pin mount (12
0) and the lock release pin (1, 19) descends (first
(See Figure 6). After that, the suction nozzle body (75) moves to the three-way position of the cholera l-<76> for large pellets (71) and descends,
will also rise. Therefore, the locking claw body 106 (106) is opened by the pin (119) (see FIG. 17).

And tool stocker (117) and stocker (
118> rises, and the adsorption collet (7G) adapter (
104) into the mounting space (103). At this time, the positioning pin (109) on the lower surface of the attachment part <102> fits into the U-shaped groove (110) of the adabuku flange part (111), thereby preventing θ deviation during this insertion. Thereafter, the pressing member (133) can be rotated outward by driving the cylinder (129).

After that, the release pin (119) is lowered, so that the lock claw bodies (106) (106) are moved by the springs (108) (108).
), it rotates inward, enters the locking part (113), and locks (see Fig. 19). Then, the suction nozzle body (75>) and the suction cholera 1-(76) rise, and this time rotate the holding member (133) inward, and press the stocker <117) and the picker stand (118). By lowering the suction collet (76), the replacement operation of the suction collet (76) is completed.

By replacing the suction collet (76), it becomes possible to accommodate large pellets 1-(71).

Next, the operation for checking whether or not the adsorbed cholera l-<76) has been reliably replaced will be described in detail.

First, when the suction collet (76) is on standby at a certain predetermined height and the DC solenoid (88) is energized, the actuation lever (90) is moved against the spring D (95).
is the vertical slider <91 via the cam follower <96).
) is pressed downward, and the cam follower (96) comes into contact with the lower limit stopper (98) and is locked,
As shown in FIG. 6, a photoelectric detection device (101) detects whether a suction collet (76) or a pellet (71) is being suctioned.

Furthermore, by demagnetizing the solenoid (88), it is possible to detect whether or not the adsorption collet (76) has been replaced correctly.
1) is raised by the fly D (95), and the operating lever (90
) comes into contact with the upper limit stopper (97) and is locked, and the photoelectric detection device (101) confirms the presence of the suction collet (76) as shown in FIG. If "existence" or "absence" is detected, the subsequent operation is stopped and the operator is notified by a notification device (not shown).

Here, when the photoelectric detection device (101) detects the presence or absence of the adsorption collet and the adsorption state of the pellet 1-(71), the length dimension is different due to the replacement of the adsorption collet 1-(76). Taking into account cases such as when using adsorbed cholera 1-(76), when there are tolerances due to processing accuracy in the same type of adsorbed cholera 1-(76), and when handling various pellets (71) with different thicknesses, etc. and the vertical motor (
The amount of movement of the suction collet (76) by the drive of (45) is adjusted.

This movement amount adjustment operation will be described in detail below.

First, the operator sets the vertical movement pitch of the vertical motor (45) in the device. That is, the motor (45) is driven using the vertical movement pitch setting suction collet (76), and the set vertical movement pitch is taught by allowing the collet <76) to descend onto the wafer sheet (38).

FIG. 21 shows the adsorption cholera 1-( 76) This is a screen of the CRT (140) showing data (hereinafter referred to as collet length offset data) regarding the difference in length (including errors due to tolerances). C.I.J.
'C2J 'C3J 'C4' suction collet <76>
The offset data are O, -5, +10, respectively. +3[:
μm].

Figure 22 shows the pellet number 'PIJ', P2 and 'P3'.
．． 'P4. This is a screen of a CRT (140) showing data regarding type data such as thickness of various pellets (71). In addition, four wafer tables (5) (6) are used here.
) are each loaded with four types of pellets (71).

Based on these data, the predetermined height is used to adsorb any pellet (71) using any adsorption cholera h (76) and detect the adsorption state or the replacement completion state of the adsorption collet (76). The amount of movement to the horizontal position (horizontal position of the light emitting element (99) and light receiving element (100) of the photoelectric detection device (101)) is changed. That is, for example, collet number 'c
When adsorbing pellets with pellet number "Pl"(71>) using a suction collet (76>), a calculation device (not shown) calculates the collet length offset D O to the set vertical movement pitch based on both of the above data. [μm] and the value of the pellet thickness is calculated, and the suction collet (76) is moved by changing the vertical movement pitch to that value.

In addition, a suction collet with collet number 1C2 (76
) and the thickness of the pellet number "Pl" is 1-
When adsorbing pellet 1-(71) with pellet number "P2" which is the same as (71) (see Figure 23),
In the same way, calculate a value (vertical pitch - 8ρ) that takes into account the collet length offset cheetah -5 [μm] and the value of the pellet thickness to the set vertical pitch, and change the vertical pitch to that value. to move the suction collet (76) (see Fig. 24).

Next, the adsorbed cholera 1-(7
6) When adsorbing pellets with pellet numbers 'P3'(71>) which have different thicknesses from pellet numbers 'Pi and 'P2' (see Figure 25), the above-mentioned vertical movement pitch is similarly set based on each data. Collet length offset data 0 [μ
m] and the value of the pellet thickness (vertical pitch - Δt) is calculated, and the suction collet (76) is moved by changing the vertical pitch to that value (26th
(see figure).

Thereafter, the vertical movement pitch is changed in the same manner every time the collet length and pellet thickness change.

In this example, the value of the pellet thickness is set to 2, because the photoelectric detection device (101) detects the adsorption collet (76) at its lower limit.
This is because the optical axis position for detecting the pellets (71) adsorbed at is set at the thickness of the pellet.

Also, in this example, the pellet thickness was stored as data as is, but like the collet length offset data,
Other pellets (7) relative to the standard pellet (71)
Pellet thickness offset data regarding the difference in thickness in 1) may be stored.

Furthermore, the vertical movement pitch of the suction collet (76) is changed to ensure stable detection of the adsorption state of the pellet (71>) by the photoelectric detection device (101). The structure may be such that it is moved, or both sides may be moved to accommodate differences in the length of the suction collet (76) and the thickness of the pellet 1-(71).

(G) Effects of the Invention With the above configuration, it is possible to deal with differences in the length of the suction collet and the thickness of electronic components, and stable detection can be performed.

[Brief explanation of the drawing]

1, 2, and 3 are a configuration circuit diagram, a plan view, and a front view of the automatic electronic component mounting apparatus of the present invention, FIG. 4 is a partially sectional front view of the mounting head, and FIG. 5 is a mounting head. Vertical right side view of the head, Figure 6 is a partially cutaway right side view of the mounting head, Figure 7 is a partially cutaway right side view of the mounting head with the vertical slider raised, and Figure 8 is the suction nozzle. 9 is a left side view of the lower end of the suction nozzle, FIG. 10 is a vertical sectional front view of the suction nozzle exchange device, and FIG. 11 is a plan view of the exchange device.
Figure 12 is a left side view of the exchange device, Figures 13 to 20
Figure 21 shows collet length offset data, Figure 22 shows data related to pellets, and Figures 23 and 24 show the use of suction collets with different collet lengths. FIGS. 25 and 26 are diagrams showing the amount of movement of the suction collet when picking up pellets having different pellet thicknesses. (71)...Pellet, (76)...Adsorption collection・7
(101)...Photoelectric detection device, (136)...
・CPU, (138)...RAM.

Claims (2)

[Claims] (1) In order to mount electronic components onto printed circuit boards, lead frames, etc., a mounting head that is movable in XY is equipped with a suction collet that can move up and down to suction the components, and a sensor that detects the suction state of the component. In an automatic component mounting device, there is provided a storage device that stores data regarding the thickness of another component with respect to the thickness of a certain standard component, and a component that is sucked by the suction collet based on the data stored in the storage device. An electronic component automatic mounting device characterized by comprising a control device that adjusts the relative position of the component and the sensor. (2) In order to mount electronic components onto printed circuit boards, lead frames, etc., a mounting head that is movable in XY is provided with a component suction collet that can be moved vertically and detachably, and a sensor that detects the suction state of the component is installed. In an automatic component mounting device, there is provided a storage device that stores data regarding the length of another suction collet with respect to the length of a certain standard suction collet, and a storage device that stores data regarding the length of another suction collet with respect to the length of a certain standard suction collet, and adsorption to the suction collet based on the data stored in the storage device. An electronic component automatic mounting device characterized by comprising a control device that adjusts the relative position of a mounted component and a sensor.