JPH0249728Y2 - - Google Patents

Info

Publication number
JPH0249728Y2
JPH0249728Y2 JP1984107643U JP10764384U JPH0249728Y2 JP H0249728 Y2 JPH0249728 Y2 JP H0249728Y2 JP 1984107643 U JP1984107643 U JP 1984107643U JP 10764384 U JP10764384 U JP 10764384U JP H0249728 Y2 JPH0249728 Y2 JP H0249728Y2
Authority
JP
Japan
Prior art keywords
hybrid
board
elastic locking
case
synthetic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984107643U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6127242U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10764384U priority Critical patent/JPS6127242U/ja
Publication of JPS6127242U publication Critical patent/JPS6127242U/ja
Application granted granted Critical
Publication of JPH0249728Y2 publication Critical patent/JPH0249728Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
JP10764384U 1984-07-18 1984-07-18 ハイブリツドicの外装構造 Granted JPS6127242U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10764384U JPS6127242U (ja) 1984-07-18 1984-07-18 ハイブリツドicの外装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10764384U JPS6127242U (ja) 1984-07-18 1984-07-18 ハイブリツドicの外装構造

Publications (2)

Publication Number Publication Date
JPS6127242U JPS6127242U (ja) 1986-02-18
JPH0249728Y2 true JPH0249728Y2 (en, 2012) 1990-12-27

Family

ID=30666861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10764384U Granted JPS6127242U (ja) 1984-07-18 1984-07-18 ハイブリツドicの外装構造

Country Status (1)

Country Link
JP (1) JPS6127242U (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2506449B2 (ja) * 1989-06-30 1996-06-12 富士通株式会社 パッケ―ジ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5222943U (en, 2012) * 1975-08-06 1977-02-18
JPS5994853A (ja) * 1982-11-22 1984-05-31 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPS6127242U (ja) 1986-02-18

Similar Documents

Publication Publication Date Title
US4731644A (en) Semiconductor power module with ceramic substrate
CA1297597C (en) Method of assembling tab bonded semiconductor chip package
US4147889A (en) Chip carrier
EP0350593A2 (en) Electronic package with heat spreader member
EP0333374A3 (en) Edge-mounted, surface-mount package for semiconductor integrated circuit devices
JPH0249728Y2 (en, 2012)
JPS6223100Y2 (en, 2012)
JPS5721845A (en) Mounting structure for miniaturized electronic parts
US5157587A (en) Sealing arrangement
JP2000299559A (ja) パワーモジュール用基板
JPS6225891Y2 (en, 2012)
JPS6214714Y2 (en, 2012)
JPH054273Y2 (en, 2012)
JPH10224065A5 (en, 2012)
JPH0513023Y2 (en, 2012)
JPH0351299B2 (en, 2012)
JPH05175351A (ja) 半導体装置のパッケージ
JP2507273Y2 (ja) 樹脂封止型電子機器
JP2906635B2 (ja) 混成集積回路装置
JP2502577Y2 (ja) 電力用半導体モジュ―ル
JPH02125628A (ja) 半導体装置の製造方法
JPS645914Y2 (en, 2012)
CZ278494A3 (en) Protective casing made of electrically insulating material for a semiconductor device
JPS6279653A (ja) ハイブリツドicのパツケ−ジング構造
JPS5835377B2 (ja) 電子機器の製造方法