JPH0249713Y2 - - Google Patents

Info

Publication number
JPH0249713Y2
JPH0249713Y2 JP1986142959U JP14295986U JPH0249713Y2 JP H0249713 Y2 JPH0249713 Y2 JP H0249713Y2 JP 1986142959 U JP1986142959 U JP 1986142959U JP 14295986 U JP14295986 U JP 14295986U JP H0249713 Y2 JPH0249713 Y2 JP H0249713Y2
Authority
JP
Japan
Prior art keywords
tape
metal foil
intermediate structure
holes
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1986142959U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6349239U (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986142959U priority Critical patent/JPH0249713Y2/ja
Publication of JPS6349239U publication Critical patent/JPS6349239U/ja
Application granted granted Critical
Publication of JPH0249713Y2 publication Critical patent/JPH0249713Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP1986142959U 1986-09-18 1986-09-18 Expired JPH0249713Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986142959U JPH0249713Y2 (enrdf_load_html_response) 1986-09-18 1986-09-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986142959U JPH0249713Y2 (enrdf_load_html_response) 1986-09-18 1986-09-18

Publications (2)

Publication Number Publication Date
JPS6349239U JPS6349239U (enrdf_load_html_response) 1988-04-04
JPH0249713Y2 true JPH0249713Y2 (enrdf_load_html_response) 1990-12-27

Family

ID=31052191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986142959U Expired JPH0249713Y2 (enrdf_load_html_response) 1986-09-18 1986-09-18

Country Status (1)

Country Link
JP (1) JPH0249713Y2 (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088287B2 (ja) * 1989-08-23 1996-01-29 株式会社東芝 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPS6349239U (enrdf_load_html_response) 1988-04-04

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