JPH0245675U - - Google Patents
Info
- Publication number
- JPH0245675U JPH0245675U JP12503988U JP12503988U JPH0245675U JP H0245675 U JPH0245675 U JP H0245675U JP 12503988 U JP12503988 U JP 12503988U JP 12503988 U JP12503988 U JP 12503988U JP H0245675 U JPH0245675 U JP H0245675U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- printed
- utility
- component insertion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図、第２図は本考案の一実施例を示す部品
組立説明図及び断面図、第３図ａ，ｂは従来装置
の部分的平面図及び断面図である。図中１は基板
、２は導電部銅パターン、３は絶縁被膜、４はリ
ード部品挿入穴、５は印刷膜、５ａは欠除部、６
はリード部品、６ａはリード線、７は半田、８は
部品挿入表示部である。
FIGS. 1 and 2 are explanatory drawings and sectional views of parts assembly showing an embodiment of the present invention, and FIGS. 3a and 3 b are partial plan views and sectional views of a conventional device. In the figure, 1 is a board, 2 is a conductive copper pattern, 3 is an insulating coating, 4 is a lead component insertion hole, 5 is a printed film, 5a is a cutout, and 6
6 is a lead component, 6a is a lead wire, 7 is solder, and 8 is a component insertion display section.
Claims (1)
印刷膜が形成されたプリント基板において、前記
印刷膜に前記部品挿入穴から周辺方向に欠除部を
設けたことを特徴とするプリント基板。 (2) 印刷膜の厚さを５０μｍ以上としたことを
特徴とする実用新案登録請求の範囲第(1)項記載
のプリント基板。 (3) 印刷膜が部品挿入表示部の機能を備えたこ
とを特徴とする実用新案登録請求の範囲第(1)項
、第(2)項記載のプリント基板。[Claims for Utility Model Registration] (1) In a printed circuit board in which a printed film is formed on the surface of the printed circuit board surrounding a component insertion hole, a cutout is provided in the printed film in a peripheral direction from the component insertion hole. A printed circuit board characterized by: (2) The printed circuit board according to claim (1) of the utility model registration, characterized in that the thickness of the printed film is 50 μm or more. (3) The printed circuit board according to claims (1) and (2) of the utility model registration, characterized in that the printed film has the function of a component insertion display section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12503988U JPH0245675U (en) | 1988-09-24 | 1988-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12503988U JPH0245675U (en) | 1988-09-24 | 1988-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245675U true JPH0245675U (en) | 1990-03-29 |
Family
ID=31375290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12503988U Pending JPH0245675U (en) | 1988-09-24 | 1988-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245675U (en) |
-
1988
- 1988-09-24 JP JP12503988U patent/JPH0245675U/ja active Pending
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