JPH0245634U - - Google Patents
Info
- Publication number
- JPH0245634U JPH0245634U JP12463088U JP12463088U JPH0245634U JP H0245634 U JPH0245634 U JP H0245634U JP 12463088 U JP12463088 U JP 12463088U JP 12463088 U JP12463088 U JP 12463088U JP H0245634 U JPH0245634 U JP H0245634U
- Authority
- JP
- Japan
- Prior art keywords
- metal disk
- semiconductor
- semiconductor device
- utility
- mounting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 239000008188 pellet Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の実施例を示す要部側断面図、
第２図は金属デイスクの変形例を示す一部断面側
面図、第３図は半導体装置の一例を示す側断面図
、第４図は第３図半導体装置の要部側断面図であ
る。
１４……半導体ペレツト、１５……半田、１８
……金属デイスク、１８ａ……半導体ペレツトマ
ウント面、１８ｂ……周面、１８ｃ……隣接部分
。
FIG. 1 is a side sectional view of the main part showing an embodiment of the present invention;
FIG. 2 is a partially sectional side view showing a modification of the metal disk, FIG. 3 is a side sectional view showing an example of a semiconductor device, and FIG. 4 is a side sectional view of a main part of the semiconductor device shown in FIG. 14...Semiconductor pellet, 15...Solder, 18
...Metal disk, 18a...Semiconductor pellet mounting surface, 18b...Surrounding surface, 18c...Adjacent portion.
Claims (1)
をマウントした半導体装置において、上記金属デ
イスクの半導体ペレツトマウント面と周面との隣
接部分を傾斜させたことを特徴とする半導体装置
。 1. A semiconductor device in which semiconductor pellets are mounted on a metal disk via solder, characterized in that a portion adjacent to a peripheral surface of the semiconductor pellet mounting surface of the metal disk is inclined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12463088U JPH0245634U (en) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12463088U JPH0245634U (en) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245634U true JPH0245634U (en) | 1990-03-29 |
Family
ID=31374537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12463088U Pending JPH0245634U (en) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245634U (en) |
-
1988
- 1988-09-22 JP JP12463088U patent/JPH0245634U/ja active Pending